Download or read book Proceedings of the Twenty Third International Symposium on Quality Electronic Design written by and published by . This book was released on 2022 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 6th International Symposium on Quality Electronic Design written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2005-01-01 with total page 710 pages. Available in PDF, EPUB and Kindle. Book excerpt: The proceedings covers research, development, and application of design techniques and methods, design processes, and EDA design methodologies and tools that address issues which impact the quality of the realization of designs into physical integrated circuits.
Download or read book Proceedings of the Twenty third AAAI Conference on Artificial Intelligence and the Twentieth Innovative Applications of Artificial Intelligence Conference written by American Association for Artificial Intelligence and published by . This book was released on 2008 with total page 652 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of the Third International Symposium on Corrosion and Reliability of Electronic Materials and Devices written by Robert B. Comizzoli and published by The Electrochemical Society. This book was released on 1994 with total page 436 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceeding of the 3rd International Conference on Electronics Biomedical Engineering and Health Informatics written by Triwiyanto Triwiyanto and published by Springer Nature. This book was released on 2023-05-31 with total page 708 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents high-quality peer-reviewed papers from the International Conference on Electronics, Biomedical Engineering, and Health Informatics (ICEBEHI) 2022 held at Surabaya, Indonesia, virtually. The contents are broadly divided into three parts: (a) Electronics, (b) Biomedical Engineering, and (c) Health Informatics. The major focus is on emerging technologies and their applications in the domain of biomedical engineering. It includes papers based on original theoretical, practical, and experimental simulations, development, applications, measurements, and testing. Featuring the latest advances in the field of biomedical engineering applications, this book serves as a definitive reference resource for researchers, professors, and practitioners interested in exploring advanced techniques in the fields of electronics, biomedical engineering, and health informatics. The applications and solutions discussed here provide excellent reference material for future product development.
Download or read book Proceedings of the International Symposium on Electronics and the Environment written by International Symposium on Electronics and the Environment and published by . This book was released on with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of Third International Conference on Communication Computing and Electronics Systems written by V. Bindhu and published by Springer Nature. This book was released on 2022-03-19 with total page 1111 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book includes high quality research papers presented at the International Conference on Communication, Computing and Electronics Systems 2021, held at the PPG Institute of Technology, Coimbatore, India, on 28-29 October 2021. The volume focuses mainly on the research trends in cloud computing, mobile computing, artificial intelligence and advanced electronics systems. The topics covered are automation, VLSI, embedded systems, optical communication, RF communication, microwave engineering, artificial intelligence, deep learning, pattern recognition, communication networks, Internet of Things, cyber-physical systems, and healthcare informatics.
Download or read book VLSI written by Tomasz Wojcicki and published by CRC Press. This book was released on 2014-10-24 with total page 490 pages. Available in PDF, EPUB and Kindle. Book excerpt: Recently the world celebrated the 60th anniversary of the invention of the first transistor. The first integrated circuit (IC) was built a decade later, with the first microprocessor designed in the early 1970s. Today, ICs are a part of nearly every aspect of our daily lives. They help us live longer and more comfortably, and do more, faster. All this is possible because of the relentless search for new materials, circuit designs, and ideas happening on a daily basis at industrial and academic institutions around the globe. Showcasing the latest advances in very-large-scale integrated (VLSI) circuits, VLSI: Circuits for Emerging Applications provides a balanced view of industrial and academic developments beyond silicon and complementary metal–oxide–semiconductor (CMOS) technology. From quantum-dot cellular automata (QCA) to chips for cochlear implants, this must-have resource: Investigates the trend of combining multiple cores in a single chip to boost performance of the overall system Describes a novel approach to enable physically unclonable functions (PUFs) using intrinsic features of a VLSI chip Examines the VLSI implementations of major symmetric and asymmetric key cryptographic algorithms, hash functions, and digital signatures Discusses nonvolatile memories such as resistive random-access memory (Re-RAM), magneto-resistive RAM (MRAM), and floating-body RAM (FB-RAM) Explores organic transistors, soft errors, photonics, nanoelectromechanical (NEM) relays, reversible computation, bioinformatics, asynchronous logic, and more VLSI: Circuits for Emerging Applications presents cutting-edge research, design architectures, materials, and uses for VLSI circuits, offering valuable insight into the current state of the art of micro- and nanoelectronics.
Download or read book ICCWCS 2019 written by Jamal Zbitou and published by European Alliance for Innovation. This book was released on with total page 564 pages. Available in PDF, EPUB and Kindle. Book excerpt: Today, computer science engineering and telecommunications are two important areas linked and even inseparable. This is obvious for the user who connects the modem of his computer on his mobile phone or telephone line to access, via the global data network, the information available on the servers. The both domains are evolving rapidly and the development of new architectures of systems dedicated to telecommunications and computing becomes essential. Especially, wireless transmission systems with high data rate. Two parts of these systems should be developed software and hardware. Another area that is renewable energies becomes more attractive for researchers in order to develop new conversion systems with good performances, and a good optimization of energy. For example, in wireless sensor systems, we try to develop new protocols permitting to have a good autonomy in terms of energy.
Download or read book Three Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and published by Newnes. This book was released on 2017-07-04 with total page 770 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization
Download or read book Energy a Continuing Bibliography with Indexes written by and published by . This book was released on 1978 with total page 524 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Through Silicon Vias written by Brajesh Kumar Kaushik and published by CRC Press. This book was released on 2016-11-30 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt: Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.
Download or read book Design Methodologies and Tools for 5G Network Development and Application written by Suresh, P. and published by IGI Global. This book was released on 2020-12-25 with total page 291 pages. Available in PDF, EPUB and Kindle. Book excerpt: The demand for mobile broadband will continue to increase in upcoming years, largely driven by the need to deliver ultra-high definition video. 5G is not only evolutionary, it also provides higher bandwidth and lower latency than the current-generation technology. More importantly, 5G is revolutionary in that it is expected to enable fundamentally new applications with much more stringent requirements in latency and bandwidth. 5G should help solve the last-mile/last-kilometer problem and provide broadband access to the next billion users on earth at a much lower cost because of its use of new spectrum and its improvements in spectral efficiency. 5G wireless access networks will need to combine several innovative aspects of decentralized and centralized allocation looking to maximize performance and minimize signaling load. Research is currently conducted to understand the inspirations, requirements, and the promising technical options to boost and enrich activities in 5G. Design Methodologies and Tools for 5G Network Development and Application presents the enhancement methods of 5G communication, explores the methods for faster communication, and provides a promising alternative solution that equips designers with the capability to produce high performance, scalable, and adoptable communication protocol. This book provides complete design methodologies, supporting tools for 5G communication, and innovative works. The design and evaluation of different proposed 5G structures signal integrity, reliability, low-power techniques, application mapping, testing, and future trends. This book is ideal for researchers who are working in communication, networks, design and implementations, industry personnel, engineers, practitioners, academicians, and students who are interested in the evolution, importance, usage, and technology adoption for 5G applications.
Download or read book Management written by and published by . This book was released on 1978 with total page 732 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advanced Field Solver Techniques for RC Extraction of Integrated Circuits written by Wenjian Yu and published by Springer Science & Business. This book was released on 2014-04-21 with total page 258 pages. Available in PDF, EPUB and Kindle. Book excerpt: Resistance and capacitance (RC) extraction is an essential step in modeling the interconnection wires and substrate coupling effect in nanometer-technology integrated circuits (IC). The field-solver techniques for RC extraction guarantee the accuracy of modeling, and are becoming increasingly important in meeting the demand for accurate modeling and simulation of VLSI designs. Advanced Field-Solver Techniques for RC Extraction of Integrated Circuits presents a systematic introduction to, and treatment of, the key field-solver methods for RC extraction of VLSI interconnects and substrate coupling in mixed-signal ICs. Various field-solver techniques are explained in detail, with real-world examples to illustrate the advantages and disadvantages of each algorithm. This book will benefit graduate students and researchers in the field of electrical and computer engineering as well as engineers working in the IC design and design automation industries. Dr. Wenjian Yu is an Associate Professor at the Department of Computer Science and Technology at Tsinghua University in China; Dr. Xiren Wang is a R&D Engineer at Cadence Design Systems in the USA.
Download or read book Electronic Design Automation for IC Implementation Circuit Design and Process Technology written by Luciano Lavagno and published by CRC Press. This book was released on 2017-02-03 with total page 893 pages. Available in PDF, EPUB and Kindle. Book excerpt: The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.
Download or read book 3D Integration for NoC based SoC Architectures written by Abbas Sheibanyrad and published by Springer Science & Business Media. This book was released on 2010-11-08 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.
