Download or read book Proceedings of the 3rd Symposium on Ultrasonic Electronics written by and published by . This book was released on 1983 with total page 246 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of the Symposium on Ultrasonic Electronics written by and published by . This book was released on 1983 with total page 240 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Index of Conference Proceedings Received written by British Library. Lending Division and published by . This book was released on 1988 with total page 492 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book written by 国立国会図書館 (Japan) and published by . This book was released on 1972 with total page 672 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Current Catalog written by National Library of Medicine (U.S.) and published by . This book was released on 1982 with total page 1068 pages. Available in PDF, EPUB and Kindle. Book excerpt: First multi-year cumulation covers six years: 1965-70.
Download or read book Design Modeling and Experiments of 3 DOF Electromagnetic Spherical Actuators written by Liang Yan and published by Springer Science & Business Media. This book was released on 2011-06-06 with total page 176 pages. Available in PDF, EPUB and Kindle. Book excerpt: A spherical actuator is a novel electric device that can achieve 2/3-DOF rotational motions in a single joint with electric power input. It has advantages such as compact structure, low mass/moment of inertia, fast response and non-singularities within the workspace. It has promising applications in robotics, automobile, manufacturing, medicine and aerospace industry. This is the first monograph that introduces the research on spherical actuators systematically. It broadens the scope of actuators from conventional single-axis to multi-axis, which will help both beginners and researchers to enhance their knowledge on electromagnetic actuators. Generic analytic modeling methods for magnetic field and torque output are developed, which can be applied to the development of other electromagnetic actuators. A parametric design methodology that allows fast analysis and design of spherical actuators for various applications is proposed. A novel non-contact high-precision 3-DOF spherical motion sensing methodology is developed and evaluated with experiments, which shows that it can achieve one order of magnitude higher precision than conventional methods. The technologies of nondimensionalization and normalization are introduced into magnetic field analysis the first time, and a benchmark database is established for the reference of other researches on spherical actuators.
Download or read book Index of Conference Proceedings written by British Library. Document Supply Centre and published by . This book was released on 1999 with total page 844 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Download or read book Mems Nems written by Cornelius T. Leondes and published by Springer Science & Business Media. This book was released on 2007-10-08 with total page 2142 pages. Available in PDF, EPUB and Kindle. Book excerpt: This significant and uniquely comprehensive five-volume reference is a valuable source for research workers, practitioners, computer scientists, students, and technologists. It covers all of the major topics within the subject and offers a comprehensive treatment of MEMS design, fabrication techniques, and manufacturing methods. It also includes current medical applications of MEMS technology and provides applications of MEMS to opto-electronic devices. It is clearly written, self-contained, and accessible, with helpful standard features including an introduction, summary, extensive figures and design examples with comprehensive reference lists.
Download or read book Electromagnetic Acoustic Transducers written by Masahiko Hirao and published by Springer. This book was released on 2016-10-25 with total page 382 pages. Available in PDF, EPUB and Kindle. Book excerpt: This second edition provides comprehensive information on electromagnetic acoustic transducers (EMATs), from the theory and physical principles of EMATs to the construction of systems and their applications to scientific and industrial ultrasonic measurements on materials. The original version has been complemented with selected ideas on ultrasonic measurement that have emerged since the first edition was released. The book is divided into four parts: PART I offers a self-contained description of the basic elements of coupling mechanisms along with the practical designing of EMATs for various purposes. Several implementations to compensate for EMATs’ low transfer efficiency are provided, along with useful tips on how to make an EMAT. PART II describes the principle of electromagnetic acoustic resonance (EMAR), which makes the most of EMATs’ contactless nature and is the most successful amplification mechanism for precise measurements of velocity and attenuation. PART III applies EMAR to studying physical acoustics. New measurements have emerged with regard to four major subjects: in situ monitoring of dislocation behavior, determination of anisotropic elastic constants, pointwise elasticity mapping (RUM), and acoustic nonlinearity evolution. PART IV deals with a variety of individual issues encountered in industrial applications, for which the EMATs are believed to be the best solutions. This is proven by a number of field applications.
Download or read book Handbook of Electronic Package Design written by Michael Pecht and published by CRC Press. This book was released on 2018-10-24 with total page 910 pages. Available in PDF, EPUB and Kindle. Book excerpt: Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
Download or read book The Tools of Owatatsumi written by Desmond Ball and published by ANU Press. This book was released on 2015-01-21 with total page 162 pages. Available in PDF, EPUB and Kindle. Book excerpt: Japan is quintessentially by geography a maritime country. Maritime surveillance capabilities – underwater, shore-based and airborne – are critical to its national defence posture. This book describes and assesses these capabilities, with particular respect to the underwater segment, about which there is little strategic analysis in publicly available literature. Since the end of the Cold War, Chinese oceanographic and navy vessels have intruded into Japanese waters with increasing frequency, not counting their activities in disputed waters such as around the Senkaku (Diaoyu) Islands and Okinotorishima where China and Japan have overlapping territorial claims. These intrusions have increasingly involved warships, including submarines, sometimes acting quite aggressively. Japan maintains an extraordinary network of undersea hydrophone arrays, connected to shore-stations which are typically equipped with electronic intelligence (ELINT) systems, for monitoring, identifying and tracking submarine and surface traffic in its internal straits and surrounding seas. Some parts of this network are operated jointly with, and are of crucial importance to, the US Navy. Japan’s superlative submarine detection capabilities would be of decisive advantage in any submarine engagement. But the relevant facilities are relatively vulnerable, which makes them very lucrative targets in any conflict. This introduces compelling escalatory dynamics, including the involvement of US forces and possible employment of nuclear options.
Download or read book Modeling and Simulation for Microelectronic Packaging Assembly written by Shen Liu and published by John Wiley & Sons. This book was released on 2011-08-24 with total page 586 pages. Available in PDF, EPUB and Kindle. Book excerpt: Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
Download or read book Power Electronic Packaging written by Yong Liu and published by Springer Science & Business Media. This book was released on 2012-02-15 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Download or read book Theory and Methodology of Electromagnetic Ultrasonic Guided Wave Imaging written by Songling Huang and published by Springer. This book was released on 2019-06-29 with total page 295 pages. Available in PDF, EPUB and Kindle. Book excerpt: Written by respected experts, this book highlights the latest findings on the electromagnetic ultrasonic guided wave (UGW) imaging method. It introduces main topics as the Time of Flight (TOF) extraction method for the guided wave signal, tomography and scattering imaging methods which can be used to improve the imaging accuracy of defects. Further, it offers essential insights into how electromagnetic UGW can be used in nondestructive testing (NDT) and defect imaging. As such, the book provides valuable information, useful methods and practical experiments that will benefit researchers, scientists and engineers in the field of NDT.
Download or read book Communication in Transportation Systems written by Strobel, Otto and published by IGI Global. This book was released on 2013-02-28 with total page 483 pages. Available in PDF, EPUB and Kindle. Book excerpt: Typically, communication technology breakthroughs and developments occur for the purposes of home, work, or cellular and mobile networks. Communications in transportation systems are often overlooked, yet they are equally as important. Communication in Transportation Systems brilliantly bridges theoretical knowledge and practical applications of cutting-edge technologies for communication in automotive applications. This reference source carefully covers innovative technologies which will continue to advance transportation systems. Researchers, developers, scholars, engineers, and graduate students in the transportation and automotive system, communication, electrical, and information technology fields will especially benefit from this advanced publication.
