Download or read book Recent Progress inSoldering Materials written by Ahmad Azmin Mohamad and published by BoD – Books on Demand. This book was released on 2017-11-29 with total page 120 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is about solders and their composition and focuses on material characterizations and the methods used to make alloys and determine their structures, physical properties and applications. Physical properties and the factors that control them and theoretical verification are the main contents of this book. Corrosion of solders is included in the coverage of the properties related to solder composition and mechanical properties.
Download or read book Recent Progress in Lead Free Solder Technology written by Mohd Arif Anuar Mohd Salleh and published by Springer Nature. This book was released on 2022-03-01 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.
Download or read book Solders and Soldering written by Howard H. Manko and published by McGraw Hill Professional. This book was released on 2001-03-01 with total page 546 pages. Available in PDF, EPUB and Kindle. Book excerpt: Get the latest developments in solder technology You can't work in electronics without solder -- and you shouldn’t work with solder without Solders and Soldering, Fourth Edition. Profusely illustrated, this book by the world's top solder educator has been the leader in its field for two decades. You’ll learn 29 different methods for soldering and heating (for both automatic and manual procedures), and learn about the strengths and weaknesses of each method for varying applications. This up-to-date edition deals at length with modern cleaning materials and processes, emphasizing EPA and OSHA guidelines and regulations, and provides you with state-of-the-art techniques for soldering with miniaturized circuit boards.
Download or read book Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium written by Mohd Arif Anuar Mohd Salleh and published by Springer Nature. This book was released on 2023-07-02 with total page 873 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.
Download or read book Solder Materials written by Lin Kwang-lung and published by World Scientific. This book was released on 2001-06-21 with total page 388 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive overview of important aspects of solder materials including solderability and soldering reaction, physical metallurgy, mechanical properties, electromigration, and reliability of solder joint. The scope of this book covers mainly, but not limited to, the important research achievements of all the subjects having been disclosed and discussed in the literatures. It is a very informative book for those who are interested in learning the material properties of solders, carrying out fundamental research, and in carrying out practical applications. This book is an important resource for the various important subjects relating to solder materials.
Download or read book Recent Progress in Flow Control for Practical Flows written by Piotr Doerffer and published by Springer. This book was released on 2017-05-11 with total page 505 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explores the outcomes on flow control research activities carried out within the framework of two EU-funded projects focused on training-through-research of Marie Sklodowska-Curie doctoral students. The main goal of the projects described in this monograph is to assess the potential of the passive- and active-flow control methods for reduction of fuel consumption by a helicopter. The research scope encompasses the fields of structural dynamics, fluid flow dynamics, and actuators with control. Research featured in this volume demonstrates an experimental and numerical approach with a strong emphasis on the verification and validation of numerical models. The book is ideal for engineers, students, and researchers interested in the multidisciplinary field of flow control.
Download or read book Joining Processes for Dissimilar and Advanced Materials written by Pawan Kumar Rakesh and published by Woodhead Publishing. This book was released on 2021-11-13 with total page 692 pages. Available in PDF, EPUB and Kindle. Book excerpt: Joining Processes for Dissimilar and Advanced Materials describes how to overcome the many challenges involved in the joining of similar and dissimilar materials resulting from factors including different thermal coefficients and melting points. Traditional joining processes are ineffective with many newly developed materials. The ever-increasing industrial demands for production efficiency and high-performance materials are also pushing this technology forward. The resulting emergence of advanced micro- and nanoscale material joining technologies, have provided many solutions to these challenges. Drawing on the latest research, this book describes primary and secondary processes for the joining of advanced materials such as metals and alloys, intermetallics, ceramics, glasses, polymers, superalloys, electronic materials and composites in similar and dissimilar combinations. It also covers details of joint design, quality assurance, economics and service life of the product. Provides valuable information on innovative joining technologies including induction heating of metals, ultrasonic heating, and laser heating at micro- and nanoscale levels Describes the newly developed modelling, simulation and digitalization of the joining process Includes a methodology for characterization of joints
Download or read book Recent Advances in Solderability of Ceramic and Metallic Materials with Application of Active Solders and Power Ultrasound written by Roman Koleňák and published by . This book was released on 2017 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The Chapter deals with solderability of ceramic materials by ultrasound and suitable selection of soldering alloy. The solderability issue of ceramic materials consists mainly in the fact that the ceramic materials are not wettable by the common solders, due to their ionic and covalent bond between the atoms. However, there exist several ways to ensure the wettability of ceramic material surface. One of them is for example coating of ceramic material by a metallic layer. Anyway, a more perspective solution seems to be the application of soldering alloys which are alloyed with a small amount of alloying elements which exert high affinity to some component of ceramic material. The basic group of such solders are the so-called active solders containing from 1 to 5 wt. % Ti. Another group of solders, which may wet the ceramic material, are the solders alloyed with a small amount of lanthanides, for example La, Ce et cetera The content of lanthanides varies from 0.5 up to 2 wt. %. The last group consists of the solders containing indium in the amount from 20 to 100 wt. %. The aim of study was to compare these three groups of soldering alloys from the viewpoint of mechanism of bond formation. The interactions between the solder and ceramic substrate were analysed and shear strength of fabricated soldered joint was determined. To improve the solderability, the soldering in combination with an active power ultrasound was also employed.
Download or read book Green and Sustainable Manufacturing of Advanced Material written by Mrityunjay Singh and published by Elsevier. This book was released on 2015-08-18 with total page 708 pages. Available in PDF, EPUB and Kindle. Book excerpt: Sustainable development is a globally recognized mandate and it includes green or environment-friendly manufacturing practices. Such practices orchestrate with the self-healing and self-replenishing capability of natural ecosystems. Green manufacturing encompasses synthesis, processing, fabrication, and process optimization, but also testing, performance evaluation and reliability. The book shall serve as a comprehensive and authoritative resource on sustainable manufacturing of ceramics, metals and their composites. It is designed to capture the diversity and unity of methods and approaches to materials processing, manufacturing, testing and evaluation across disciplines and length scales. Each chapter incorporates in-depth technical information without compromising the delicate link between factual data and fundamental concepts or between theory and practice. Green and sustainable materials processing and manufacturing is designed as a key enabler of sustainable development. A one-stop compendium of new research and technology of green manufacturing of metals, ceramics and their composites In-depth cutting-edge treatment of synthesis, processing, fabrication, process optimization, testing, performance evaluation and reliability which are of critical importance to green manufacturing Stimulates fresh thinking and exchange of ideas and information on approaches to green materials processing across disciplines
Download or read book Solders and Soldering written by Howard H. Manko and published by McGraw-Hill Companies. This book was released on 1979 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: Get the latest developments in solder technology You can't work in electronics without solder -- and you shouldn't work with solder without Solders and Soldering, Fourth Edition. Profusely illustrated, this book by the world's top solder educator has been the leader in its field for two decades. You'll learn 29 different methods for soldering and heating (for both automatic and manual procedures), and learn about the strengths and weaknesses of each method for varying applications. This up-to-date edition deals at length with modern cleaning materials and processes, emphasizing EPA and OSHA guidelines and regulations, and provides you with state-of-the-art techniques for soldering with miniaturized circuit boards.
Download or read book Recent Advances in Manufacturing Processes and Systems written by Harshit K. Dave and published by Springer Nature. This book was released on 2022-03-03 with total page 1006 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents select proceedings of 2nd International Conference on Recent Advances in Manufacturing (RAM 2021). The book provides insights into the current research trends and development in manufacturing processes. The topics covered include conventional and nonconventional manufacturing processes, micro and nano manufacturing processes, chemical and biochemical manufacturing, additive manufacturing, smart manufacturing, and sustainable and energy-efficient manufacturing. The contributions presented here are intended to stimulate new research directions in the manufacturing domain. This book will be useful for the beginners, researchers and professionals working in the area of industrial and production engineering and allied fields.
Download or read book Solder Joint Reliability written by John H. Lau and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 649 pages. Available in PDF, EPUB and Kindle. Book excerpt: Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.
Download or read book Recent Advances in Civil Engineering written by Pala Gireesh Kumar and published by Springer Nature. This book was released on 2022-05-13 with total page 615 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book presents the select proceedings of the 2nd International Conference on Sustainable Construction Technologies and Advancements in Civil Engineering (ScTACE 2021). This book discusses the latest developments and contributions towards sustainable construction technologies and advances in civil engineering. Various topics covered in this book are construction technologies, geotechnical engineering, transportation and traffic engineering, structural engineering, environmental engineering, remote sensing and GIS, geo-environmental engineering, water resources engineering and earthquake engineering. This book will be useful for students, researchers and professionals working in the area of civil engineering.
Download or read book Semiconductor Nanocrystals and Metal Nanoparticles written by Tupei Chen and published by CRC Press. This book was released on 2016-10-14 with total page 526 pages. Available in PDF, EPUB and Kindle. Book excerpt: Semiconductor nanocrystals and metal nanoparticles are the building blocks of the next generation of electronic, optoelectronic, and photonic devices. Covering this rapidly developing and interdisciplinary field, the book examines in detail the physical properties and device applications of semiconductor nanocrystals and metal nanoparticles. It begins with a review of the synthesis and characterization of various semiconductor nanocrystals and metal nanoparticles and goes on to discuss in detail their optical, light emission, and electrical properties. It then illustrates some exciting applications of nanoelectronic devices (memristors and single-electron devices) and optoelectronic devices (UV detectors, quantum dot lasers, and solar cells), as well as other applications (gas sensors and metallic nanopastes for power electronics packaging). Focuses on a new class of materials that exhibit fascinating physical properties and have many exciting device applications. Presents an overview of synthesis strategies and characterization techniques for various semiconductor nanocrystal and metal nanoparticles. Examines in detail the optical/optoelectronic properties, light emission properties, and electrical properties of semiconductor nanocrystals and metal nanoparticles. Reviews applications in nanoelectronic devices, optoelectronic devices, and photonic devices.
Download or read book Soldering Materials and Process Developments written by M. Warwick and published by . This book was released on 1995 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Materials Methods written by and published by . This book was released on 1949 with total page 976 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Modern Solder Technology for Competitive Electronics Manufacturing written by Jennie S. Hwang and published by McGraw Hill Professional. This book was released on 1996 with total page 678 pages. Available in PDF, EPUB and Kindle. Book excerpt: Introduction Advanced Surface Mount Technology and Die Attach Techniques Solder Material Soldering Chemistry Solderability Microstructure of Solders Aqueous-Cleaning Manufacture No-Clean Manufacture Protective and Reactive Atmosphere Soldering Surface Mount Fine Pitch Technology Surface Mount-BGA/PAC Technology Soldering Methodology and Equipment Soldering and Soldering Related Issues Strengthened Solders Lead-Free Solders Solder Joint Failure Mode Solder Joint Failure Assessment-Case Studies Solder Joint Quality and Reliability New and Emerging Specifications and Standards Future Trends.
