Download or read book Rapid Thermal and Laser Processing written by Dim-Lee Kwong and published by . This book was released on 1993 with total page 167 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Rapid Thermal and Laser Processing written by and published by . This book was released on 1993 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Rapid Thermal and Laser Processing written by Dim-Lee Kwong and published by . This book was released on 1992 with total page 167 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Rapid Thermal and Laser Processing written by Dim-Lee Kwong and published by . This book was released on 1993 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Rapid Thermal Processing and beyond Applications in Semiconductor Processing written by Wielfried Lerch and published by Trans Tech Publications Ltd. This book was released on 2008-03-24 with total page 448 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heat-treatment and thermal annealing are very common processing steps which have been employed during semiconductor manufacturing right from the beginning of integrated circuit technology. In order to minimize undesired diffusion, and other thermal budget-dependent effects, the trend has been to reduce the annealing time sharply by switching from standard furnace batch-processing (involving several hours or even days), to rapid thermal processing involving soaking times of just a few seconds. This transition from thermal equilibrium, to highly non-equilibrium, processing was very challenging and is still a field ripe for further development.
Download or read book Rapid Thermal and Other Short time Processing Technologies II written by Dim-Lee Kwong and published by The Electrochemical Society. This book was released on 2001 with total page 458 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Electronics, Dielectric Science and Technology, and High Temperature Materials Divisions."
Download or read book Advances in Rapid Thermal and Integrated Processing written by F. Roozeboom and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 568 pages. Available in PDF, EPUB and Kindle. Book excerpt: Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.
Download or read book Rapid Thermal Processing for Future Semiconductor Devices written by H. Fukuda and published by Elsevier. This book was released on 2003-04-02 with total page 161 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume is a collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. This symposium is second conference followed the previous successful first International RTP conference held at Hokkaido in 1997. The RTP 2001 covered the latest developments in RTP and other short-time processing continuously aiming to point out the future direction in the Silicon ULSI devices and II-VI, III-V compound semiconductor devices.This book covers the following areas: advanced MOS gate stack, integration technologies, advancd channel engineering including shallow junction, SiGe, hetero-structure, novel metallization, inter-connect, silicidation, low-k materials, thin dielectrics including gate dielectrics and high-k materials, thin film deposition including SiGe, SOI and SiC, process and device modelling, Laser-assisted crystallization and TFT device fabrication technologies, temperature monitoring and slip-free technologies.
Download or read book Rapid Thermal Processing of Semiconductors written by Victor E. Borisenko and published by Springer Science & Business Media. This book was released on 2013-11-22 with total page 374 pages. Available in PDF, EPUB and Kindle. Book excerpt: Rapid thermal processing has contributed to the development of single wafer cluster processing tools and other innovations in integrated circuit manufacturing environments. Borisenko and Hesketh review theoretical and experimental progress in the field, discussing a wide range of materials, processes, and conditions. They thoroughly cover the work of international investigators in the field.
Download or read book Rapid Thermal Processing written by Richard B. Fair and published by Academic Press. This book was released on 2012-12-02 with total page 441 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the first definitive book on rapid thermal processing (RTP), an essential namufacturing technology for single-wafer processing in highly controlled environments. Written and edited by nine experts in the field, this book covers a range of topics for academics and engineers alike, moving from basic theory to advanced technology for wafer manufacturing. The book also provides new information on the suitability or RTP for thin film deposition, junction formation, silicides, epitaxy, and in situ processing. Complete discussions on equipment designs and comparisons between RTP and other processing approaches also make this book useful for supplemental information on silicon processing, VLSI processing, and integrated circuit engineering.
Download or read book Rapid Thermal and Other Short time Processing Technologies written by Fred Roozeboom and published by The Electrochemical Society. This book was released on 2000 with total page 482 pages. Available in PDF, EPUB and Kindle. Book excerpt: The proceedings from this May 2000 symposium illustrate the range of applications in Rapid Thermal Processing (RTP). The refereed papers cover a variety of issues, such as ultra-shallow junctions; contacts for nanoscale CMOS; gate stacks; new applications of RTP, such as for the enhanced crystalization of amorphous silicon thin films; and advances on RTP systems and process monitoring, including optimizing and controlling gas flows in an RTCVD reactor. Most presentations are supported by charts and other graphical data. c. Book News Inc.
Download or read book Laser Materials Processing written by Michael Bass and published by Elsevier. This book was released on 2012-12-02 with total page 491 pages. Available in PDF, EPUB and Kindle. Book excerpt: Laser Materials Processing aims to introduce lasers and laser systems to the newcomers to laser terminology and to provide enough background material on lasers to reduce one's hesitation to employ these devices. The book covers the use of lasers in materials processing, including its application in cutting and welding, as well as the principles behind them; laser heat treatment; rapid solidification laser processing at high power density; shaping of materials using lasers; and laser processing of semiconductors. The selection also covers considerations in laser manufacturing and a survey in laser applications. The text is recommended for both experienced laser users, engineers, or scientists yet unfamiliar with the subject. The book is also recommended for those who wish to know about the importance of lasers in the field of materials processing, as the bulk of the book is devoted to the discussions of some of the most important materials processing activities in use or under development.
Download or read book Rapid Thermal and Other Short time Processing Technologies III written by Paul J. Timans and published by The Electrochemical Society. This book was released on 2002 with total page 500 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Rapid Thermal and Integrated Processing written by and published by . This book was released on 1998 with total page 914 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Rapid Thermal and Integrated Processing written by and published by . This book was released on 1996 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Rapid Thermal and Related Processing Techniques written by Rajendra Singh and published by . This book was released on 1991 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reduced Thermal Processing for ULSI written by R.A. Levy and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 444 pages. Available in PDF, EPUB and Kindle. Book excerpt: As feature dimensions of integrated circuits shrink, the associated geometrical constraints on junction depth impose severe restrictions on the thermal budget for processing such devices. Furthermore, due to the relatively low melting point of the first aluminum metallization level, such restrictions extend to the fabrication of multilevel structures that are now essential in increasing packing density of interconnect lines. The fabrication of ultra large scale integrated (ULSI) devices under thermal budget restrictions requires the reassessment of existing and the development of new microelectronic materials and processes. This book addresses three broad but interrelated areas. The first area focuses on the subject of rapid thermal processing (RTP), a technology that allows minimization of processing time while relaxing the constraints on high temperature. Initially developed to limit dopant redistribution, current applications of RTP are shown here to encompass annealing, oxidation, nitridation, silicidation, glass reflow, and contact sintering. In a second but complementary area, advances in equipment design and performance of rapid thermal processing equipment are presented in conjunction with associated issues of temperature measurement and control. Defect mechanisms are assessed together with the resulting properties of rapidly deposited and processed films. The concept of RTP integration for a full CMOS device process is also examined together with its impact on device characteristics.
