Download or read book Glsvlsi 13 Proceedings of the ACM International Conference of the Great Lakes Symposium on VLSI written by Glsvlsi 13 Conference Committee and published by . This book was released on 2013-07-01 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceedings of the 25th Edition on Great Lakes Symposium on VLSI written by and published by . This book was released on 2015 with total page 404 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book GLSVLSI 2014 written by and published by . This book was released on 2014 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceedings of the ACM Great Lakes Symposium on VLSI written by and published by . This book was released on 2007 with total page 644 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Glsvlsi 12 Proceedings of the Great Lake Symposium on Vlsi 2012 written by Association for Computing Machinery and published by ACM Press. This book was released on 2012-11-01 with total page 390 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Glsvlsi 18 written by Glsvlsi and published by . This book was released on 2018-10-29 with total page 536 pages. Available in PDF, EPUB and Kindle. Book excerpt: Welcome to the 28th edition of the Great Lakes Symposium on VLSI (GLSVLSI) 2018, held at Chicago, IL. GLSVLSI is a premier venue for the dissemination of manuscripts of the highest quality in all areas related to VLSI, devices, and system-level design. The location of this year's GLSVLSI is Chicago, returning to the Great Lakes region of the USA. Conference will be held at Marriott Marquis Chicago located in downtown Chicago close to Lake Michigan and South Loop. Chicago is the home of Willis Tower, Cloud Gate and Millennium Park, Navy Pier, Art Institute of Chicago, Field Museum of Natural History, Magnificent Mile, and Wrigley Field. The conference this year will host a social event aboard Chicago's First Lady Cruises for Chicago Architecture Foundation River Cruise. This year's central theme for GLSVLSI is IoT Hardware and Heterogeneous Computing for Artificial Intelligence. The conference will showcase a program highlighted by five keynote speeches related to the central theme by the following academic, industrial, and governmental leaders: Matthew Casto, Chief, Air Force Research Lab, delivering the keynote entitled Hardware Assurance: Trojans, Counterfeits, and Security in an Interconnected World. Nikil Dutt, Chancellor's Professor, UC-Irvine, delivering the keynote entitled Self-Awareness for Heterogeneous MPSoCs: A Case Study using Adaptive, Reflective Middleware. Sharon Hu, Associate Dean, University of Notre Dame, delivering keynote entitled A Cross- Layer Perspective for Energy Efficient Processing -- From Beyond-CMOS Devices to Deep Learning. David Pellerin, Head of Global Business Development, Infotech/Semiconductor, Amazon Web Services, delivering keynote entitled Connected Devices, AI, and Scale -- Trends Driving Semiconductor Innovation. Wade Shen, Program Manager, DARPA, delivering keynote entitled DARPA's Data Driven Discovery of Models (D3M) and Software Defined Hardware (SDH) programs. Complementing the keynotes are six special sessions on: Powering Heterogeneous IoT Systems: Design for Efficiency, Security, and Sustainability. Emergence of Silicon Photonics in High-Performance Computing: How can the VLSI Community Contribute? Artificial Intelligence at the Edge. Implementing and Benchmarking Post-Quantum Cryptography in Hardware. Stochastic and Approximate Computing for Emerging Learning and Communication Systems. Circuits and Systems for Autonomous IoT Devices. For the first time in 2018, GLSVLSI program is featuring panels. Panel chairs Ioannis Savidis and Avesta Sasan will be moderating panels on the timely topics of security and machine learning, respectively Securing the Systems of the Future -- Techniques for a Shifting Attack Space. Low Power & Trusted Machine Learning. Most importantly, GLSVLSI 2018 will continue the strong tradition of featuring a stellar technical program focusing on VLSI, devices and systems. The technical program is shaped by the strong representation of high-quality papers in the standard tracks in VLSI Design; VLSI Circuits and Power Aware Design; Computer-Aided Design; Testing, Reliability, Fault Tolerance; Emerging Computing and Post-CMOS Technologies; and Hardware Security. GLSVLSI 2018 adds a new track in Machine Learning and Artificial Intelligence to capture the increasing interest and demonstrated competence of our community in the emerging field that also helps shape the central theme of GLSVLSI 2018. There were 161 papers submitted to GLSVLSI 2018 from 22 countries.

Download or read book GLSVLSI 19 written by Glsvlsi '19 and published by . This book was released on 2020-03-26 with total page 564 pages. Available in PDF, EPUB and Kindle. Book excerpt: Welcome to the 29th edition of the Great Lakes Symposium on VLSI (GLSVLSI) 2019, held between May 9-11, 2019 at Tysons Corner, VA in the Washington, DC metropolitan area. GLSVLSI is a premier venue for the dissemination of manuscripts of the highest quality in all areas related to VLSI, devices, and system-level design. The location of this year's GLSVLSI is Washington, DC, visiting the east coast of the US, not too far from the "Great Lakes" region of the USA, especially given the global stretch of GLSVLSI host cities within the past decade. Conference will be held at Tysons Corner Marriott located in Tysons Corner, VA, a short ride from downtown Washington DC. ACM GLSVLSI 2019 is presented through the collaborative effort of a 15+ member organizing committee with 100+ technical program committee members. The Technical Program Committee Chairs, Tinoosh Mohsenin and Weisheng Zhao, have put together the 2019 installment of the traditionally strong ACM SIGDA GLSVLSI program. The program is structured around the following eight tracks, with GLSVLSI welcoming the International Conference on Microelectronic Systems Education (MSE) for GLSVLSI attendees as one of the tracks in 2019: 1. VLSI Design (Track Chairs Selcuk Kose, Inna Partin-Vaisband) 2. VLSI Circuits and Power Aware Design (Track Chairs Deliang Fan, Swaroop Ghosh) 3. Computer-Aided Design (Track Chairs Yanzhi Wang, Jianlei Yang) 4. Testing, Reliability, Fault Tolerance (Track Chairs Sandip Ray, Benjamin Schaefer) 5. Emerging Computing & Post-CMOS Technologies (Track Chairs Sorin Cotofana, Yue Zhang) 6. Hardware Security (Track Chairs JV Rajendran, Patrick Schaumont) 7. VLSI for Machine Learning and Artificial Intelligence (Track Chairs Philip Brisk, Amey Kulkarni) 8. Microelectronics Systems Education (Track Chairs Tina Hudson, Bradley Minch)

Download or read book Glsvlsi 13 written by Jose Ayala and published by . This book was released on 2013-05-02 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: GLSVLSI'13: Great Lakes Symposium on VLSI 2013 (part of ECRC) May 02, 2013-May 04, 2013 Paris, France. You can view more information about this proceeding and all of ACM�s other published conference proceedings from the ACM Digital Library: http://www.acm.org/dl.

Download or read book Great Lakes 6th Symposium on VLSI written by IEEE Computer Soc and published by IEEE. This book was released on 1997-04 with total page 300 pages. Available in PDF, EPUB and Kindle. Book excerpt: Fifty-one selected proceedings papers written by computer researchers in the Great Lakes, region and also by international contributors, representing the core discussions of the March 1996 symposium at Iowa State University. The VLSI based presentations focus on current trends and methodologies, cov

Download or read book Proceedings of the ACM Great Lakes Symposium on VLSI written by and published by . This book was released on 2007 with total page 636 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceedings written by and published by IEEE Computer Society. This book was released on 1995 with total page 274 pages. Available in PDF, EPUB and Kindle. Book excerpt: The proceedings of the March 1995 symposium, GLSVLSI'95, comprise 22 regular papers and 29 short papers, all refereed, in technical sessions devoted to synthesis (3 sessions), analog VLSI, physical design (3 sessions), low power design, verification, architecture and design (2 sessions), testing, as

Download or read book GLSVLSI 04 written by and published by . This book was released on 2004 with total page 492 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceedings 2001 written by and published by . This book was released on 2001 with total page 172 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Sustainable ICTs and Management Systems for Green Computing written by Hu, Wen-Chen and published by IGI Global. This book was released on 2012-06-30 with total page 496 pages. Available in PDF, EPUB and Kindle. Book excerpt: "This book focuses on information technology using sustainable green computing to reduce energy and resources used"--Provided by publisher.

Download or read book Physical Design for 3D Integrated Circuits written by Aida Todri-Sanial and published by CRC Press. This book was released on 2017-12-19 with total page 397 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.

Download or read book Low Power High Level Synthesis for Nanoscale CMOS Circuits written by Saraju P. Mohanty and published by Springer Science & Business Media. This book was released on 2008-05-31 with total page 325 pages. Available in PDF, EPUB and Kindle. Book excerpt: This self-contained book addresses the need for analysis, characterization, estimation, and optimization of the various forms of power dissipation in the presence of process variations of nano-CMOS technologies. The authors show very large-scale integration (VLSI) researchers and engineers how to minimize the different types of power consumption of digital circuits. The material deals primarily with high-level (architectural or behavioral) energy dissipation.

Download or read book Three Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and published by Newnes. This book was released on 2017-07-04 with total page 768 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization