Download or read book Signal Integrity Effects in Custom IC and ASIC Designs written by Raminderpal Singh and published by John Wiley & Sons. This book was released on 2001-12-12 with total page 484 pages. Available in PDF, EPUB and Kindle. Book excerpt: "...offers a tutorial guide to IC designers who want to move to the next level of chip design by unlocking the secrets of signal integrity." —Jake Buurma, Senior Vice President, Worldwide Research & Development, Cadence Design Systems, Inc. Covers signal integrity effects in high performance Radio Frequency (RF) IC Brings together research papers from the past few years that address the broad range of issues faced by IC designers and CAD managers now and in the future A Wiley-IEEE Press publication

Download or read book Synthesis of Power Distribution to Manage Signal Integrity in Mixed Signal ICs written by Balsha R. Stanisic and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 221 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the early days of VLSI, the design of the power distribution for an integrated cir cuit was rather simple. Power distribution --the design of the geometric topology for the network of wires that connect the various power supplies, the widths of the indi vidual segments for each of these wires, the number and location of the power I/O pins around the periphery of the chip --was simple because the chips were simpler. Few available wiring layers forced floorplans that allowed simple, planar (non-over lapping) power networks. Lower speeds and circuit density made the choice of the wire widths easier: we made them just fat enough to avoid resistive voltage drops due to switching currents in the supply network. And we just didn't need enormous num bers of power and ground pins on the package for the chips to work. It's not so simple any more. Increased integration has forced us to focus on reliability concerns such as metal elec tromigration, which affects wire sizing decisions in the power network. Extra metal layers have allowed more flexibility in the topological layout of the power networks.

Download or read book Closing the Gap Between ASIC Custom written by David Chinnery and published by Springer Science & Business Media. This book was released on 2007-05-08 with total page 422 pages. Available in PDF, EPUB and Kindle. Book excerpt: by Kurt Keutzer Those looking for a quick overview of the book should fast-forward to the Introduction in Chapter 1. What follows is a personal account of the creation of this book. The challenge from Earl Killian, formerly an architect of the MIPS processors and at that time Chief Architect at Tensilica, was to explain the significant performance gap between ASICs and custom circuits designed in the same process generation. The relevance of the challenge was amplified shortly thereafter by Andy Bechtolsheim, founder of Sun Microsystems and ubiquitous investor in the EDA industry. At a dinner talk at the 1999 International Symposium on Physical Design, Andy stated that the greatest near-term opportunity in CAD was to develop tools to bring the performance of ASIC circuits closer to that of custom designs. There seemed to be some synchronicity that two individuals so different in concern and character would be pre-occupied with the same problem. Intrigued by Earl and Andy’s comments, the game was afoot. Earl Killian and other veterans of microprocessor design were helpful with clues as to the sources of the performance discrepancy: layout, circuit design, clocking methodology, and dynamic logic. I soon realized that I needed help in tracking down clues. Only at a wonderful institution like the University of California at Berkeley could I so easily commandeer an ab- bodied graduate student like David Chinnery with a knowledge of architecture, circuits, computer-aided design and algorithms.

Download or read book Silicon Germanium written by Raminderpal Singh and published by John Wiley & Sons. This book was released on 2004-03-15 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt: "An excellent introduction to the SiGe BiCMOS technology, from the underlying device physics to current applications." -Ron Wilson, EETimes "SiGe technology has demonstrated the ability to provide excellent high-performance characteristics with very low noise, at high power gain, and with excellent linearity. This book is a comprehensive review of the technology and of the design methods that go with it." -Alberto Sangiovanni-Vincentelli Professor, University of California, Berkeley Cofounder, Chief Technology Officer, Member of Board Cadence Design Systems Inc. Filled with in-depth insights and expert advice, Silicon Germanium covers all the key aspects of this technology and its applications. Beginning with a brief introduction to and historical perspective of IBM's SiGe technology, this comprehensive guide quickly moves on to: * Detail many of IBM's SiGe technology development programs * Explore IBM's approach to device modeling and characterization-including predictive TCAD modeling * Discuss IBM's design automation and signal integrity knowledge and implementation methodologies * Illustrate design applications in a variety of IBM's SiGe technologies * Highlight details of highly integrated SiGe BiCMOS system-on-chip (SOC) design Written for RF/analog and mixed-signal designers, CAD designers, semiconductor students, and foundry process engineers worldwide, Silicon Germanium provides detailed insight into the modeling and design automation requirements for leading-edge RF/analog and mixed-signal products, and illustrates in-depth applications that can be implemented using IBM's advanced SiGe process technologies and design kits. "This volume provides an excellent introduction to the SiGe BiCMOS technology, from the underlying device physics to current applications. But just as important is the window the text provides into the infrastructure-the process development, device modeling, and tool development." -Ron Wilson Silicon Engineering Editor, EETimes "This book chronicles the development of SiGe in detail, provides an in-depth look at the modeling and design automation requirements for making advanced applications using SiGe possible, and illustrates such applications as implemented using IBM's process technologies and design methods." -John Kelly Senior Vice President and Group Executive, Technology Group, IBM

Download or read book Compound Semiconductor Integrated Circuits written by Tho T. Vu and published by World Scientific. This book was released on 2003-01-01 with total page 366 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the book version of a special issue of the International Journal of High Speed Electronics and Systems, reviewing recent work in the field of compound semiconductor integrated circuits. There are fourteen invited papers covering a wide range of applications, frequencies and materials. These papers deal with digital, analog, microwave and millimeter-wave technologies, devices and integrated circuits for wireline fiber-optic lightwave transmissions, and wireless radio-frequency microwave and millimeter-wave communications. In each case, the market is young and experiencing rapid growth for both commercial and millitary applications. Many new semiconductor technologies compete for these new markets, leading to an alphabet soup of semiconductor materials described in these papers. The book also includes three papers focused on radiation effects and reliability in III-V semiconductor electronics, which are useful for reference and future directions. Moreover, reliability is covered in several papers separately for certain process technologies. Contents: Present and Future of High-Speed Compound Semiconductor IC''s (T Otsuji); The Transforming MMIC (E J Martinez); Distributed Amplifier for Fiber-Optic Communication Systems (H Shigematsu et al.); Microwave GaN-Based Power Transistors on Large-Scale Silicon Wafers (S Manohar et al.); Radiation Effects in High Speed III-V Integrated Circuits (T R Weatherford); Radiation Effects in III-V Semiconductor Electronics (B D Weaver et al.); Reliability and Radiation Hardness of Compound Semiconductors (S A Kayali & A H Johnston); and other papers. Readership: Engineers, scientists and graduate students working on high speed electronics and systems, and in the area of compound semiconductor integrated circuits.

Download or read book Advanced Model Order Reduction Techniques in VLSI Design written by Sheldon Tan and published by Cambridge University Press. This book was released on 2007-05-31 with total page 259 pages. Available in PDF, EPUB and Kindle. Book excerpt: Model order reduction (MOR) techniques reduce the complexity of VLSI designs, paving the way to higher operating speeds and smaller feature sizes. This book presents a systematic introduction to, and treatment of, the key MOR methods employed in general linear circuits, using real-world examples to illustrate the advantages and disadvantages of each algorithm. Following a review of traditional projection-based techniques, coverage progresses to more advanced MOR methods for VLSI design, including HMOR, passive truncated balanced realization (TBR) methods, efficient inductance modeling via the VPEC model, and structure-preserving MOR techniques. Where possible, numerical methods are approached from the CAD engineer's perspective, avoiding complex mathematics and allowing the reader to take on real design problems and develop more effective tools. With practical examples and over 100 illustrations, this book is suitable for researchers and graduate students of electrical and computer engineering, as well as practitioners working in the VLSI design industry.

Download or read book Model and Design of Bipolar and MOS Current Mode Logic written by Massimo Alioto and published by Springer Science & Business Media. This book was released on 2006-01-25 with total page 329 pages. Available in PDF, EPUB and Kindle. Book excerpt: Current-Mode digital circuits have been extensively analyzed and used since the early days of digital ICs. In particular, bipolar Current-Mode digital circuits emerged as an approach to realize digital circuits with the highest speed. Together with its speed performance, CMOS Current-Mode logic has been rediscovered to allow logic gates implementations which, in contrast to classical VLSI CMOS digital circuits, have the feature of low noise level generation. Thus, CMOS Current-Mode gates can be efficiently used inside analog and mixed-signal ICs, which require a low noise silicon environment. For these reasons, until today, many works and results have been published which reinforce the importance of Current-Mode digital circuits. In the topic of Current-Mode digital circuits, the authors spent a lot of effort in the last six years, and their original results highly enhanced both the modeling and the related design methodologies. Since the fundamental Current-Mode logic building block is the classical differential amplifier, the winning idea, that represents the starting point of the authors’ research, was to change the classical point of view typically followed in the investigation and design of Current-Mode digital circuits. In particular, they properly exploited classical paradigms developed and used in the analog circuit domain (a topic in which one of the authors maturated a great experience).

Download or read book Measurement and Modeling of Silicon Heterostructure Devices written by John D. Cressler and published by CRC Press. This book was released on 2018-10-03 with total page 200 pages. Available in PDF, EPUB and Kindle. Book excerpt: When you see a nicely presented set of data, the natural response is: “How did they do that; what tricks did they use; and how can I do that for myself?” Alas, usually, you must simply keep wondering, since such tricks-of- the-trade are usually held close to the vest and rarely divulged. Shamefully ignored in the technical literature, measurement and modeling of high-speed semiconductor devices is a fine art. Robust measuring and modeling at the levels of performance found in modern SiGe devices requires extreme dexterity in the laboratory to obtain reliable data, and then a valid model to fit that data. Drawn from the comprehensive and well-reviewed Silicon Heterostructure Handbook, this volume focuses on measurement and modeling of high-speed silicon heterostructure devices. The chapter authors provide experience-based tricks-of-the-trade and the subtle nuances of measuring and modeling advanced devices, making this an important reference for the semiconductor industry. It includes easy-to-reference appendices covering topics such as the properties of silicon and germanium, the generalized Moll-Ross relations, the integral charge-control model, and sample SiGe HBT compact model parameters.

Download or read book System on Chip Test Architectures written by Laung-Terng Wang and published by Morgan Kaufmann. This book was released on 2010-07-28 with total page 893 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modern electronics testing has a legacy of more than 40 years. The introduction of new technologies, especially nanometer technologies with 90nm or smaller geometry, has allowed the semiconductor industry to keep pace with the increased performance-capacity demands from consumers. As a result, semiconductor test costs have been growing steadily and typically amount to 40% of today's overall product cost. This book is a comprehensive guide to new VLSI Testing and Design-for-Testability techniques that will allow students, researchers, DFT practitioners, and VLSI designers to master quickly System-on-Chip Test architectures, for test debug and diagnosis of digital, memory, and analog/mixed-signal designs. - Emphasizes VLSI Test principles and Design for Testability architectures, with numerous illustrations/examples. - Most up-to-date coverage available, including Fault Tolerance, Low-Power Testing, Defect and Error Tolerance, Network-on-Chip (NOC) Testing, Software-Based Self-Testing, FPGA Testing, MEMS Testing, and System-In-Package (SIP) Testing, which are not yet available in any testing book. - Covers the entire spectrum of VLSI testing and DFT architectures, from digital and analog, to memory circuits, and fault diagnosis and self-repair from digital to memory circuits. - Discusses future nanotechnology test trends and challenges facing the nanometer design era; promising nanotechnology test techniques, including Quantum-Dots, Cellular Automata, Carbon-Nanotubes, and Hybrid Semiconductor/Nanowire/Molecular Computing. - Practical problems at the end of each chapter for students.

Download or read book Fields Networks Computational Methods and Systems in Modern Electrodynamics written by Peter Russer and published by Springer Science & Business Media. This book was released on 2013-04-17 with total page 296 pages. Available in PDF, EPUB and Kindle. Book excerpt: On June 1St 2004 the Faculty of Electrical Engineering and Information Technology of the Technische Universitat Miinchen bestowed the degree of the doctor honoris causa to Leopold B. Felsen, for extraordinary achievements in the theory of electromag netic fields. On this occasion on June 1St and 2nd 2004 at the Technische Universitat Miinchen a symposium on "Fields, Networks, Computational Methods, and Systems: A Modern View of Engineering Electrodynamics" in honor of Leopold B. Felsen was organized. The symposium topic focused on an important area of Leopold Felsen research interests and, as the title emphasizes, on a modern view of applied Electro dynamics. While the fundamental physical laws of electrodynamics are well known, research in this field is experiencing a steady continuous growth. The problem -solving approaches of, say, twenty years ago may seem now fairly obsolete since considerable progress has been made in the meantime. In this monograph we collect samples of present day state of the art in dealing with electromagnetic fields, their network theory representation, their computation and, finally, on system applications. The network formulation of field problems can improve the problem formulation and also contribute to the solution methodology. Network theory systematic approaches for circuit analysis are based on the separation of the circuit into the connection circuit and the circuit elements. Many applications in science and technology rely on computations of the electromagnetic field in either man-made or natural complex structures.

Download or read book Scientific Computing in Electrical Engineering written by Wilhelmus H. Schilders and published by Springer Science & Business Media. This book was released on 2004-08-11 with total page 436 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the proceedings of the 4th International Workshop "Scientific Computing in Electrical Engineering", held in Eindhoven, The Netherlands, from June 23-28, 2002. This workshop followed three earlier workshops held in 1997 at the Darmstadt University of Technology, in 1998 at the Weierstrass Institute for Applied Analysis and Stochastics, and in 2000 at the University of Rostock. The main topics of SCEE-2002 were computational electrodynamics, circuit simulation and coupled problems. The objective of the workshop, which was mainly directed at mathematicians and electrical engineers, was to bring together scientists from universities and industry with the goal of intensive discussions about modelling and numerical simulation of electronic circuits and electromagnetic fields. A special feature was the "Industry Day", where distinguished speakers discussed the needs of industry in the field of computational electromagnetics and circuit simulation. The book contains papers of invited and contributed talks, as well as from poster presentations.

Download or read book Semiconductor Modeling written by Roy Leventhal and published by Springer Science & Business Media. This book was released on 2007-01-10 with total page 769 pages. Available in PDF, EPUB and Kindle. Book excerpt: Discusses process variation, model accuracy, design flow and many other practical engineering, reliability and manufacturing issues Gives a good overview for a person who is not an expert in modeling and simulation, enabling them to extract the necessary information to competently use modeling and simulation programs Written for engineering students and product design engineers

Download or read book Signal and Power Integrity in Digital Systems written by James Edgar Buchanan and published by . This book was released on 1996 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt: "This book shows designers how to ensure signal integrity and control noise in high-speed digital systems - particularly important in a Pentium-paced environment where functional logic design is no longer separable from electrical and mechanical design." "Highlighting TTL, CMOS, and BiCMOS logic applications in a single source, Signal and Power Integrity in Digital Systems provides a practical solutions-oriented approach to a wide variety of relevant interconnection and timing issues." "Special features include noise tolerant logic architectures; power distribution techniques that reduce noise; clock distribution techniques that ensure clock signal quality; signal interconnection techniques that reduce crosstalk, signal loading, and transmission-line effects; how to get optimum performance from high-speed memory devices; and system application tips for high-speed PALs, PLAs, FIFOs, and ASICs." "Designers will also appreciate the practical engineering approximations provided for the calculation of design parameters along with illustrations and numerous tables usable for quick reference and comparison of characteristics." "It's a book every digital designer should have - engineers involved in the design of computers, peripherals, signal processors, and control and communications equipment, as well as young engineers facing their first designs using high-speed logic devices."--BOOK JACKET.Title Summary field provided by Blackwell North America, Inc. All Rights Reserved

Download or read book High Speed Signaling written by Kyung Suk (Dan) Oh and published by Prentice Hall. This book was released on 2011-10-07 with total page 608 pages. Available in PDF, EPUB and Kindle. Book excerpt: New System-Level Techniques for Optimizing Signal/Power Integrity in High-Speed Interfaces--from Pioneering Innovators at Rambus, Stanford, Berkeley, and MIT As data communication rates accelerate well into the multi-gigahertz range, ensuring signal integrity both on- and off-chip has become crucial. Signal integrity can no longer be addressed solely through improvements in package or board-level design: Diverse engineering teams must work together closely from the earliest design stages to identify the best system-level solutions. In High-Speed Signaling, several of the field’s most respected practitioners and researchers introduce cutting-edge modeling, simulation, and optimization techniques for meeting this challenge. Edited by pioneering experts Drs. Dan Oh and Chuck Yuan, these contributors explain why noise and jitter are no longer separable, demonstrate how to model their increasingly complex interactions, and thoroughly introduce a new simulation methodology for predicting link-level performance with unprecedented accuracy. The authors address signal integrity from architecture through high-volume production, thoroughly discussing design, implementation, and verification. Coverage includes New advances in passive-channel modeling, power-supply noise and jitter modeling, and system margin prediction Methodologies for balancing system voltage and timing budgets to improve system robustness in high-volume manufacturing Practical, stable formulae for converting key network parameters Improved solutions for difficult problems in the broadband modeling of interconnects Equalization techniques for optimizing channel performance Important new insights into the relationships between jitter and clocking topologies New on-chip measurement techniques for in-situ link performance testing Trends and future directions in signal integrity engineering High-Speed Signaling thoroughly introduces new techniques pioneered at Rambus and other leading high-tech companies and universities: approaches that have never before been presented with this much practical detail. It will be invaluable to everyone concerned with signal integrity, including signal and power integrity engineers, high-speed I/O circuit designers, and system-level board design engineers.

Download or read book IBM Journal of Research and Development written by and published by . This book was released on 2003 with total page 768 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Understanding Signal Integrity written by Stephen C. Thierauf and published by Artech House. This book was released on 2010-11 with total page 257 pages. Available in PDF, EPUB and Kindle. Book excerpt: This unique book provides you with practical guidance on understanding and interpreting signal integrity (SI) performance to help you with your challenging circuit board design projects. You find high-level discussions of important SI concepts presented in a clear and easily accessible format, including question and answer sections and bulleted lists. This valuable resource features rules of thumb and simple equations to help you make estimates of critical signal integrity parameters without using circuit simulators of CAD (computer-aided design). The book is supported with over 120 illustrations, nearly 100 equations, and detailed reference lists at the end of each chapter.

Download or read book ASIC Design in the Silicon Sandbox written by and published by . This book was released on 2007 with total page 390 pages. Available in PDF, EPUB and Kindle. Book excerpt: