Download or read book Reliability of High Temperature Electronics written by A. Christou and published by RIAC. This book was released on 1996 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book High Temperature Electronics written by F. Patrick McCluskey and published by CRC Press. This book was released on 2018-05-04 with total page 279 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Download or read book High Temperature Electronics written by Randall Kirschman and published by Wiley-IEEE Press. This book was released on 1998-09-01 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: "HIGH-TEMPERATURE ELECTRONICS provides expert coverage of the applications, characteristics, design, selection, and operation of electronic devices and circuits at temperatures above the conventional limit of 125 degrees Celsius. This edited volume contains approximately 100 key reprinted papers covering a wide range of topics related to high-temperature electronics, eight invited papers, extensive references, and a comprehensive bibliography. Containing more than 200 pages of new material, it brings the reader a well-rounded review of high-temperature electronics from its beginnings decades ago through the present and beyond to possible future technologies. The scope of HIGH TEMPERATURE ELECTRONICS includes active components from standard and advanced semiconductor materials, passive components, as well as technologies for metallizations, interconnections, and the assembly and packaging of electronic components. This book will provide active researchers, technology developers, managers, materials scientists, and advanced students with a sound fundamental grounding in high-temperature electronics technology." Sponsored by: IEEE Components, Packaging, and Manufacturing Technology Society.
Download or read book High Temperature Electronics Design for Aero Engine Controls and Health Monitoring written by Lucian Stoica and published by CRC Press. This book was released on 2022-09-01 with total page 161 pages. Available in PDF, EPUB and Kindle. Book excerpt: There is a growing desire to install electronic power and control systems in high temperature harsh environments to improve the accuracy of critical measurements, reduce the amount of cabling and to eliminate cooling systems. Typical target applications include electronics for energy exploration, power generation and control systems. Technical topics presented in this book include:• High temperature electronics market• High temperature devices, materials and assembly processes• Design, manufacture and testing of multi-sensor data acquisition system for aero-engine control• Future applications for high temperature electronicsHigh Temperature Electronics Design for Aero Engine Controls and Health Monitoring contains details of state of the art design and manufacture of electronics targeted towards a high temperature aero-engine application. High Temperature Electronics Design for Aero Engine Controls and Health Monitoring is ideal for design, manufacturing and test personnel in the aerospace and other harsh environment industries as well as academic staff and master/research students in electronics engineering, materials science and aerospace engineering.
Download or read book Influence of Temperature on Microelectronics and System Reliability written by Pradeep Lall and published by CRC Press. This book was released on 2020-07-09 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
Download or read book Low Temperature Electronics written by Edmundo A. Gutierrez-D. and published by Academic Press. This book was released on 2001 with total page 985 pages. Available in PDF, EPUB and Kindle. Book excerpt: Summarizes the advances in cryoelectronics starting from the fundamentals in physics and semiconductor devices to electronic systems, hybrid superconductor-semiconductor technologies, photonic devices, cryocoolers and thermal management. This book provides an exploration of the theory, research, and technologies related to cryoelectronics.
Download or read book Reliability and Failure of Electronic Materials and Devices written by Milton Ohring and published by Academic Press. This book was released on 2014-10-14 with total page 759 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Download or read book GaAs MMIC Reliability High Temperature Behavior written by Aris Christou and published by RIAC. This book was released on 2006 with total page 260 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Die Attach Materials for High Temperature Applications in Microelectronics Packaging written by Kim S. Siow and published by Springer. This book was released on 2019-01-29 with total page 279 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.
Download or read book High Temperature Electronics written by F. Patrick McCluskey and published by CRC Press. This book was released on 2018-05-04 with total page 341 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Download or read book Bias Temperature Instability for Devices and Circuits written by Tibor Grasser and published by Springer Science & Business Media. This book was released on 2013-10-22 with total page 805 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a single-source reference to one of the more challenging reliability issues plaguing modern semiconductor technologies, negative bias temperature instability. Readers will benefit from state-of-the art coverage of research in topics such as time dependent defect spectroscopy, anomalous defect behavior, stochastic modeling with additional metastable states, multiphonon theory, compact modeling with RC ladders and implications on device reliability and lifetime.
Download or read book 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems iTherm written by IEEE Staff and published by . This book was released on 2021-06 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems
Download or read book Materials for High Temperature Semiconductor Devices written by National Research Council and published by National Academies Press. This book was released on 1995-09-14 with total page 135 pages. Available in PDF, EPUB and Kindle. Book excerpt: Major benefits to system architecture would result if cooling systems for components could be eliminated without compromising performance. This book surveys the state-of-the-art for the three major wide bandgap materials (silicon carbide, nitrides, and diamond), assesses the national and international efforts to develop these materials, identifies the technical barriers to their development and manufacture, determines the criteria for successfully packaging and integrating these devices into existing systems, and recommends future research priorities.
Download or read book Reliability of Power Electronic Converter Systems written by Henry Shu-hung Chung and published by IET. This book was released on 2015-12-07 with total page 502 pages. Available in PDF, EPUB and Kindle. Book excerpt: The main aims of power electronic converter systems (PECS) are to control, convert, and condition electrical power flow from one form to another through the use of solid state electronics. This book outlines current research into the scientific modeling, experimentation, and remedial measures for advancing the reliability, availability, system robustness, and maintainability of PECS at different levels of complexity.
Download or read book Reliability of Electronic Components written by Titu I. Bajenescu and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 547 pages. Available in PDF, EPUB and Kindle. Book excerpt: This application-oriented professional book explains why components fail, addressing the needs of engineers who apply reliability principles in design, manufacture, testing and field service. A detailed index, a glossary, acronym lists, reliability dictionaries and a rich specific bibliography complete the book.
Download or read book High Temperature Electronics written by Magnus Willander and published by Springer. This book was released on 1997 with total page 346 pages. Available in PDF, EPUB and Kindle. Book excerpt: High Temperature Electronics covers a very active and topical area. This text reviews in detail the trends and options for electronic materials in high temperature environments. The contributors are leading authorities from several countries to provide an international appeal. After an introduction to the subject, users of these materials (e.g. aircraft and space, automotive, military and power industries) are considered. A discussion of silicon and gallium arsenide electronics is followed by an assessment of the future for electronic materials and devices.
Download or read book Extreme Environment Electronics written by John D. Cressler and published by CRC Press. This book was released on 2017-12-19 with total page 1044 pages. Available in PDF, EPUB and Kindle. Book excerpt: Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.
