Download or read book Reliability Physics Symposium 1983 21st Annual written by and published by . This book was released on 1983 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Reliability Physics 1983 written by Ariz.). International Reliability Physics Symposium (21st : 1983 : Phoenix and published by . This book was released on 1983 with total page 356 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Reliability Physics 21st Annual Proceedings 1983 Phoenix April 5 7 1983 written by Reliability Physics and published by . This book was released on with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book 21st annual proceedings reliability physics 1983 Phoenix Arizona April 5 6 7 1983 written by and published by . This book was released on 1983 with total page 356 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Reliability Physics 1983 written by D. L. Burgess and published by . This book was released on 1983 with total page 356 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Reliability physics 1983 written by and published by . This book was released on 1983 with total page 356 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Reliability Physics 1983 Proc of 21st Annual Symp Phoenix Arizona April 5 7 1983 written by Institute of Electrical and Electronics Engineers and published by . This book was released on 1983 with total page 356 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Reliability Assessments written by Franklin Richard Nash, Ph.D. and published by CRC Press. This book was released on 2017-07-12 with total page 784 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides engineers and scientists with a single source introduction to the concepts, models, and case studies for making credible reliability assessments. It satisfies the need for thorough discussions of several fundamental subjects. Section I contains a comprehensive overview of assessing and assuring reliability that is followed by discussions of: • Concept of randomness and its relationship to chaos • Uses and limitations of the binomial and Poisson distributions • Relationship of the chi-square method and Poisson curves • Derivations and applications of the exponential, Weibull, and lognormal models • Examination of the human mortality bathtub curve as a template for components Section II introduces the case study modeling of failure data and is followed by analyses of: • 5 sets of ideal Weibull, lognormal, and normal failure data • 83 sets of actual (real) failure data The intent of the modeling was to find the best descriptions of the failures using statistical life models, principally the Weibull, lognormal, and normal models, for characterizing the failure probability distributions of the times-, cycles-, and miles-to-failure during laboratory or field testing. The statistical model providing the preferred characterization was determined empirically by choosing the two-parameter model that gave the best straight-line fit in the failure probability plots using a combination of visual inspection and three statistical goodness-of-fit (GoF) tests. This book offers practical insight in dealing with single item reliability and illustrates the use of reliability methods to solve industry problems.

Download or read book Proceedings of Annual Reliability Physics written by and published by . This book was released on 1983 with total page 356 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Reliability Physics written by and published by . This book was released on 1983 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Reliability Physics 1983 written by and published by . This book was released on 1983 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book 21st Annual Proceedings Reliability Physics 1983 Phoenix Arizona written by and published by . This book was released on 1983 with total page 356 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Reliability and Failure of Electronic Materials and Devices written by Milton Ohring and published by Academic Press. This book was released on 2014-10-14 with total page 759 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites

Download or read book Proceedings of the Symposium on Electromigration of Metals and First International Symposium on Multilevel Metallization and Packaging written by James R. Lloyd and published by . This book was released on 1985 with total page 214 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Microelectronics Packaging Handbook written by R.R. Tummala and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 742 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Download or read book Reliability Physics written by IEEE Electron Devices Society and published by . This book was released on with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book 21st Annual Proceedings Reliability Physics 1983 written by and published by . This book was released on 1983 with total page 359 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electromigration, humidity dependence of IC, aluminium corrosion, semiconductor instabilities, CMOS latch-up analysis, defect analysis, device failure mechanisms, GaAs device reliability, VLSI package reliability.