Download or read book Proceedings of the Symposium on Polymeric Materials for Electronic Packaging and High Technology Applications written by John R. Susko and published by . This book was released on 1988 with total page 228 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Polymeric Materials for Electronic Packaging and High Technology Applications written by Electrochemical Society. Dielectrics and Insulation Division and published by . This book was released on with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Polymers in Organic Electronics written by Sulaiman Khalifeh and published by Elsevier. This book was released on 2020-04-01 with total page 617 pages. Available in PDF, EPUB and Kindle. Book excerpt: Polymers in Organic Electronics: Polymer Selection for Electronic, Mechatronic, and Optoelectronic Systems provides readers with vital data, guidelines, and techniques for optimally designing organic electronic systems using novel polymers. The book classifies polymer families, types, complexes, composites, nanocomposites, compounds, and small molecules while also providing an introduction to the fundamental principles of polymers and electronics. Features information on concepts and optimized types of electronics and a classification system of electronic polymers, including piezoelectric and pyroelectric, optoelectronic, mechatronic, organic electronic complexes, and more. The book is designed to help readers select the optimized material for structuring their organic electronic system.Chapters discuss the most common properties of electronic polymers, methods of optimization, and polymeric-structured printed circuit boards. The polymeric structures of optoelectronics and photonics are covered and the book concludes with a chapter emphasizing the importance of polymeric structures for packaging of electronic devices. Provides key identifying details on a range of polymers, micro-polymers, nano-polymers, resins, hydrocarbons, and oligomers Covers the most common electrical, electronic, and optical properties of electronic polymers Describes the underlying theories on the mechanics of polymer conductivity Discusses polymeric structured printed circuit boards, including their rapid prototyping and optimizing their polymeric structures Shows optimization methods for both polymeric structures of organic active electronic components and organic passive electronic components
Download or read book Special Section on Polymeric Materials for Electronics Packaging written by Johan Liu and published by . This book was released on 2000 with total page 183 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Polymeric Materials for Electronics Packaging and Interconnection written by John H. Lupinski and published by . This book was released on 1989 with total page 520 pages. Available in PDF, EPUB and Kindle. Book excerpt: From a symposium of the ACS 196th meeting, Los Angeles, CA, Sept. 1988. Thirty-nine chapters cover a broad spectrum of topics in four general areas: physical chemistry of materials, properties and applications of encapsulants and gels, and printed circuit board substrates and materials. Also includes a review of the marketing trends which drive packaging technology. Annotation copyrighted by Book News, Inc., Portland, OR
Download or read book Proceedings of the IEEE 1989 National Aerospace and Electronics Conference NAECON 1989 written by and published by . This book was released on 1989 with total page 728 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electronic Packaging Materials Science V Symposium Held in Boston Massachusetts on 26 29 November 1990 Materials Research Society Symposium Proceedings written by Edwin D. Lillie and published by . This book was released on 1990 with total page 473 pages. Available in PDF, EPUB and Kindle. Book excerpt: The theme of the symposium deals with materials-related issues important to the future of technology for the packaging and interconnection of electronic components. This technology is on the critical path to increased performance of office computers and workstations, home computers, mainframes, supercomputers, control systems in automobiles, navigation and avionics, fast processors for medical diagnostics, or the huge telecommunications industry. It is true of all these applications that major advanced in packaging and interconnect are only possible with concomitant progress in materials science. Performance is not the only issue so influences, so too is compactness, lightness and cost to the consumer. The symposium included sessions on the mechanical and deformation properties of polymer interfaces (with emphasis and the effects of plastic behavior in polymeric thin films, and general attention to stress effects on reliability), protective coatings for IC's, polymers and polymer-processing for high density packaging (e.g., photoimageable polyimides, use of liquid crystals to control thermal expansion, effect of curing on stress in polyimides in multilayer structures), ceramics and glass-ceramics (emphasis on aluminum nitride bulk, and interface properties), metallization techniques (low temperature CVD of copper films, laser planarization, laser assisted deposition of catalysts for electroless and electrolytic plating of copper), solders and soldering (including fatigue life predictions for solder joints), and measurement of material properties of thin films.
Download or read book Electronic Enclosures Housings and Packages written by Frank Suli and published by Woodhead Publishing. This book was released on 2018-11-15 with total page 490 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions. Introduces the concepts of materials recycling and sustainability to electronic enclosures Provides thorough coverage of all technical aspects relating to the design and manufacturing of electronic packaging Includes practical information on environmental considerations, shielding, standardization, materials selection, and more
Download or read book Nanopackaging written by James E. Morris and published by Springer. This book was released on 2018-09-22 with total page 996 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Download or read book Polymers for Electronic Photonic Application written by C. P. Wong and published by Elsevier. This book was released on 2013-10-22 with total page 676 pages. Available in PDF, EPUB and Kindle. Book excerpt: The most recent advances in the use of polymeric materials by the electronic industry can be found in Polymers for Electronic and Photonic Applications. This bookprovides in-depth coverage of photoresis for micro-lithography, microelectronic encapsulants and packaging, insulators, dielectrics for multichip packaging,electronic and photonic applications of polymeric materials, among many other topics. Intended for engineers and scientists who design, process, and manufacturemicroelectronic components, this book will also prove useful for hybrid and systems packaging managers who want to be informed of the very latest developments inthis field. * Presents most recent advances in the use of polymeric materials by the electronic industry* Contributions by foremost experts in the field
Download or read book Handbook of Adhesives and Sealants written by Philippe Cognard and published by Elsevier. This book was released on 2005-07-14 with total page 511 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Adhesives and Sealants is the most comprehensive Adhesives and Sealants Handbook ever published, with the cooperation of around 35 authors from all over the world – each one a specialist in their field. It will include 80 chapters dealing with general information, theory of bonding and sealing, design of bonding parts, technical characteristics, chemistry, types of adhesives, application, equipment, controls, standards etc. Industrial applications such as automotive, aeronautics, building and civil engineering, electronics, packaging, wood, furniture, metals, plastics and composites, textiles, footwear etc. Over 1,000 real-life examples illustrate the do's and don'ts of using adhesives Every scientific and technical issue concerning every chemical type in every industry Designed to help solve problems quickly, the content is structured to allow readers to navigate this comprehensive resource in 4 different ways
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Download or read book Handbook of Lead Free Solder Technology for Microelectronic Assemblies written by Karl J. Puttlitz and published by CRC Press. This book was released on 2004-02-27 with total page 1044 pages. Available in PDF, EPUB and Kindle. Book excerpt: This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specif
Download or read book Plastics for Electronics written by William M. Alvino and published by McGraw-Hill Companies. This book was released on 1995 with total page 394 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Modeling and Simulation for Microelectronic Packaging Assembly written by Shen Liu and published by John Wiley & Sons. This book was released on 2011-08-24 with total page 586 pages. Available in PDF, EPUB and Kindle. Book excerpt: Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
Download or read book Encapsulation Technologies for Electronic Applications written by Haleh Ardebili and published by William Andrew. This book was released on 2018-10-23 with total page 508 pages. Available in PDF, EPUB and Kindle. Book excerpt: Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics Includes coverage of environmentally friendly 'green encapsulants' Presents coverage of faults and defects, and how to analyze and avoid them
Download or read book Proceedings written by and published by . This book was released on with total page 978 pages. Available in PDF, EPUB and Kindle. Book excerpt:
