Download or read book Rapid Thermal Processing written by Thomas O. Sedgwick and published by Cambridge University Press. This book was released on 2014-06-05 with total page 502 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Download or read book Rapid Thermal and Laser Processing written by Dim-Lee Kwong and published by . This book was released on 1993 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Reduced Thermal Processing for ULSI written by R.A. Levy and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 444 pages. Available in PDF, EPUB and Kindle. Book excerpt: As feature dimensions of integrated circuits shrink, the associated geometrical constraints on junction depth impose severe restrictions on the thermal budget for processing such devices. Furthermore, due to the relatively low melting point of the first aluminum metallization level, such restrictions extend to the fabrication of multilevel structures that are now essential in increasing packing density of interconnect lines. The fabrication of ultra large scale integrated (ULSI) devices under thermal budget restrictions requires the reassessment of existing and the development of new microelectronic materials and processes. This book addresses three broad but interrelated areas. The first area focuses on the subject of rapid thermal processing (RTP), a technology that allows minimization of processing time while relaxing the constraints on high temperature. Initially developed to limit dopant redistribution, current applications of RTP are shown here to encompass annealing, oxidation, nitridation, silicidation, glass reflow, and contact sintering. In a second but complementary area, advances in equipment design and performance of rapid thermal processing equipment are presented in conjunction with associated issues of temperature measurement and control. Defect mechanisms are assessed together with the resulting properties of rapidly deposited and processed films. The concept of RTP integration for a full CMOS device process is also examined together with its impact on device characteristics.

Download or read book Materials Research Society Symposia Proceedings Volume 52 Rapid Thermal Processing Held in Boston Massachusetts on 2 4 December 1985 written by Thomas O. Sedgwick and published by . This book was released on 1986 with total page 497 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Symposium on Rapid Thermal Processing (RTP) was dominated by discussion on silicon and silicon transistor technology with its host of associated materials: oxides, nitrides, silicides and reflow glasses. The session on compound semiconductors was dominated by GaAs and related III-V materials. Rapid annealing has now grown to include processes with reactive gases. This includes rather extensive studies of the oxidation of silicon and the nitridation of oxides. Now, RTP has been used to grow epitaxial silicon. This technique may herald the introduction of RTP 'style' processing equipment to carry out a wide range of semiconductor fabrication steps. As the move toward larger wafer sizes continues and if single-wafer-processing becomes pervasive, it is likely that many device fabrication steps will be carried out in equipment of the RTP-type. RTP can minimize thermal cycle, provide rapid process turn around and is single-wafer-processing compatible.

Download or read book Rapid Thermal Processing of Electronic Materials Volume 92 written by Syd R. Wilson and published by . This book was released on 1987-10 with total page 522 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Download or read book Rapid Thermal and Integrated Processing written by Mehrdad M. Moslehi and published by . This book was released on 1992 with total page 226 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Rapid Isothermal Processing written by Rajendra Singh and published by . This book was released on 1990 with total page 218 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Rapid Thermal Processing written by Richard B. Fair and published by Academic Press. This book was released on 2012-12-02 with total page 441 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the first definitive book on rapid thermal processing (RTP), an essential namufacturing technology for single-wafer processing in highly controlled environments. Written and edited by nine experts in the field, this book covers a range of topics for academics and engineers alike, moving from basic theory to advanced technology for wafer manufacturing. The book also provides new information on the suitability or RTP for thin film deposition, junction formation, silicides, epitaxy, and in situ processing. Complete discussions on equipment designs and comparisons between RTP and other processing approaches also make this book useful for supplemental information on silicon processing, VLSI processing, and integrated circuit engineering.

Download or read book ULSI Science and Technology 1989 written by C. M. Osburn and published by . This book was released on 1989 with total page 804 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Reference Data for Engineers written by Mac E. Van Valkenburg and published by Elsevier. This book was released on 2001-10-19 with total page 1689 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reference Data for Engineers is the most respected, reliable, and indispensable reference tool for technical professionals around the globe. Written by professionals for professionals, this book is a complete reference for engineers, covering a broad range of topics. It is the combined effort of 96 engineers, scientists, educators, and other recognized specialists in the fields of electronics, radio, computer, and communications technology. By providing an abundance of information on essential, need-to-know topics without heavy emphasis on complicated mathematics, Reference Data for Engineers is an absolute "must-have" for every engineer who requires comprehensive electrical, electronics, and communications data at his or her fingertips. Featured in the Ninth Edition is updated coverage on intellectual property and patents, probability and design, antennas, power electronics, rectifiers, power supplies, and properties of materials. Useful information on units, constants and conversion factors, active filter design, antennas, integrated circuits, surface acoustic wave design, and digital signal processing is also included. The Ninth Edition also offers new knowledge in the fields of satellite technology, space communication, microwave science, telecommunication, global positioning systems, frequency data, and radar. * Widely acclaimed as the most practical reference ever published for a wide range of electronics and computer professionals, from technicians through post-graduate engineers. * Provides a great way to learn or review the basics of various technologies, with a minimum of tables, equations, and other heavy math.

Download or read book Advances in Rapid Thermal Processing written by Fred Roozeboom and published by The Electrochemical Society. This book was released on 1999 with total page 470 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Defects in Semiconductors written by and published by Academic Press. This book was released on 2015-06-08 with total page 458 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume, number 91 in the Semiconductor and Semimetals series, focuses on defects in semiconductors. Defects in semiconductors help to explain several phenomena, from diffusion to getter, and to draw theories on materials' behavior in response to electrical or mechanical fields. The volume includes chapters focusing specifically on electron and proton irradiation of silicon, point defects in zinc oxide and gallium nitride, ion implantation defects and shallow junctions in silicon and germanium, and much more. It will help support students and scientists in their experimental and theoretical paths. Expert contributors Reviews of the most important recent literature Clear illustrations A broad view, including examination of defects in different semiconductors

Download or read book 16th Annual Conference on Composites and Advanced Ceramic Materials Part 2 of 2 Volume 13 Issue 9 10 written by John B. Wachtman and published by John Wiley & Sons. This book was released on 2009-09-28 with total page 542 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume is part of the Ceramic Engineering and Science Proceeding (CESP) series. This series contains a collection of papers dealing with issues in both traditional ceramics (i.e., glass, whitewares, refractories, and porcelain enamel) and advanced ceramics. Topics covered in the area of advanced ceramic include bioceramics, nanomaterials, composites, solid oxide fuel cells, mechanical properties and structural design, advanced ceramic coatings, ceramic armor, porous ceramics, and more.

Download or read book Microelectronic Materials and Processes written by R.A. Levy and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 992 pages. Available in PDF, EPUB and Kindle. Book excerpt: The primary thrust of very large scale integration (VLS!) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron range has now been made possible by the introduction of innovative circuit designs and the development of new microelectronic materials and processes. This book addresses the latter challenge by assessing the current status of the science and technology associated with the production of VLSI silicon circuits. It represents the cumulative effort of experts from academia and industry who have come together to blend their expertise into a tutorial overview and cohesive update of this rapidly expanding field. A balance of fundamental and applied contributions cover the basics of microelectronics materials and process engineering. Subjects in materials science include silicon, silicides, resists, dielectrics, and interconnect metallization. Subjects in process engineering include crystal growth, epitaxy, oxidation, thin film deposition, fine-line lithography, dry etching, ion implantation, and diffusion. Other related topics such as process simulation, defects phenomena, and diagnostic techniques are also included. This book is the result of a NATO-sponsored Advanced Study Institute (AS!) held in Castelvecchio Pascoli, Italy. Invited speakers at this institute provided manuscripts which were edited, updated, and integrated with other contributions solicited from non-participants to this AS!.

Download or read book Rapid Thermal Processing of Semiconductors written by Victor E. Borisenko and published by Springer Science & Business Media. This book was released on 2013-11-22 with total page 374 pages. Available in PDF, EPUB and Kindle. Book excerpt: Rapid thermal processing has contributed to the development of single wafer cluster processing tools and other innovations in integrated circuit manufacturing environments. Borisenko and Hesketh review theoretical and experimental progress in the field, discussing a wide range of materials, processes, and conditions. They thoroughly cover the work of international investigators in the field.

Download or read book Rapid Thermal and Integrated Processing V Volume 429 written by J. C. Gelpey and published by . This book was released on 1996-10-14 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is the latest in a continuing series on rapid thermal processing and related topics. It embraces a diversity of research, development and manufacturing activities that require rapid thermal and integrated processing techniques which are recognized by their acronyms, such as rapid thermal annealing (RTA), rapid thermal processing (RTP), rapid thermal chemical vapor deposition (RTCVP), rapid thermal oxidation (RTO), and others. This fifth anniversary volume reports notable advances in the use of rapid thermal techniques in processing science and technology, and for process control in industrial fabrication facilities. It is organized around progress obtained through: evaluation methodology; equipment and process modelling; temperature control; defects and diffusion associated with annealing; metallizations such as silicidation; novel processing of sol-gel and magnetic films; dielectric growth and deposition; and silicon or silicon-germanium film deposition.

Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2017-12-19 with total page 1720 pages. Available in PDF, EPUB and Kindle. Book excerpt: Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.