Download or read book Process Induced Particulate Generation and Deposition During Reactive Ion Etching of SiO2 written by Paul James Resnick and published by . This book was released on 1991 with total page 212 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book In Situ Particle Generation During Reactive Ion Etching of SiO Sub 2 written by and published by . This book was released on 1992 with total page 8 pages. Available in PDF, EPUB and Kindle. Book excerpt: Particulate contamination during IC fabrication is generally acknowledged as a major contributor to yield loss. In particular, plasma processes have the potential for generating copious quantities of process induced particulates. Ideally, in order to effectively control process generated particulate contamination, a fundamental understanding of the particulate generation and transport is essential. Although a considerable amount of effort has been expended to study particles in laboratory apparatus, only a limited amount of work has been performed in production line equipment with production processes. In these experiments, a Drytek Quad Model 480 single wafer etcher was used to etch blanket thermal SiO2 films on 150 mm substrates in fluorocarbon discharges. The effects of rf power, reactor pressure, and feed gas composition on particle production rates were evaluated. Particles were measured using an HYT downstream particle flux monitor. Surface particle deposition was measured using a Tencor Surfscan 4500, as well as advanced ex situ techniques. Particle morphology and composition were also determined ex situ. Response surface methodology was utilized to determine the process conditions under which particle generation was most pronounced. The use of in situ and ex situ techniques has provided some insight into the mechanisms involved for particle generation and particle dynamics within the plasma during oxide etching.

Download or read book A Study of Particle Generation in Sputtering and Reactive Ion Etching of Silicon and Silicon Dioxide written by Won Jong Yoo and published by . This book was released on 1993 with total page 258 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Energy Research Abstracts written by and published by . This book was released on 1992-10 with total page 508 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Reactive Ion Etching of PECVD Silicon Dioxide SiO2 Layer for MEMS Application written by and published by . This book was released on 2004 with total page 23 pages. Available in PDF, EPUB and Kindle. Book excerpt: A reactive ion etching (RIE) process has been developed to etch up to 1-micrometer (1 m) layer of low stress SiO2 (Silicon Dioxide) Plasma Enhanced Chemical Vapor Deposition (PECVD) film compatible for MEMS research applications. Etch rates from as low as 123 nm/min at 100 W to as high as 721 nm/min at 900 W powers were demonstrated using fluorocarbon (CF4) reactive gas plasma. RIE selectivity (SiO2/PR-Photoresist was 3:1 at 900W. The measured thickness variation was 0.13 m on 4-inch substrate for 1 m thick SiO2 film.

Download or read book Plasma Processing of Materials written by National Research Council and published by National Academies Press. This book was released on 1991-02-01 with total page 88 pages. Available in PDF, EPUB and Kindle. Book excerpt: Plasma processing of materials is a critical technology to several of the largest manufacturing industries in the worldâ€"electronics, aerospace, automotive, steel, biomedical, and toxic waste management. This book describes the relationship between plasma processes and the many industrial applications, examines in detail plasma processing in the electronics industry, highlights the scientific foundation underlying this technology, and discusses education issues in this multidisciplinary field. The committee recommends a coordinated, focused, and well-funded research program in this area that involves the university, federal laboratory, and industrial sectors of the community. It also points out that because plasma processing is an integral part of the infrastructure of so many American industries, it is important for both the economy and the national security that America maintain a strong leadership role in this technology.

Download or read book Atomic Layer Deposition of Nanostructured Materials written by Nicola Pinna and published by John Wiley & Sons. This book was released on 2012-09-19 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt: Atomic layer deposition, formerly called atomic layer epitaxy, was developed in the 1970s to meet the needs of producing high-quality, large-area fl at displays with perfect structure and process controllability. Nowadays, creating nanomaterials and producing nanostructures with structural perfection is an important goal for many applications in nanotechnology. As ALD is one of the important techniques which offers good control over the surface structures created, it is more and more in the focus of scientists. The book is structured in such a way to fi t both the need of the expert reader (due to the systematic presentation of the results at the forefront of the technique and their applications) and the ones of students and newcomers to the fi eld (through the first part detailing the basic aspects of the technique). This book is a must-have for all Materials Scientists, Surface Chemists, Physicists, and Scientists in the Semiconductor Industry.

Download or read book Crucial Issues in Semiconductor Materials and Processing Technologies written by S. Coffa and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 523 pages. Available in PDF, EPUB and Kindle. Book excerpt: Semiconductors lie at the heart of some of the most important industries and technologies of the twentieth century. The complexity of silicon integrated circuits is increasing considerably because of the continuous dimensional shrinkage to improve efficiency and functionality. This evolution in design rules poses real challenges for the materials scientists and processing engineers. Materials, defects and processing now have to be understood in their totality. World experts discuss, in this volume, the crucial issues facing lithography, ion implication and plasma processing, metallization and insulating layer quality, and crystal growth. Particular emphasis is placed upon silicon, but compound semiconductors and photonic materials are also highlighted. The fundamental concepts of phase stability, interfaces and defects play a key role in understanding these crucial issues. These concepts are reviewed in a crucial fashion.

Download or read book Dry Etching Technology for Semiconductors written by Kazuo Nojiri and published by Springer. This book was released on 2014-10-25 with total page 126 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc.

Download or read book JJAP written by and published by . This book was released on 1998 with total page 932 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Japanese Journal of Applied Physics written by and published by . This book was released on 2005 with total page 1176 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Dry Etching for VLSI written by A.J. van Roosmalen and published by Springer Science & Business Media. This book was released on 1991-03-31 with total page 260 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book has been written as part of a series of scientific books being published by Plenum Press. The scope of the series is to review a chosen topic in each volume. To supplement this information, the abstracts to the most important references cited in the text are reprinted, thus allowing the reader to find in-depth material without having to refer to many additional publications. This volume is dedicated to the field of dry (plasma) etching, as applied in silicon semiconductor processing. Although a number of books have appeared dealing with this area of physics and chemistry, these all deal with parts of the field. This book is unique in that it gives a compact, yet complete, in-depth overview of fundamentals, systems, processes, tools, and applications of etching with gas plasmas for VLSI. Examples are given throughout the fundamental sections, in order to give the reader a better insight in the meaning and magnitude of the many parameters relevant to dry etching. Electrical engineering concepts are emphasized to explain the pros and cons of reactor concepts and excitation frequency ranges. In the description of practical applications, extensive use is made of cross-referencing between processes and materials, as well as theory and practice. It is thus intended to provide a total model for understanding dry etching. The book has been written such that no previous knowledge of the subject is required. It is intended as a review of all aspects of dry etching for silicon semiconductor processing.

Download or read book Thin Film Processes II written by John L. Vossen and published by Gulf Professional Publishing. This book was released on 1991 with total page 892 pages. Available in PDF, EPUB and Kindle. Book excerpt: This sequel to an earlier work offers an exposition of important thin film deposition and etching processes. It is intended to be of use to both the beginner in any particular process and to the experienced user wishing a wider perspective. Information is presented in a tutorial format. New topics which have arisen since the first book are included and some topics from the first book are updated. The practical applications of major thin film deposition and etching processes are given special emphasis.

Download or read book Silicon Devices written by Kenneth A. Jackson and published by John Wiley & Sons. This book was released on 2008-11-21 with total page 210 pages. Available in PDF, EPUB and Kindle. Book excerpt: Silicon is the most important material for the electronics industry. In modern microelectronics silicon devices like diodes and transistors play a major role, and devices like photodetectors or solar cells gain ever more importance. This concise handbook deals with one of the most important topics for the electronics industry. World renowned authors have contributed to this unique overview of the processing of silicon and silicon devices.

Download or read book Reactive Ion Etching of SiO2 Using CHF3 CO2 Gas Mixture written by Anthony Hyunwoo Chung and published by . This book was released on 1997 with total page 134 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Ceramic Abstracts written by and published by . This book was released on 2000 with total page 278 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Electrical Electronics Abstracts written by and published by . This book was released on 1997 with total page 1904 pages. Available in PDF, EPUB and Kindle. Book excerpt: