Download or read book Signal Propagation on Interconnects written by Hartmut Grabinski and published by Springer Science & Business Media. This book was released on 2013-11-11 with total page 150 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book comprises a selection of the most representative contributions to the 1st IEEE Workshop on Signal Propagation on Interconnects that was held at Travemunde, Germany, in May 1997. It represents, therefore, a survey of the actual problems currently concerning researchers and professionals in the field of signal propagation on interconnects. Signal Propagation on Interconnects contains chapters which cover a wide area of important research results dealing with simulation and measurement of noise and radiated emissions on boards, describing ground bounce effects as well as inductance calculations in multilayer packages. There is also reference and coverage of timing simulation techniques on chip as well as on board level. Signal Propagation on Interconnects is intended to give developers and researchers in the field of chip and package design a review of the state of the art regarding the influence of interconnect effects on the electrical performance of electronic circuits. In addition, the book illustrates ways to overcome performance problems related to the parasitic influences of interconnects. It is an invaluable text for circuit design engineers, developers and researchers in the field of signal integrity.

Download or read book Interconnect Centric Design for Advanced SOC and NOC written by Jari Nurmi and published by Springer Science & Business Media. This book was released on 2006-03-20 with total page 450 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Interconnect-centric Design for Advanced SoC and NoC, we have tried to create a comprehensive understanding about on-chip interconnect characteristics, design methodologies, layered views on different abstraction levels and finally about applying the interconnect-centric design in system-on-chip design. Traditionally, on-chip communication design has been done using rather ad-hoc and informal approaches that fail to meet some of the challenges posed by next-generation SOC designs, such as performance and throughput, power and energy, reliability, predictability, synchronization, and management of concurrency. To address these challenges, it is critical to take a global view of the communication problem, and decompose it along lines that make it more tractable. We believe that a layered approach similar to that defined by the communication networks community should also be used for on-chip communication design. The design issues are handled on physical and circuit layer, logic and architecture layer, and from system design methodology and tools point of view. Formal communication modeling and refinement is used to bridge the communication layers, and network-centric modeling of multiprocessor on-chip networks and socket-based design will serve the development of platforms for SoC and NoC integration. Interconnect-centric Design for Advanced SoC and NoC is concluded by two application examples: interconnect and memory organization in SoCs for advanced set-top boxes and TV, and a case study in NoC platform design for more generic applications.

Download or read book Low Power Interconnect Design written by Sandeep Saini and published by Springer. This book was released on 2015-06-12 with total page 166 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides practical solutions for delay and power reduction for on-chip interconnects and buses. It provides an in depth description of the problem of signal delay and extra power consumption, possible solutions for delay and glitch removal, while considering the power reduction of the total system. Coverage focuses on use of the Schmitt Trigger as an alternative approach to buffer insertion for delay and power reduction in VLSI interconnects. In the last section of the book, various bus coding techniques are discussed to minimize delay and power in address and data buses.

Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-04-02 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.

Download or read book 3D Interconnect Architectures for Heterogeneous Technologies written by Lennart Bamberg and published by Springer Nature. This book was released on 2022-06-27 with total page 403 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.

Download or read book Integrated Optical Interconnect Architectures for Embedded Systems written by Ian O'Connor and published by Springer Science & Business Media. This book was released on 2012-11-07 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a broad overview of current research in optical interconnect technologies and architectures. Introductory chapters on high-performance computing and the associated issues in conventional interconnect architectures, and on the fundamental building blocks for integrated optical interconnect, provide the foundations for the bulk of the book which brings together leading experts in the field of optical interconnect architectures for data communication. Particular emphasis is given to the ways in which the photonic components are assembled into architectures to address the needs of data-intensive on-chip communication, and to the performance evaluation of such architectures for specific applications.

Download or read book Interconnect Technology and Design for Gigascale Integration written by Jeffrey A. Davis and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 417 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.

Download or read book Integrated Circuit and System Design written by Enrico Macii and published by Springer Science & Business Media. This book was released on 2004-09-07 with total page 926 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the 14th International Workshop on Power and Timing Optimization and Simulation, PATMOS 2004, held in Santorini, Greece in September 2004. The 85 revised papers presented together with abstracts of 6 invited presentations were carefully reviewed and selected from 152 papers submitted. The papers are organized in topical sections on buses and communication, circuits and devices, low power issues, architectures, asynchronous circuits, systems design, interconnect and physical design, security and safety, low-power processing, digital design, and modeling and simulation.

Download or read book Interconnection Noise in VLSI Circuits written by Francesc Moll and published by Springer Science & Business Media. This book was released on 2007-05-08 with total page 214 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book addresses two main problems with interconnections at the chip and package level: crosstalk and simultaneous switching noise. Its orientation is towards giving general information rather than a compilation of practical cases. Each chapter contains a list of references for the topics.

Download or read book Advanced Nanoscale ULSI Interconnects Fundamentals and Applications written by Yosi Shacham-Diamand and published by Springer Science & Business Media. This book was released on 2009-09-19 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.

Download or read book Nano Interconnects written by Afreen Khursheed and published by CRC Press. This book was released on 2021-12-23 with total page 187 pages. Available in PDF, EPUB and Kindle. Book excerpt: This textbook comprehensively covers on-chip interconnect dimension and application of carbon nanomaterials for modeling VLSI interconnect and buffer circuits. It provides analysis of ultra-low power high speed nano-interconnects based on different facets such as material modeling, circuit modeling and the adoption of repeater insertion strategies and measurement techniques. It covers important topics including on-chip interconnects, interconnect modeling, electrical impedance modeling of on-chip interconnects, modeling of repeater buffer and variability analysis. Pedagogical features including solved problems and unsolved exercises are interspersed throughout the text for better understanding. Aimed at senior undergraduate and graduate students in the field of electrical engineering, electronics and communications engineering for courses on Advanced VLSI Interconnects/Advanced VLSI Design/VLSI Interconnects/VLSI Design Automation and Techniques, this book: Provides comprehensive coverage of fundamental concepts related to nanotube transistors and interconnects. Discusses properties and performance of practical nanotube devices and related applications. Covers physical and electrical phenomena of carbon nanotubes, as well as applications enabled by this nanotechnology. Discusses the structure, properties, and characteristics of graphene-based on-chip interconnect. Examines interconnect power and interconnect delay issues arising due to downscaling of device size.

Download or read book Analytical Methodology of Tree Microstrip Interconnects Modelling For Signal Distribution written by Blaise Ravelo and published by Springer Nature. This book was released on 2019-11-21 with total page 239 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the modelling methodology of microstrip interconnects, discussing various structures of single-input multiple-output (SIMO) tree interconnects for signal integrity (SI) engineering. Further, it describes lumped and distributed transmission line elements based on single-input single-output (SIMO) models of symmetric and asymmetric trees, and investigates more complicated phenomenon, such as interbranch coupling. The modelling approaches are based on the analytical methods using the Z-, Y- and T-matrices. The established method enables the S-parameters and voltage transfer function of SIMO tree to be determined. Providing illustrative results with frequency and time domain analyses for each tree interconnect structure, the book is a valuable resource for researchers, engineers, and graduate students in fields of analogue, RF/microwave, digital and mixed circuit design, SI and manufacturing engineering.

Download or read book Applications of Advanced Electromagnetics written by Guennadi A. Kouzaev and published by Springer Science & Business Media. This book was released on 2012-10-30 with total page 542 pages. Available in PDF, EPUB and Kindle. Book excerpt: This text, directed to the microwave engineers and Master and PhD students, is on the use of electromagnetics to the development and design of advanced integrated components distinguished by their extended field of applications. The results of hundreds of authors scattered in numerous journals and conference proceedings are carefully reviewed and classed. Several chapters are to refresh the knowledge of readers in advanced electromagnetics. New techniques are represented by compact electromagnetic–quantum equations which can be used in modeling of microwave-quantum integrated circuits of future In addition, a topological method to the boundary value problem analysis is considered with the results and examples. One extended chapter is for the development and design of integrated components for extended bandwidth applications, and the technology and electromagnetic issues of silicon integrated transmission lines, transitions, filters, power dividers, directional couplers, etc are considered. Novel prospective interconnects based on different physical effects are reviewed as well. The ideas of topology is applicable to the electromagnetic signaling and computing, when the vector field maps can carry discrete information, and this area and the results in topological signaling obtained by different authors are analyzed, including the recently designed predicate logic processor operating spatially represented signal units. The book is rich of practical examples, illustrations, and references and useful for the specialists working at the edge of contemporary technology and electromagnetics.

Download or read book Handbook of Emerging Materials for Semiconductor Industry written by Young Suh Song and published by Springer Nature. This book was released on with total page 930 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Mobile Big Data written by Georgios Skourletopoulos and published by Springer. This book was released on 2017-10-31 with total page 346 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book reports on the latest advances in mobile technologies for collecting, storing and processing mobile big data in connection with wireless communications. It presents novel approaches and applications in which mobile big data is being applied from an engineering standpoint and addresses future theoretical and practical challenges related to the big data field from a mobility perspective. Further, it provides an overview of new methodologies designed to take mobile big data to the Cloud, enable the processing of real-time streaming events on-the-move and enhance the integration of resource availability through the ‘Anywhere, Anything, Anytime’ paradigm. By providing both academia and industry researchers and professionals with a timely snapshot of emerging mobile big data-centric systems and highlighting related pitfalls, as well as potential solutions, the book fills an important gap in the literature and fosters the further development in the area of mobile technologies for exploiting mobile big data.

Download or read book Graphene Science Handbook written by Mahmood Aliofkhazraei and published by CRC Press. This book was released on 2016-04-27 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt: Explore the Practical Applications and Promising Developments of GrapheneThe Graphene Science Handbook is a six-volume set that describes graphene's special structural, electrical, and chemical properties. The book considers how these properties can be used in different applications (including the development of batteries, fuel cells, photovoltaic

Download or read book Testing for EMC Compliance written by Mark I. Montrose and published by John Wiley & Sons. This book was released on 2004-04-08 with total page 478 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Keep It Simple (KISS) philosophy is the primary focus of this book. It is written in very simple language with minimal math, as a compilation of helpful EMI troubleshooting hints. Its light-hearted tone is at odds with the extreme seriousness of most engineering reference works that become boring after a few pages. This text tells engineers what to do and how to do it. Only a basic knowledge of math, electronics, and a basic understanding of EMI/EMC are necessary to understand the concepts and circuits described. Once EMC troubleshooting is demystified, readers learn there are quick and simple techniques to solve complicated problems a key aspect of this book. Simple and inexpensive methods to resolve EMI issues are discussed to help generate unique ideas and methods for developing additional diagnostic tools and measurement procedures. An appendix on how to build probes is included. It can be a fun activity, even humorous at times with bizarre techniques (i.e., the sticky finger probe).