Download or read book Semiconducting Silicides written by Victor E. Borisenko and published by Springer Science & Business Media. This book was released on 2013-03-07 with total page 362 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive presentation and analysis of properties and methods of formation of semiconducting silicides. Fundamental electronic, optical and transport properties of the silicides collected from recent publications will help readers choose their application in new generations of solid-state devices. A comprehensive presentation of thermodynamic and kinetic data is given in combination with their technical application, as is information on corresponding thin-film or bulk crystal formation techniques.
Download or read book Silicides Fundamentals Applications written by Francois D'heurle and published by World Scientific. This book was released on 2000-12-18 with total page 390 pages. Available in PDF, EPUB and Kindle. Book excerpt: Silicides were introduced into the technology of electronic devices some thirty years ago; since then, they have been continuously used to form both ohmic and rectifying contacts to silicon. Silicides are also important for other applications (thermoelectric devices and structural applications, such as jet engines), but it is not easy to find an updated reference containing both their basic properties, either chemical or physical, and the latest applications.The 16th Course of the International School of Solid State Physics, held in Erice (Italy) in the late spring of 1999, was intended to break artificial barriers between disciplines, and to gather people concerned with the properties and applications of silicides, regardless of the formal fields to which they belong, or of the practical goals they pursue. This book is therefore concerned with theory as well as applications, metallurgy as well as physics, and materials science as well as microelectronics.
Download or read book Mechanical Properties of Silicon Based Compounds Silicides written by Joshua Pelleg and published by Springer. This book was released on 2019-07-16 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the mechanical properties of silicides for very large scale integration (VLSI) applications. It presents the fabrication process for bulk silicides and thin films, and list complete testing deformation for a variety of silicon based compounds. The author also presents dislocation in silicides, fatigue and fracture aspects. A special chapter is given on deformation in silicides in the nano scale. Composites and alloys are also considered.
Download or read book Silicides for VLSI Applications written by Shyam P. Murarka and published by Academic Press. This book was released on 2012-12-02 with total page 213 pages. Available in PDF, EPUB and Kindle. Book excerpt: Most of the subject matter of this book has previously been available only in the form of research papers and review articles. I have not attempted to refer to all the published papers. The reader may find it advantageous to refer to the references listed.
Download or read book The Analysis of Refractory Borides Carbides Nitrides and Silicides written by Owen H. Kriege and published by . This book was released on 1959 with total page 62 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Silicide Technology for Integrated Circuits written by Institution of Electrical Engineers and published by IET. This book was released on 2004-12-21 with total page 302 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the first book to provide guidance on the development and application of metal silicide technology as it emerges from the scientific to the prototype and manufacturing stages. Other key topics covered are fundamentals, present and future silicide technology for Si-based devices, and characterisation methods. Suitable for engineers and students in microelectronics.
Download or read book Rare earth Silicide Additions to an Alloy Steel to Increase Toughness and Ductility written by H. Austin Tucker and published by . This book was released on 1968 with total page 38 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Energy information data base written by United States. Dept. of Energy. Technical Information Center and published by . This book was released on 1979 with total page 868 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Subject Headings Used in the Catalogs of the United States Atomic Energy Commission written by and published by . This book was released on 1962 with total page 384 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Subject Headings Used by the USAEC Technical Information Service written by U.S. Atomic Energy Commission and published by . This book was released on 1960 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Nuclear Science Abstracts written by and published by . This book was released on 1973 with total page 1256 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Multicomponent Silicides for Thermoelectric Materials written by Jean-Claude Tedenac and published by Springer. This book was released on 2017-06-02 with total page 50 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive review of the current state of the art in silicon compounds for thermoelectric applications. Silicides are materials with good initial thermoelectric properties, which can be enhanced through tuning of their micro- and macrostructure. These compounds present various conduction mechanisms and complex band structures. Moreover, some are isotropic, and others anisotropic, which is highly beneficial for device tailoring. Silicides are a particularly attractive material for sensors, thermoelectric generators, and other applications because they are environmentally friendly, abundant, and low cost. This concise volume covers fundamentals and applications for an audience of materials scientists, chemists, solid-state physicists, and engineers.
Download or read book Microelectronic Materials and Processes written by Roland Levy and published by Springer Science & Business Media. This book was released on 1989-01-31 with total page 1006 pages. Available in PDF, EPUB and Kindle. Book excerpt: The primary thrust of very large scale integration (VLS!) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron range has now been made possible by the introduction of innovative circuit designs and the development of new microelectronic materials and processes. This book addresses the latter challenge by assessing the current status of the science and technology associated with the production of VLSI silicon circuits. It represents the cumulative effort of experts from academia and industry who have come together to blend their expertise into a tutorial overview and cohesive update of this rapidly expanding field. A balance of fundamental and applied contributions cover the basics of microelectronics materials and process engineering. Subjects in materials science include silicon, silicides, resists, dielectrics, and interconnect metallization. Subjects in process engineering include crystal growth, epitaxy, oxidation, thin film deposition, fine-line lithography, dry etching, ion implantation, and diffusion. Other related topics such as process simulation, defects phenomena, and diagnostic techniques are also included. This book is the result of a NATO-sponsored Advanced Study Institute (AS!) held in Castelvecchio Pascoli, Italy. Invited speakers at this institute provided manuscripts which were edited, updated, and integrated with other contributions solicited from non-participants to this AS!.
Download or read book Properties of Metal Silicides written by Karen Maex and published by Institution of Electrical Engineers. This book was released on 1995 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt: The properties of silicon alloyed with metals are presented here for silicides of both transition and rare earth metals.
Download or read book Interstitial Alloys written by H. J. Goldschmidt and published by Elsevier. This book was released on 2016-01-22 with total page 643 pages. Available in PDF, EPUB and Kindle. Book excerpt: Interstitial Alloys covers the significant progress in the development and understanding of the principles and applications of interstitial alloys. Interstitial alloy refers to the existence of a pure metal lattice, which the metal-metal atom bond remains the dominant one, and the non-metal atoms are sufficiently small to be accommodated within the metal lattice without, or with only a limited degree of, distortion from metal-type symmetry. This book contains 10 chapters and begins with a brief introduction to the basic principles of interstitial alloys. The next two chapters describe the physical properties of these alloys, along with their behavior in solid solutions. The remaining chapters deal with a specific interstitial alloy, its structure, physico-chemical properties, preparation, and application. This work specifically considers carbide, nitride, boride, silicide, oxide, hydride, and mixed interstitial alloys. This book will be of value to chemists and physicists.
Download or read book TID written by and published by . This book was released on 1972 with total page 1062 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book VLSI Metallization written by Norman G. Einspruch and published by Academic Press. This book was released on 2014-12-01 with total page 491 pages. Available in PDF, EPUB and Kindle. Book excerpt: VLSI Electronics Microstructure Science, Volume 15: VLSI Metallization discusses the various issues and problems related to VLSI metallization. It details the available solutions and presents emerging trends. This volume is comprised of 10 chapters. The two introductory chapters, Chapter 1 and 2 serve as general references for the electrical and metallurgical properties of thin conducting films. Subsequent chapters review the various aspects of VLSI metallization. The order of presentation has been chosen to follow the common processing sequence. In Chapter 3, some relevant metal deposition techniques are discussed. Chapter 4 presents the methods of VLSI lithography and etching. Conducting films are first deposited at the gate definition step; therefore, the issues related to gate metallization are discussed next in Chapter 5.In Chapter 6, contact metallization is elaborated, and Chapter 7 is devoted to multilevel metallization schemes. Long-time reliability is the subject of Chapter 8, which discusses the issues of contact and interconnect electromigration. GaAs metallization is tackled in Chapter 9. The volume concludes with a general discussion of the functions of interconnect systems in VLSI. Materials scientists, processing and design engineers, and device physicists will find the book very useful.
