Download or read book Thermal and Electro thermal System Simulation 2020 written by Márta Rencz and published by MDPI. This book was released on 2021-01-12 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
Download or read book Selected Papers from the 5th International Electronic Conference on Sensors and Applications written by Francisco Falcone and published by MDPI. This book was released on 2020-12-29 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Special Issue comprises selected papers from the proceedings of the 5th International Electronic Conference on Sensors and Applications, held on 15–30 November 2018, on sciforum.net, an online platform for hosting scholarly e-conferences and discussion groups. In this 5th edition of the electronic conference, contributors were invited to provide papers and presentations from the field of sensors and applications at large, resulting in a wide variety of excellent submissions and topic areas. Papers which attracted the most interest on the web or that provided a particularly innovative contribution were selected for publication in this collection. These peer-reviewed papers are published with the aim of rapid and wide dissemination of research results, developments, and applications. We hope this conference series will grow rapidly in the future and become recognized as a new way and venue by which to (electronically) present new developments related to the field of sensors and their applications.
Download or read book Proceedings of the IUTAM Symposium on Turbulent Structure and Particles Turbulence Interaction written by Xiaojing Zheng and published by Springer Nature. This book was released on 2024-01-02 with total page 349 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the proceedings of the 'IUTAM Symposium on Turbulent Structure and Particles' held in 2023. It provides a comprehensive overview of the latest research and developments in the field of turbulent dispersed multiphase flows. The book features contributions from experts in academia and industry, covering a range of topics including droplet and pollutant dispersion, sand/dust storms, sediment transport in water or air flows, fluidized beds, bubbly flows and more. The content is a valuable reference for researchers, engineers, and students who are interested in understanding the complex behavior of multiphase flows in different natural and industrial environments.
Download or read book Thermal Management of Gallium Nitride Electronics written by Marko Tadjer and published by Woodhead Publishing. This book was released on 2022-07-13 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermal Management of Gallium Nitride Electronics outlines the technical approaches undertaken by leaders in the community, the challenges they have faced, and the resulting advances in the field. This book serves as a one-stop reference for compound semiconductor device researchers tasked with solving this engineering challenge for future material systems based on ultra-wide bandgap semiconductors. A number of perspectives are included, such as the growth methods of nanocrystalline diamond, the materials integration of polycrystalline diamond through wafer bonding, and the new physics of thermal transport across heterogeneous interfaces. Over the past 10 years, the book's authors have performed pioneering experiments in the integration of nanocrystalline diamond capping layers into the fabrication process of compound semiconductor devices. Significant research efforts of integrating diamond and GaN have been reported by a number of groups since then, thus resulting in active thermal management options that do not necessarily lead to performance derating to avoid self-heating during radio frequency or power switching operation of these devices. Self-heating refers to the increased channel temperature caused by increased energy transfer from electrons to the lattice at high power. This book chronicles those breakthroughs. - Includes the fundamentals of thermal management of wide-bandgap semiconductors, with historical context, a review of common heating issues, thermal transport physics, and characterization methods - Reviews the latest strategies to overcome heating issues through materials modeling, growth and device design strategies - Touches on emerging, real-world applications for thermal management strategies in power electronics
Download or read book Proceedings of the International Conference on Industrial and Manufacturing Systems CIMS 2020 written by Ravi Pratap Singh and published by Springer Nature. This book was released on 2021-07-24 with total page 689 pages. Available in PDF, EPUB and Kindle. Book excerpt: In order to deal with the societal challenges novel technology plays an important role. For the advancement of technology, Department of Industrial and Production Engineering under the aegis of NIT Jalandhar is organizing an “International Conference on Industrial and Manufacturing Systems” (CIMS-2020) from 26th -28th June, 2020. The present conference aims at providing a leading forum for sharing original research contributions and real-world developments in the field of Industrial and Manufacturing Systems so as to contribute its share for technological advancements. This volume encloses various manuscripts having its roots in the core of industrial and production engineering. Globalization provides all around development and this development is impossible without technological contributions. CIMS-2020, gathered the spirits of various academicians, researchers, scientists and practitioners, answering the vivid issues related to optimisation in the various problems of industrial and manufacturing systems.
Download or read book Proceedings of the Fifteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ITherm 2016 written by and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advances in Nanofluid Heat Transfer written by Hafiz Muhammad Ali and published by Elsevier. This book was released on 2022-05-28 with total page 589 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Nanofluid Heat Transfer covers the broad definitions, brief history, preparation techniques, thermophysical properties, heat transfer characteristics, and emerging applications of hybrid nanofluids. Starting with the basics, this book advances step-by-step toward advanced topics, with mathematical models, schematic diagrams and discussions of the experimental work of leading researchers. By introducing readers to new techniques, this book helps readers resolve existing problems and implement nanofluids in innovative new applications. This book provides detailed coverage of stability and reliable measurement techniques for nanofluid properties, as well as different kinds of base fluids. Providing a clear understanding of what happens at the nanoscale, the book is written to be used by engineers in industry as well as researchers and graduate students. - Covers new applications of nanofluids, along with key challenges encountered in the commercialization of this technology - Highlights new nanofluid properties and associated numerical modeling methods - Addresses the very latest topics in nanofluids sciences, such as ionic nanofluids
Download or read book Parallel Computational Technologies written by Leonid Sokolinsky and published by Springer. This book was released on 2017-10-01 with total page 355 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the 11th International Conference on Parallel Computational Technologies, PCT 2017, held in Kazan, Russia, in April 2017. The 24 revised full papers presented were carefully reviewed and selected from 167 submissions. The papers are organized in topical sections on high performance architectures, tools and technologies; parallel numerical algorithms; supercomputer simulation.
Download or read book Direct Copper Interconnection for Advanced Semiconductor Technology written by Dongkai Shangguan and published by CRC Press. This book was released on 2024-06-28 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.
Download or read book Thermal Energy written by Yatish T. Shah and published by CRC Press. This book was released on 2018-01-12 with total page 1112 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book details sources of thermal energy, methods of capture, and applications. It describes the basics of thermal energy, including measuring thermal energy, laws of thermodynamics that govern its use and transformation, modes of thermal energy, conventional processes, devices and materials, and the methods by which it is transferred. It covers 8 sources of thermal energy: combustion, fusion (solar) fission (nuclear), geothermal, microwave, plasma, waste heat, and thermal energy storage. In each case, the methods of production and capture and its uses are described in detail. It also discusses novel processes and devices used to improve transfer and transformation processes.
Download or read book HEMT Technology and Applications written by Trupti Ranjan Lenka and published by Springer Nature. This book was released on 2022-06-23 with total page 246 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers two broad domains: state-of-the-art research in GaN HEMT and Ga2O3 HEMT. Each technology covers materials system, band engineering, modeling and simulations, fabrication techniques, and emerging applications. The book presents basic operation principles of HEMT, types of HEMT structures, and semiconductor device physics to understand the device behavior. The book presents numerical modeling of the device and TCAD simulations for high-frequency and high-power applications. The chapters include device characteristics of HEMT including 2DEG density, Id-Vgs, Id-Vds, transconductance, linearity, and C-V. The book emphasizes the state-of-the-art fabrication techniques of HEMT and circuit design for various applications in low noise amplifier, oscillator, power electronics, and biosensor applications. The book focuses on HEMT applications to meet the ever-increasing demands of the industry, innovation in terms of materials, design, modeling, simulation, processes, and circuits. The book will be primarily helpful to undergraduate/postgraduate, researchers, and practitioners in their research.
Download or read book Lead free Soldering Process Development and Reliability written by Jasbir Bath and published by John Wiley & Sons. This book was released on 2020-07-28 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.
Download or read book Smart Anticorrosive Materials written by Chandrabhan Verma and published by Elsevier. This book was released on 2023-03-28 with total page 649 pages. Available in PDF, EPUB and Kindle. Book excerpt: Smart Anticorrosive Materials: Trends and Opportunities covers new developments in nanoscale coatings and their current applications. The book addresses fundamental characteristics, synthesis, inhibition mechanisms and applications of green nanomaterials for educational (academic) as well as industrial purposes and provides a chronological overview of the growth of the field. The book concludes with discussions about commercialization, economics and environmental considerations. This will be an indispensable reference for scholars, chemical engineers, chemists and materials scientists working in R&D and academia who want to understand corrosion systems and modern advancements on smart coatings. - Presents current research and the latest developments in corrosion protection and future opportunities, along with anticorrosive effects of nanomaterials and nanocomposites - Focuses on advanced nanomaterials and nanocomposites coatings for industry-oriented practices, including current challenges during manufacturing - Includes websites of interest and information the about latest research
Download or read book Novel Aspects of Diamond II written by Soumen Mandal and published by Springer Nature. This book was released on 2024 with total page 530 pages. Available in PDF, EPUB and Kindle. Book excerpt: This edited book covers a wide range of novel scientific and engineering aspects of diamond films produced from chemical vapor deposition. It focuses on the most recent developments and achievements in this rapidly growing field from scientists and engineers across the domains of chemistry, biology, medicine, physics, and semiconductor engineering. The latest volume of this consistently well-cited book brings an updated, systematic review of the latest developments in diamond research and application. Featuring contributed chapters from a mix of highly-active international researchers, this new edition presents recent research focusing on topics such as diamond for thermal management in high-power electronics, diamond MOSFETs, water treatment, application of machine learning for nanodiamonds, theoretical aspects of diamond growth, current trends in emerging diamond technologies, and the growth of doped single-crystal diamond. This book is especially appealing to interdisciplinary researchers and industry professionals working on advanced diamond devices and applications, as well as theoretical and computational methods for predicting and designing new diamond materials.
Download or read book Advances in Mechanical Design written by Jianrong Tan and published by Springer Nature. This book was released on with total page 2698 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book The Art of Measuring in the Thermal Sciences written by Josua Meyer and published by CRC Press. This book was released on 2020-11-05 with total page 483 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Art of Measuring in the Thermal Sciences provides an original state-of-the-art guide to scholars who are conducting thermal experiments in both academia and industry. Applications include energy generation, transport, manufacturing, mining, processes, HVAC&R, etc. This book presents original insights into advanced measurement techniques and systems, explores the fundamentals, and focuses on the analysis and design of thermal systems. Discusses the advanced measurement techniques now used in thermal systems Links measurement techniques to concepts in thermal science and engineering Draws upon the original work of current researchers and experts in thermal-fluid measurement Includes coverage of new technologies, such as micro-level heat transfer measurements Covers the main types of instrumentation and software used in thermal-fluid measurements This book offers engineers, researchers, and graduate students an overview of the best practices for conducting sound measurements in the thermal sciences.
Download or read book Parallel Computing is Everywhere written by S. Bassini and published by IOS Press. This book was released on 2018-03-07 with total page 852 pages. Available in PDF, EPUB and Kindle. Book excerpt: The most powerful computers work by harnessing the combined computational power of millions of processors, and exploiting the full potential of such large-scale systems is something which becomes more difficult with each succeeding generation of parallel computers. Alternative architectures and computer paradigms are increasingly being investigated in an attempt to address these difficulties. Added to this, the pervasive presence of heterogeneous and parallel devices in consumer products such as mobile phones, tablets, personal computers and servers also demands efficient programming environments and applications aimed at small-scale parallel systems as opposed to large-scale supercomputers. This book presents a selection of papers presented at the conference: Parallel Computing (ParCo2017), held in Bologna, Italy, on 12 to 15 September 2017. The conference included contributions about alternative approaches to achieving High Performance Computing (HPC) to potentially surpass exa- and zetascale performances, as well as papers on the application of quantum computers and FPGA processors. These developments are aimed at making available systems better capable of solving intensive computational scientific/engineering problems such as climate models, security applications and classic NP-problems, some of which cannot currently be managed by even the most powerful supercomputers available. New areas of application, such as robotics, AI and learning systems, data science, the Internet of Things (IoT), and in-car systems and autonomous vehicles were also covered. As always, ParCo2017 attracted a large number of notable contributions covering present and future developments in parallel computing, and the book will be of interest to all those working in the field.
