Download or read book Electronic Product Design for Automated Manufacturing written by Richard Stillwell and published by Routledge. This book was released on 2018-02-06 with total page 338 pages. Available in PDF, EPUB and Kindle. Book excerpt: Analyzes all phases of the electronic product design process, including management, planning, quality control, design, manufacturing, and automation. A reference/textbook for students and professionals in such fields as electronics, manufacturing, circuit design, computer science. Annotation copyrig
Download or read book Plunkett s Engineering Research Industry Almanac 2008 written by Jack W. Plunkett and published by Plunkett Research, Ltd.. This book was released on 2008-05 with total page 719 pages. Available in PDF, EPUB and Kindle. Book excerpt: A guide to the trends and leading companies in the engineering, research, design, innovation and development business fields: those firms that are dominant in engineering-based design and development, as well leaders in technology-based research and development.
Download or read book Micro and Opto Electronic Materials and Structures Physics Mechanics Design Reliability Packaging written by Ephraim Suhir and published by Springer Science & Business Media. This book was released on 2007-05-26 with total page 1471 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Download or read book Handbook of Lead Free Solder Technology for Microelectronic Assemblies written by Karl J. Puttlitz and published by CRC Press. This book was released on 2004-02-27 with total page 1044 pages. Available in PDF, EPUB and Kindle. Book excerpt: This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specif
Download or read book The Art of Electronics written by Paul Horowitz and published by . This book was released on 2021 with total page 1227 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Lead Free Soldering in Electronics written by Katsuaki Suganuma and published by CRC Press. This book was released on 2003-12-11 with total page 355 pages. Available in PDF, EPUB and Kindle. Book excerpt: Assessing the scientific and technological aspects of lead-free soldering, Lead-Free Soldering in Electronics considers the necessary background and requirements for proper alloy selection. It highlights the metallurgical and mechanical properties; plating and processing technologies; and evaluation methods vital to the production of lead-free solders in electronics. A valuable resource for those interested in promoting environmentally-conscious electronic packaging practices! Responding to increasing environmental and health concerns over lead toxicity, Lead-Free Soldering in Electronics discusses: Soldering inspection and design Mechanical evaluation in electronics Lead-free solder paste and reflow soldering Wave soldering Plating lead-free soldering in electronics Lead-Free Soldering in Electronics will benefit manufacturing, electronics, and mechanical engineers, as well as undergraduate and graduate students in these disciplines.
Download or read book Electronic Packaging and Production written by and published by . This book was released on 1986 with total page 626 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Computers and the Environment Understanding and Managing their Impacts written by R. Kuehr and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 306 pages. Available in PDF, EPUB and Kindle. Book excerpt: Personal computers have made life convenient in many ways, but what about their impacts on the environment due to production, use and disposal? Manufacturing computers requires prodigious quantities of fossil fuels, toxic chemicals and water. Rapid improvements in performance mean we often buy a new machine every 1-3 years, which adds up to mountains of waste computers. How should societies respond to manage these environmental impacts? This volume addresses the environmental impacts and management of computers through a set of analyses on issues ranging from environmental assessment, technologies for recycling, consumer behaviour, strategies of computer manufacturing firms, and government policies. One conclusion is that extending the lifespan of computers (e.g. through reselling) is an environmentally and economically effective strategy that deserves more attention from governments, firms and the general public.
Download or read book Lead free Soldering Process Development and Reliability written by Jasbir Bath and published by John Wiley & Sons. This book was released on 2020-07-28 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.
Download or read book The Printed Circuit Assembler s Guide To Solder Defects written by Indium Corporation and published by . This book was released on 2021-11-12 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Solder defects in surface-mount technology (SMT) assembly have been an issue for decades. Further, the combined challenges of Pb-free soldering and ever-increasing miniaturization have resulted in new or exacerbated defects in electronics assembly, but there are proven ways to avoid defects. Indium Corporations' Christopher Nash and Dr. Ronald C. Lasky address six top defect topics, as well as how to avoid them, including (1) voiding in bottom-termination components, (2) graping, (3) head-in-pillow and non-wet opens, (4) tombstoning of passive components, (5) insufficients, and (6) solder balling and beading. This book will be especially beneficial to PCB assemblers in improving their assembly processes and the reliability of the end-product, eliminating field failures, and reducing costs.
Download or read book Lead Free Soldering written by Jasbir Bath and published by Springer Science & Business Media. This book was released on 2007-06-26 with total page 307 pages. Available in PDF, EPUB and Kindle. Book excerpt: The worldwide trend toward lead-free components and soldering is especially urgent in the European Union with the implementation strict new standards in July 2006, and with pending implementation of laws in China and California. This book provides a standard reference guide for engineers who must meet the new regulations, including a broad collection of techniques for lead-free soldering design and manufacture, which up to now have been scattered in difficult-to-find scholarly sources.
Download or read book Contracting for ABS written by Shakeel Bhatti and published by IUCN. This book was released on 2009 with total page 334 pages. Available in PDF, EPUB and Kindle. Book excerpt: Contracts relating to scientific/technical development are effective only where they are enforceable or valid under relevant law, can be practically implemented by the parties, and address matters arising from the relevant scientific/technical issues and practices. Negotiators are often hampered by their lack of knowledge of contract law and of the biotechnological techniques used to derive new molecules and genes or genetic or biochemical formulas from biological samples. This lack of knowledge means they may not make the best choices. This book examines the special issues in applying contract law to the rights to take and utilize genetic resources; and the scientific issues and the manner in which they affect the negotiation of ABS agreements.
Download or read book Beyond Access written by Morten Walløe Tvedt and published by IUCN. This book was released on 2007 with total page 172 pages. Available in PDF, EPUB and Kindle. Book excerpt: Fewer than 11% of CBD Parties have adopted substantive ABS law, and nearly all of these are developing countries, focusing almost entirely on the 'access' side of the equation. Most of the CBD's specific ABS obligations, however, relate to the other side of the equation-benefit sharing. This book considers the full range of ABS obligations, and how existing tools in user countries' national law can be used to achieve the CBD's third objective. It examines the laws of those user countries which have either declared that their ABS obligations are satisfied by existing national law, or have begun legislative development; the requirements, weaknesses and gaps in achieving benefit-sharing objectives; and the ways in which new or existing legal tools can be applied to these requirements.
Download or read book Lead Free Solder Process Development written by Gregory Henshall and published by John Wiley & Sons. This book was released on 2011-03-29 with total page 241 pages. Available in PDF, EPUB and Kindle. Book excerpt: Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distribution Examines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB) Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD) Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.
Download or read book Wireless Technologies written by Krzysztof Iniewski and published by CRC Press. This book was released on 2017-12-19 with total page 909 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced concepts for wireless technologies present a vision of technology that is embedded in our surroundings and practically invisible. From established radio techniques like GSM, 802.11 or Bluetooth to more emerging technologies, such as Ultra Wide Band and smart dust motes, a common denominator for future progress is the underlying integrated circuit technology. Wireless Technologies responds to the explosive growth of standard cellular radios and radically different wireless applications by presenting new architectural and circuit solutions engineers can use to solve modern design problems. This reference addresses state-of-the art CMOS design in the context of emerging wireless applications, including 3G/4G cellular telephony, wireless sensor networks, and wireless medical application. Written by top international experts specializing in both the IC industry and academia, this carefully edited work uncovers new design opportunities in body area networks, medical implants, satellite communications, automobile radar detection, and wearable electronics. The book is divided into three sections: wireless system perspectives, chip architecture and implementation issues, and devices and technologies used to fabricate wireless integrated circuits. Contributors address key issues in the development of future silicon-based systems, such as scale of integration, ultra-low power dissipation, and the integration of heterogeneous circuit design style and processes onto one substrate. Wireless sensor network systems are now being applied in critical applications in commerce, healthcare, and security. This reference, which contains 25 practical and scientifically rigorous articles, provides the knowledge communications engineers need to design innovative methodologies at the circuit and system level.
Download or read book Failure Modes and Mechanisms in Electronic Packages written by P. Singh and published by Springer Science & Business Media. This book was released on 1997-11-30 with total page 398 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.
Download or read book Practical Reliability Engineering written by Patrick O'Connor and published by Wiley. This book was released on 1997-02-24 with total page 72 pages. Available in PDF, EPUB and Kindle. Book excerpt: This classic textbook/reference contains a complete integration of the processes which influence quality and reliability in product specification, design, test, manufacture and support. Provides a step-by-step explanation of proven techniques for the development and production of reliable engineering equipment as well as details of the highly regarded work of Taguchi and Shainin. New to this edition: over 75 pages of self-assessment questions plus a revised bibliography and references. The book fulfills the requirements of the qualifying examinations in reliability engineering of the Institute of Quality Assurance, UK and the American Society of Quality Control.
