Download or read book Si RF Technology written by Ayan Karmakar and published by Springer. This book was released on 2019-05-10 with total page 144 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses the recent research developments of various passive microwave circuits on silicon substrate and demonstrated operations catering for multiple frequency bands. It covers the design, modelling, process fabrication and characterization aspects with practical examples. The book will be of use to researchers and engineers working in the field of RF or microwave engineering, who can use the techniques and approaches effectively without having to refer to multiple sources.

Download or read book Si RF Technology written by Ayan Karmakar and published by . This book was released on 2019 with total page 157 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses the recent research developments of various passive microwave circuits on silicon substrate and demonstrated operations catering for multiple frequency bands. It covers the design, modelling, process fabrication and characterization aspects with practical examples. The book will be of use to researchers and engineers working in the field of RF or microwave engineering, who can use the techniques and approaches effectively without having to refer to multiple sources.

Download or read book mm Wave Silicon Technology written by Ali M. Niknejad and published by Springer Science & Business Media. This book was released on 2008-01-03 with total page 313 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book compiles and presents the research results from the past five years in mm-wave Silicon circuits. This area has received a great deal of interest from the research community including several university and research groups. The book covers device modeling, circuit building blocks, phased array systems, and antennas and packaging. It focuses on the techniques that uniquely take advantage of the scale and integration offered by silicon based technologies.

Download or read book RF Technologies for Low Power Wireless Communications written by Tatsuo Itoh and published by John Wiley & Sons. This book was released on 2004-04-07 with total page 482 pages. Available in PDF, EPUB and Kindle. Book excerpt: A survey of microwave technology tailored for professionals in wireless communications RF Technologies for Low Power Wireless Communications updates recent developments in wireless communications from a hardware design standpoint and offers specialized coverage of microwave technology with a focus on the low power wireless units required in modern wireless systems. It explores results of recent research that focused on a holistic, integrated approach to the topics of materials, devices, circuits, modulation, and architectures rather than the more traditional approach of research into isolated topical areas. Twelve chapters deal with various fundamental research aspects of low power wireless electronics written by world-class experts in each field. The first chapter offers an overview of wireless architecture and performance, followed by detailed coverage of: Advanced GaAs-based HBT designs InP-based devices and circuits Si/SiGe HBT technology Noise in GaN devices Power amplifier architectures and nonlinearities Planar-oriented components MEMS and micromachined components Resonators, filters, and low-noise oscillators Antennas Transceiver front-end architectures With a clear focus and expert contributors, RF Technologies for Low Power Wireless Communications will be of interest to a wide range of electrical engineering disciplines working in wireless technologies.

Download or read book TSV 3D RF Integration written by Shenglin Ma and published by Elsevier. This book was released on 2022-04-27 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt: TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology. Provides a detailed demonstration of the design and process development of HR-Si (High-Resistivity Silicon) interposer technology Presents a series of implementation case studies that detail modeling and simulation, integration, qualification and testing methods Offers a systematic and comparative literature review of HR-Si interposer technology by topic Offers solutions to problems with TSV (through silicon via) interposer technology, including high frequency loss and cooling problems Gives a systematic and accessible accounting on this leading technology

Download or read book Porous Silicon From Formation to Applications Optoelectronics Microelectronics and Energy Technology Applications Volume Three written by Ghenadii Korotcenkov and published by CRC Press. This book was released on 2016-01-06 with total page 431 pages. Available in PDF, EPUB and Kindle. Book excerpt: Porous silicon is rapidly attracting increasing interest from various fields, including optoelectronics, microelectronics, photonics, medicine, sensor and energy technologies, chemistry, and biosensing. This nanostructured and biodegradable material has a range of unique properties that make it ideal for many applications. This book, the third of a

Download or read book Microwave Circuits for 24 GHz Automotive Radar in Silicon based Technologies written by Vadim Issakov and published by Springer Science & Business Media. This book was released on 2010-08-05 with total page 218 pages. Available in PDF, EPUB and Kindle. Book excerpt: There are continuous efforts focussed on improving road traffic safety worldwide. Numerous vehicle safety features have been invented and standardized over the past decades. Particularly interesting are the driver assistance systems, since these can considerably reduce the number of accidents by supporting drivers’ perception of their surroundings. Many driver assistance features rely on radar-based sensors. Nowadays the commercially available automotive front-end sensors are comprised of discrete components, thus making the radar modules highly-priced and suitable for integration only in premium class vehicles. Realization of low-cost radar fro- end circuits would enable their implementation in inexpensive economy cars, c- siderably contributing to traffic safety. Cost reduction requires high-level integration of the microwave front-end c- cuitry, specifically analog and digital circuit blocks co-located on a single chip. - cent developments of silicon-based technologies, e.g. CMOS and SiGe:C bipolar, make them suitable for realization of microwave sensors. Additionally, these te- nologies offer the necessary integration capability. However, the required output power and temperature stability, necessary for automotive radar sensor products, have not yet been achieved in standard digital CMOS technologies. On the other hand, SiGe bipolar technology offers excellent high-frequency characteristics and necessary output power for automotive applications, but has lower potential for - alization of digital blocks than CMOS.

Download or read book Design Simulation and Applications of Inductors and Transformers for Si RF ICs written by Ali M. Niknejad and published by Springer Science & Business Media. This book was released on 2005-12-15 with total page 193 pages. Available in PDF, EPUB and Kindle. Book excerpt: The modern wireless communication industry has put great demands on circuit designers for smaller, cheaper transceivers in the gigahertz frequency range. One tool which has assisted designers in satisfying these requirements is the use of on-chip inductiveelements (inductors and transformers) in silicon (Si) radio-frequency (RF) integrated circuits (ICs). These elements allow greatly improved levels of performance in Si monolithic low-noise amplifiers, power amplifiers, up-conversion and down-conversion mixers and local oscillators. Inductors can be used to improve the intermodulation distortion performance and noise figure of small-signal amplifiers and mixers. In addition, the gain of amplifier stages can be enhanced and the realization of low-cost on-chip local oscillators with good phase noise characteristics is made feasible. In order to reap these benefits, it is essential that the IC designer be able to predict and optimize the characteristics of on-chip inductiveelements. Accurate knowledge of inductance values, quality factor (Q) and the influence of ad- cent elements (on-chip proximity effects) and substrate losses is essential. In this book the analysis, modeling and application of on-chip inductive elements is considered. Using analyses based on Maxwells equations, an accurate and efficient technique is developed to model these elements over a wide frequency range. Energy loss to the conductive substrate is modeled through several mechanisms, including electrically induced displacement and conductive c- rents and by magnetically induced eddy currents. These techniques have been compiled in a user-friendly software tool ASITIC (Analysis and Simulation of Inductors and Transformers for Integrated Circuits).

Download or read book Radio Frequency Integrated Circuit Engineering written by Cam Nguyen and published by John Wiley & Sons. This book was released on 2015-03-04 with total page 884 pages. Available in PDF, EPUB and Kindle. Book excerpt: Radio-Frequency Integrated-Circuit Engineering addresses the theory, analysis and design of passive and active RFIC's using Si-based CMOS and Bi-CMOS technologies, and other non-silicon based technologies. The materials covered are self-contained and presented in such detail that allows readers with only undergraduate electrical engineering knowledge in EM, RF, and circuits to understand and design RFICs. Organized into sixteen chapters, blending analog and microwave engineering, Radio-Frequency Integrated-Circuit Engineering emphasizes the microwave engineering approach for RFICs. * Provides essential knowledge in EM and microwave engineering, passive and active RFICs, RFIC analysis and design techniques, and RF systems vital for RFIC students and engineers * Blends analog and microwave engineering approaches for RFIC design at high frequencies * Includes problems at the end of each chapter

Download or read book Tunable RF Components and Circuits written by Jeffrey L. Hilbert and published by CRC Press. This book was released on 2018-09-03 with total page 330 pages. Available in PDF, EPUB and Kindle. Book excerpt: An Industry Perspective on Key Tunable Technologies and Applications Tunable RF Components and Circuits: Applications in Mobile Handsets provides a technical introduction to the state of the art in tunable radio frequency (RF) components, circuits, and applications and discusses the foundational work that has been done to date. Leading practitioners in the field share their expertise on tunable devices in mobile handset applications. Through these practical viewpoints, readers discover how to use tunable RF techniques and devices to develop successful product designs. A substantial portion of the book focuses on antennas and antenna tuning, reflecting the dominance of the antenna tuning application in today’s commercial market for tunable RF. The book explains how RF-microelectromechanical systems (RF-MEMS), barium strontium titinate (BST), silicon-on-insulator (SOI) field effect transistors (FETs), and high-performance complementary metal oxide semiconductors (CMOS) are used as enabling technologies for tunable functions in current and next-generation radio architectures. The book also describes power amplifier envelope tracking, an emerging and important technique for improving efficiency; presents a network operator’s perspective on the evolution of the handset front end; and explores emerging approaches to production testing of wireless devices.

Download or read book Electronics for Microwave Backhaul written by Vittorio Camarchia and published by Artech House. This book was released on 2016-03-31 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt: This timely new resource presents an overview of the electronics of mobile network backhaul. Infrastructure planning, architecture evolution, digital controls, and countermeasures are all presented highlighting the building blocks of specific backhaul features. Tx and Rx design and antenna requirements and covered while examining the overall construction of the microwave radio hardware blocks. Single blocks are explored: the antenna, the analog transmitter and receiver, and the modem, recalling the most important aspects of transport networks and microwave link dimensioning. Essential theory is provided for each hardware block with an emphasis on present solutions. Authored by academic and industrial experts in the field, development and design engineers will benefit from the practical guidance in solving realistic issues and providing useful tips throughout the design process. This book guides readers through the historical evolution of microwave radios and the components of the next generation of mobile networks.

Download or read book Silicon Germanium Carbon Alloys written by S. Pantellides and published by CRC Press. This book was released on 2002-07-26 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt: Carbon (C) and Silicon Germanium (SiGe) work like a magic sauce. At least in small concentrations, they make everything taste better. It is remarkable enough that SiGe, a new material, and the heterobipolar transistor, a new device, appear on the brink of impacting the exploding wireless market. The addition of C to SiGe, albeit in small concentrations, looks to have breakthrough potential. Here, at last, is proof that materials science can put a rocket booster on the silicon-mind, the silicon transistor. Scientific excitement arises, as always, from the new possibilities a multicomponent materials system offers. Bandgaps can be changed, strains can be tuned, and properties can be tailored. This is catnip to the materials scientist. The wide array of techniques applied here to the SiGeC system bear testimony to the ingenious approaches now available for mastering the complexities of new materials

Download or read book RF MEMS and Their Applications written by Vijay K. Varadan and published by John Wiley & Sons. This book was released on 2003-07-25 with total page 406 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectromechanical systems (MEMS) refer to a collection of micro-sensors and actuators, which can react to environmental change under micro- circuit control. The integration of MEMS into traditional Radio Frequency (RF) circuits has resulted in systems with superior performance levels and lower manufacturing costs. The incorporation of MEMS based fabrication technologies into micro and millimeter wave systems offers viable routes to ICs with MEMS actuators, antennas, switches and transmission lines. The resultant systems operate with an increased bandwidth and increased radiation efficiency and have considerable scope for implementation within the expanding area of wireless personal communication devices. This text provides leading edge coverage of this increasingly important area and highlights the overlapping information requirements of the RF and MEMS research and development communities. * Provides an introduction to micromachining techniques and their use in the fabrication of micro switches, capacitors and inductors * Includes coverage of MEMS devices for wireless and Bluetooth enabled systems Essential reading for RF Circuit design practitioners and researchers requiring an introduction to MEMS technologies, as well as practitioners and researchers in MEMS and silicon technology requiring an introduction to RF circuit design.

Download or read book RF and Microwave Passive and Active Technologies written by Mike Golio and published by CRC Press. This book was released on 2018-10-03 with total page 736 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the high frequency world, the passive technologies required to realize RF and microwave functionality present distinctive challenges. SAW filters, dielectric resonators, MEMS, and waveguide do not have counterparts in the low frequency or digital environment. Even when conventional lumped components can be used in high frequency applications, their behavior does not resemble that observed at lower frequencies. RF and Microwave Passive and Active Technologies provides detailed information about a wide range of component technologies used in modern RF and microwave systems. Updated chapters include new material on such technologies as MEMS, device packaging, surface acoustic wave (SAW) filters, bipolar junction and heterojunction transistors, and high mobility electron transistors (HMETs). The book also features a completely rewritten section on wide bandgap transistors.

Download or read book Design and Test of Integrated Inductors for RF Applications written by Jaime Aguilera and published by Springer Science & Business Media. This book was released on 2007-05-08 with total page 203 pages. Available in PDF, EPUB and Kindle. Book excerpt: Intended for engineers who are starting out in the design of integrated inductors, this book describes the whole design flow, basic selection of the geometry and optimisation of the quality by redesigning the geometry, measurement and de-embedding and characterisation.

Download or read book New Materials and Devices Enabling 5G Applications and Beyond written by Nadine Collaert and published by Elsevier. This book was released on 2024-01-24 with total page 369 pages. Available in PDF, EPUB and Kindle. Book excerpt: New Materials and Devices for 5G Applications and Beyond focuses on the materials, device architectures and enabling integration schemes for 5G applications and emerging technologies. It gives a comprehensive overview of the trade-offs, challenges and unique properties of novel upcoming technologies. Starting from the application side and its requirements, the book examines different technologies under consideration for the different functions, both more conventional to exploratory, and within this context the book provides guidance to the reader on how to possibly optimize the system for a particular application. This book aims at guiding the reader through the technologies required to enable 5G applications, with the main focus on mm-wave frequencies, up to THz. New Materials and Devises for 5G Applications and Beyond is suitable for industrial researchers and development engineers, and researchers in materials science, device engineering and circuit design. Reviews challenges and emerging opportunities for materials, devices, and integration to enable 5G technologies Includes discussion of technologies such as RF-MEMs, RF FINFETs, and transistors based on current and emerging materials (InP, GaN, etc.) Focuses on mm-wave frequencies up to the terahertz regime

Download or read book Lumped Elements for RF and Microwave Circuits Second Edition written by Inder J. Bahl and published by Artech House. This book was released on 2022-12-31 with total page 593 pages. Available in PDF, EPUB and Kindle. Book excerpt: Fully updated and including entirely new chapters, this Second Edition provides in-depth coverage of the different types of RF and microwave circuit elements, including inductors, capacitors, resistors, transformers, via holes, airbridges, and crossovers. Featuring extensive formulas for lumped elements, design trade-offs, and an updated and current list of references, the book helps you understand the value and usefulness of lumped elements in the design of RF, microwave and millimeter wave components and circuits. You’ll find a balanced treatment between standalone lumped elements and their circuits using MICs, MMICs and RFICs technologies. You’ll also find detailed information on a broader range RFICs that was not available when the popular first edition was published. The book captures – in one consolidated volume -- the fundamentals, equations, modeling, examples, references and overall procedures to design, test and produce microwave components that are indispensable in industry and academia today. With its superb organization and expanded coverage of the subject, this is a must-have, go-to resource for practicing engineers and researchers in industry, government and university and microwave engineers working in the antenna area. Students will also find it a useful reference with its clear explanations, many examples and practical modeling guidelines.