Download or read book Reliable Electronic Assembly Production written by Charles Eric Jowett and published by Random House Business. This book was released on 1970 with total page 224 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Design for Excellence in Electronics Manufacturing written by Cheryl Tulkoff and published by John Wiley & Sons. This book was released on 2021-03-22 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: An authoritative guide to optimizing design for manufacturability and reliability from a team of experts Design for Excellence in Electronics Manufacturing is a comprehensive, state-of-the-art book that covers design and reliability of electronics. The authors—noted experts on the topic—explain how using the DfX concepts of design for reliability, design for manufacturability, design for environment, design for testability, and more, reduce research and development costs and decrease time to market and allow companies to confidently issue warranty coverage. By employing the concepts outlined in Design for Excellence in Electronics Manufacturing, engineers and managers can increase customer satisfaction, market share, and long-term profits. In addition, the authors describe the best practices regarding product design and show how the practices can be adapted for different manufacturing processes, suppliers, use environments, and reliability expectations. This important book: Contains a comprehensive review of the design and reliability of electronics Covers a range of topics: establishing a reliability program, design for the use environment, design for manufacturability, and more Includes technical information on electronic packaging, discrete components, and assembly processes Shows how aspects of electronics can fail under different environmental stresses Written for reliability engineers, electronics engineers, design engineers, component engineers, and others, Design for Excellence in Electronics Manufacturing is a comprehensive book that reveals how to get product design right the first time.
Download or read book The Electronics Assembly Handbook written by Frank Riley and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 576 pages. Available in PDF, EPUB and Kindle. Book excerpt: The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in "Assembly Engineering" and "Electronic Packaging and Production", will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.
Download or read book Electronics Manufacturing Processes written by Thomas L. Landers and published by Pearson Education. This book was released on 1994 with total page 584 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume provides a comprehensive introduction to electronic technology, products, and manufacturing processes.Reviews principles of production and electronics fundamentals (electronic components, interconnections, printed wiring boards, soldering and solderability); explains automatic assembly (automation, leaded component insertion, and surface-mount device placement); discusses life-cycle engineering (design for assembly, quality and reliability, testability, and environmental stress screening); and explores manufacturing systems (facilities and materials handling, production and inventory control, production economics).For electrical or industrial engineers interested in electronics manufacturing.
Download or read book Practical Reliability Of Electronic Equipment And Products written by Eugene R. Hnatek and published by CRC Press. This book was released on 2002-10-25 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: Practical Reliability of Electronic Equipment and Products will help electrical, electronics, manufacturing, mechanical, systems design, and reliability engineers; electronics production managers; electronic circuit designers; and upper-level undergraduate and graduate students in these disciplines.
Download or read book Reliability of Electronic Components written by Titu I. Bajenescu and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 547 pages. Available in PDF, EPUB and Kindle. Book excerpt: This application-oriented professional book explains why components fail, addressing the needs of engineers who apply reliability principles in design, manufacture, testing and field service. A detailed index, a glossary, acronym lists, reliability dictionaries and a rich specific bibliography complete the book.
Download or read book Electronic Assembly Fabrication written by Charles A. Harper and published by McGraw Hill Professional. This book was released on 2002-04-10 with total page 692 pages. Available in PDF, EPUB and Kindle. Book excerpt: Printed circuit history and overview. Development and fabrication of IC chips. Packaging of IC chips. Printed circuit board fabrication.
Download or read book Assembly and Reliability of Lead Free Solder Joints written by John H. Lau and published by Springer Nature. This book was released on 2020-05-29 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
Download or read book Modeling and Simulation for Microelectronic Packaging Assembly written by Shen Liu and published by John Wiley & Sons. This book was released on 2011-05-17 with total page 586 pages. Available in PDF, EPUB and Kindle. Book excerpt: Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
Download or read book Manufacturing Challenges in Electronic Packaging written by Y.C. Lee and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 270 pages. Available in PDF, EPUB and Kindle. Book excerpt: About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.
Download or read book Electronics Process Technology written by Wilfried Sauer and published by Springer Science & Business Media. This book was released on 2007-04-21 with total page 493 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a systemized presentation of new techniques and methods in electronics manufacture. It helps the reader reduce the cost and increase the reliability of electronic products by employing up-to-date technology. It also details the latest ideas for reducing the scale of electronic components and products to the nano-scale by organizing all the elements of the complicated modern electronics manufacturing process showing how they affect each other.
Download or read book Contamination of Electronic Assemblies written by Elissa M. Bumiller and published by CRC Press. This book was released on 2002-11-12 with total page 236 pages. Available in PDF, EPUB and Kindle. Book excerpt: Contamination problems have become a major factor in determining the manufacturability, quality, and reliability of electronic assemblies. Understanding the mechanics and chemistry of contamination has become necessary for improving quality and reliability and reducing costs of electronic assemblies. Designed as a practical guide, Contamination of
Download or read book Troubleshooting Electronic Assembly written by Phil Zarrow and published by Pragma Media. This book was released on 2020-02-27 with total page 278 pages. Available in PDF, EPUB and Kindle. Book excerpt: BoardTalk had its humble beginnings as a SMT expert Q&A session with Phil Zarrow and Jim Hall at an SMTAI conference. Ten years and over 200 episodes later, the "Assembly Brothers - Pick and Place" have transcribed their informative discussions from CircuitInsight.com, where BoardTalk is streamed all over the world.
Download or read book Assembly Line Planning and Control written by Nick T. Thomopoulos and published by Springer Science & Business Media. This book was released on 2013-09-11 with total page 152 pages. Available in PDF, EPUB and Kindle. Book excerpt: Assembly Line Planning and Control describes the basic fundamentals of assembly lines for single model lines, mixed model make-to-stock lines, mixed model make-to-order lines and for one-station assembly. The book shows how to select the quantity of units to schedule for a shift duration, compute the number of operators needed on a line, set the conveyor speed, coordinate the main line with sub-assembly lines, assign the work elements to the operators on the line, sequence the models down the line, sequence the jobs down the line, calculate the part and component requirements for a line and for each station, determine the replenish needs of the parts and components from the suppliers, compute the similarity between the models being produced and show applications, use learning curves to estimate time and costs of assembly, and measure the efficiency of the line. The material is timeless and the book will never become obsolete. The author presents solutions with easy-to-understand numerical examples that can be applied to real-life applications.
Download or read book Linkages written by National Research Council and published by National Academies Press. This book was released on 2006-01-19 with total page 94 pages. Available in PDF, EPUB and Kindle. Book excerpt: Over the past two decades, the Department of Defense has been moving toward commercial-military integration for manufacturing, while at the same time, the printed circuit board industry has been moving steadily offshore. Today, many in DoD, the U.S. Congress, and the federal government lack a clear understanding of the importance of high-quality, trustworthy printed circuit boards (PrCBs) for properly functioning weapons and other defense systems and components. To help develop this understanding, DOD requested the NRC to identify and assess the key issues affecting PrCBs for military use. This report presents a discussion of how to ensure DOD's access to reliable printed circuits; an assessment of its vulnerability to the global printed circuit supply chain; and suggestions about ways to secure the design and manufacture of printed circuits. In addition, this report offers recommendations to help DoD (1) preserve existing systems' capabilities, (2) improve the military's access to currently available PrCBs, and (3) ensure access to future PrCB technology. The recommendations reflect the need to achieve these goals at reasonable cost and in concert with evolving environmental regulations.
Download or read book Circuit Design Laws written by V T Harikumar and published by Harikumar V T. This book was released on 2024-07 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Circuit Design Laws: A Handbook for Electronic Assembly" is an essential guide for anyone involved in the design, assembly, and production of electronic circuits. This comprehensive book serves as a one-stop resource, providing readers with a deep understanding of the fundamental principles, best practices, and industry standards related to circuit design and electronic assembly. The book begins with an introduction to the basic concepts of circuit design, including an overview of electronic components, circuit analysis, and common design techniques. It emphasizes the importance of adhering to design laws and industry standards to ensure the safety, functionality, and reliability of electronic assemblies. As readers navigate through the chapters, they will delve into the different types of circuit design laws and how they apply to specific aspects of electronic assembly. This includes laws pertaining to power distribution, signal integrity, electromagnetic compatibility (EMC), thermal management, and safety considerations. Each law is explained in detail, along with practical examples and case studies that illustrate their application in real-world scenarios. The handbook also covers essential topics such as component selection and placement, soldering techniques, trace routing guidelines, and manufacturing processes. It emphasizes the importance of design for manufacturability (DFM) and provides valuable insights on how to optimize circuit designs for efficient and cost-effective assembly. One of the key strengths of "Circuit Design Laws" is its practical approach. Throughout the book, readers will find step-by-step instructions, design checklists, and troubleshooting tips to help them apply these design laws effectively in their own projects. The book also includes a comprehensive set of design templates and tools that can be used as a starting point for various types of circuit designs. "Circuit Design Laws: A Handbook for Electronic Assembly" is not just a reference book but also a valuable tool for professionals and enthusiasts alike. With its clear explanations, practical examples, and comprehensive coverage of circuit design laws, this handbook empowers readers to create robust and reliable electronic assemblies that meet industry standards and perform optimally in their intended applications. By having this book by their side, designers, engineers, hobbyists, and students alike will be well-equipped to turn their circuit designs into successful, market-ready products while adhering to the essential laws and principles of electronic assembly.
Download or read book Solderless Assembly for Electronics written by Joseph Fjelstad and published by . This book was released on 2017-04 with total page 60 pages. Available in PDF, EPUB and Kindle. Book excerpt: Solder has been a loyal servant of the electronics manufacturing industry for years; however, like any aging servant, the efficacy of solder has been waning as the industry looks to make products increasingly dense. Solder has always been the weak link in the electronics manufacturing process, where a substantial number of defects are created and solder joints remain the most common site of failure in electronic systems. With that in mind, an alternative approach to manufacturing electronic assemblies without the use of solder is discussed in this short book. In most fundamental terms, the process is one where, instead of building PCBs and placing and soldering components to them, a component board is assembled and the terminations on the components are interconnected using traditional PCB processes and bypassing, completely, the high-temperature soldering process. The reader will be shown the numerous prospective advantages and benefits--economic, technical and environmental--of this important alternative approach, including rapid prototyping, which was first suggested 10 years ago and is just now beginning to be appreciated.
