Download or read book Semiconductor Devices Mechanical and Climatic Test Methods Preconditioning of Non Hermetic Surface Mount Devices Prior to Reliability Testing written by British Standards Institute Staff and published by . This book was released on 2006-01-27 with total page 18 pages. Available in PDF, EPUB and Kindle. Book excerpt: Semiconductor devices, Integrated circuits, Electronic equipment and components, Mechanical testing, Environmental testing, Climate, Surface mounting devices, Specimen preparation, Reliability, Performance testing
Download or read book GB T 2018 GB 2018 Chinese National Standard PDF English Catalog year 2018 written by https://www.chinesestandard.net and published by https://www.chinesestandard.net. This book was released on 2020-06-06 with total page 434 pages. Available in PDF, EPUB and Kindle. Book excerpt: This document provides the comprehensive list of Chinese National Standards - Category: GB, GB/T Series of year 2018.
Download or read book Chinese Standard GB GB T GBT JB JB T YY HJ NB HG QC SL SN SH JJF JJG CJ TB YD YS NY FZ JG QB SJ SY DL AQ CB GY JC JR JT written by https://www.chinesestandard.net and published by https://www.chinesestandard.net. This book was released on 2018-01-01 with total page 7263 pages. Available in PDF, EPUB and Kindle. Book excerpt: This document provides the comprehensive list of Chinese National Standards and Industry Standards (Total 17,000 standards).
Download or read book GB T GBT Product Catalog Translated English of Chinese Standard GB T GBT written by https://www.chinesestandard.net and published by https://www.chinesestandard.net. This book was released on 2018-01-01 with total page 2263 pages. Available in PDF, EPUB and Kindle. Book excerpt: This document provides the comprehensive list of Chinese National Standards - Category: GB/T; GBT.
Download or read book List of English translated Chinese standards GB T written by https://www.codeofchina.com and published by https://www.codeofchina.com. This book was released on with total page 3495 pages. Available in PDF, EPUB and Kindle. Book excerpt: HTTPS://WWW.CODEOFCHINA.COM EMAIL:[email protected] "Codeofchina Inc., a part of TransForyou (Beijing) Translation Co., Ltd., is a professional Chinese code translator in China. Now, Codeofchina Inc. is running a professional Chinese code website, www.codeofchina.com. Through this website, Codeofchina Inc. provides English-translated Chinese codes to clients worldwide. About TransForyou TransForyou (Beijing) Translation Co., Ltd., established in 2003, is a reliable language service provider for clients at home and abroad. Since our establishment, TransForyou has been aiming to build up a translation brand with our professional dedicated service. Currently, TransForyou is the director of China Association of Engineering Construction Standardization (CECS); the committeeman of Localization Service Committee / Translators Association of China (TAC) and the member of Boya Translation Culture Salon (BTCS); and the field study center of the University of the University of International Business & Economics (UIBE) and Hebei University (HU). In 2016, TransForyou ranked 27th among Asian Language Service Providers by Common Sense Advisory. "
Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Download or read book Semiconductor Packaging written by Andrea Chen and published by CRC Press. This book was released on 2016-04-19 with total page 216 pages. Available in PDF, EPUB and Kindle. Book excerpt: In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Download or read book NUREG CR written by U.S. Nuclear Regulatory Commission and published by . This book was released on 1977 with total page 164 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Accelerated Testing written by Wayne B. Nelson and published by John Wiley & Sons. This book was released on 2009-09-25 with total page 626 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Wiley-Interscience Paperback Series consists of selected books that have been made more accessible to consumers in an effort to increase global appeal and general circulation. With these new unabridged softcover volumes, Wiley hopes to extend the lives of these works by making them available to future generations of statisticians, mathematicians, and scientists. ". . . a goldmine of knowledge on accelerated life testing principles and practices . . . one of the very few capable of advancing the science of reliability. It definitely belongs in every bookshelf on engineering." –Dev G. Raheja, Quality and Reliability Engineering International ". . . an impressive book. The width and number of topics covered, the practical data sets included, the obvious knowledge and understanding of the author and the extent of published materials reviewed combine to ensure that this will be a book used frequently." –Journal of the Royal Statistical Society A benchmark text in the field, Accelerated Testing: Statistical Models, Test Plans, and Data Analysis offers engineers, scientists, and statisticians a reliable resource on the effective use of accelerated life testing to measure and improve product reliability. From simple data plots to advanced computer programs, the text features a wealth of practical applications and a clear, readable style that makes even complicated physical and statistical concepts uniquely accessible. A detailed index adds to its value as a reference source.
Download or read book Materials and Processes written by Barrie D. Dunn and published by Springer. This book was released on 2015-12-29 with total page 677 pages. Available in PDF, EPUB and Kindle. Book excerpt: The objective of this book is to assist scientists and engineers select the ideal material or manufacturing process for particular applications; these could cover a wide range of fields, from light-weight structures to electronic hardware. The book will help in problem solving as it also presents more than 100 case studies and failure investigations from the space sector that can, by analogy, be applied to other industries. Difficult-to-find material data is included for reference. The sciences of metallic (primarily) and organic materials presented throughout the book demonstrate how they can be applied as an integral part of spacecraft product assurance schemes, which involve quality, material and processes evaluations, and the selection of mechanical and component parts. In this successor edition, which has been revised and updated, engineering problems associated with critical spacecraft hardware and the space environment are highlighted by over 500 illustrations including micrographs and fractographs. Space hardware captured by astronauts and returned to Earth from long durations in space are examined. Information detailed in the Handbook is applicable to general terrestrial applications including consumer electronics as well as high reliability systems associated with aeronautics, medical equipment and ground transportation. This Handbook is also directed to those involved in maximizing the relia bility of new materials and processes for space technology and space engineering. It will be invaluable to engineers concerned with the construction of advanced structures or mechanical and electronic sub-systems.
Download or read book Mechanics of Microelectronics written by G.Q. Zhang and published by Springer Science & Business Media. This book was released on 2006-08-25 with total page 580 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.
Download or read book Reflow Soldering Processes written by Ning-Cheng Lee and published by Newnes. This book was released on 2002-01-11 with total page 282 pages. Available in PDF, EPUB and Kindle. Book excerpt: Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process
Download or read book Improving Product Reliability written by Mark A. Levin and published by John Wiley & Sons. This book was released on 2003-05-07 with total page 346 pages. Available in PDF, EPUB and Kindle. Book excerpt: The design and manufacture of reliable products is a major challenge for engineers and managers. This book arms technical managers and engineers with the tools to compete effectively through the design and production of reliable technology products.
Download or read book Failure Modes and Mechanisms in Electronic Packages written by P. Singh and published by Springer Science & Business Media. This book was released on 1997-11-30 with total page 398 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.
Download or read book Semiconductor Memories written by Ashok K. Sharma and published by Wiley-IEEE Press. This book was released on 2002-09-10 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt: Semiconductor Memories provides in-depth coverage in the areas of design for testing, fault tolerance, failure modes and mechanisms, and screening and qualification methods including. * Memory cell structures and fabrication technologies. * Application-specific memories and architectures. * Memory design, fault modeling and test algorithms, limitations, and trade-offs. * Space environment, radiation hardening process and design techniques, and radiation testing. * Memory stacks and multichip modules for gigabyte storage.
Download or read book Automotive Mechatronics written by Konrad Reif and published by Springer. This book was released on 2014-08-25 with total page 549 pages. Available in PDF, EPUB and Kindle. Book excerpt: As the complexity of automotive vehicles increases this book presents operational and practical issues of automotive mechatronics. It is a comprehensive introduction to controlled automotive systems and provides detailed information of sensors for travel, angle, engine speed, vehicle speed, acceleration, pressure, temperature, flow, gas concentration etc. The measurement principles of the different sensor groups are explained and examples to show the measurement principles applied in different types.
Download or read book Electronic Components and Systems written by W. H. Dennis and published by Elsevier. This book was released on 2013-10-22 with total page 273 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic Components and Systems focuses on the principles and processes in the field of electronics and the integrated circuit. Covered in the book are basic aspects and physical fundamentals; different types of materials involved in the field; and passive and active electronic components such as capacitors, inductors, diodes, and transistors. Also covered in the book are topics such as the fabrication of semiconductors and integrated circuits; analog circuitry; digital logic technology; and microprocessors. The monograph is recommended for beginning electrical engineers who would like to know the fundamental concepts, theories, and processes in the related fields.
