Download or read book Proceedings of the International Symposium on Microelectronics written by and published by . This book was released on 2001 with total page 816 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceedings 1999 International Symposium on Microelectronics written by and published by . This book was released on 1999 with total page 836 pages. Available in PDF, EPUB and Kindle. Book excerpt: This text comprises the proceedings of the 1999 International Symposium on Microelectronics.

Download or read book Proceedings written by and published by . This book was released on 1997 with total page 1330 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book 1995 International Symposium on Microelectronics written by and published by . This book was released on 1995 with total page 588 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book 1993 International Symposium on Microelectronics written by and published by . This book was released on 1993 with total page 752 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book 1995 International Symposium on Microelectronics written by International Symposium on Microelectronics and published by . This book was released on 1995 with total page 584 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Microelectronics Packaging Handbook written by R.R. Tummala and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 1060 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Download or read book Proceedings of the Symposium Om Process Control Diagnostics and Modeling in Semiconductor Manufacturing written by M. Meyyappan and published by The Electrochemical Society. This book was released on 1995 with total page 644 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book 1997 International Symposium on Microelectronics written by and published by International Society for Hybrid Microelectronics. This book was released on 1997 with total page 738 pages. Available in PDF, EPUB and Kindle. Book excerpt: Contains the proceedings of IMAPS '97 in Adobe portable document format (PDF).

Download or read book Nineteenth IEEE CPMT International Electronics Manufacturing Technology Symposium written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1996 with total page 520 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Encapsulation Technologies for Electronic Applications written by Haleh Ardebili and published by William Andrew. This book was released on 2018-10-23 with total page 510 pages. Available in PDF, EPUB and Kindle. Book excerpt: Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. - Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics - Includes coverage of environmentally friendly 'green encapsulants' - Presents coverage of faults and defects, and how to analyze and avoid them

Download or read book Contamination of Electronic Assemblies written by Elissa M. Bumiller and published by CRC Press. This book was released on 2002-11-12 with total page 236 pages. Available in PDF, EPUB and Kindle. Book excerpt: Contamination problems have become a major factor in determining the manufacturability, quality, and reliability of electronic assemblies. Understanding the mechanics and chemistry of contamination has become necessary for improving quality and reliability and reducing costs of electronic assemblies. Designed as a practical guide, Contamination of

Download or read book Fan Out Wafer Level Packaging written by John H. Lau and published by Springer. This book was released on 2018-04-05 with total page 319 pages. Available in PDF, EPUB and Kindle. Book excerpt: This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.

Download or read book Modern Microwave and Millimeter Wave Power Electronics written by Gregory S. Nusinovich and published by John Wiley & Sons. This book was released on 2005-04-19 with total page 885 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive study of microwave vacuum electronic devices and their current and future applications While both vacuum and solid-state electronics continue to evolve and provide unique solutions, emerging commercial and military applications that call for higher power and higher frequencies to accommodate massive volumes of transmitted data are the natural domain of vacuum electronics technology. Modern Microwave and Millimeter-Wave Power Electronics provides systems designers, engineers, and researchers-especially those with primarily solid-state training-with a thoroughly up-to-date survey of the rich field of microwave vacuum electronic device (MVED) technology. This book familiarizes the R&D and academic communities with the capabilities and limitations of MVED and highlights the exciting scientific breakthroughs of the past decade that are dramatically increasing the compactness, efficiency, cost-effectiveness, and reliability of this entire class of devices. This comprehensive text explores a wide range of topics: Traveling-wave tubes, which form the backbone of satellite and airborne communications, as well as of military electronic countermeasures systems Microfabricated MVEDs and advanced electron beam sources Klystrons, gyro-amplifiers, and crossed-field devices "Virtual prototyping" of MVEDs via advanced 3-D computational models High-Power Microwave (HPM) sources Next-generation microwave structures and circuits How to achieve linear amplification Advanced materials technologies for MVEDs A Web site appendix providing a step-by-step walk-through of a typical MVED design process Concluding with an in-depth examination of emerging applications and future possibilities for MVEDs, Modern Microwave and Millimeter-Wave Power Electronics ensures that systems designers and engineers understand and utilize the significant potential of this mature, yet continually developing technology. SPECIAL NOTE: All of the editors' royalties realized from the sale of this book will fund the future research and publication activities of graduate students in the vacuum electronics field.

Download or read book Silicon on Insulator Technology written by J.-P. Colinge and published by Springer Science & Business Media. This book was released on 1997-09-30 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt: Silicon-on-Insulator Technology: Materials to VLSI, 2nd Edition describes the different facets of SOI technology. SOI chips are now commercially available and SOI wafer manufacturers have gone public. SOI has finally made it out of the academic world and is now a big concern for every major semiconductor company. SOI technology has indeed deserved serious recognition: high-temperature (400°C), extremely rad-hard (500 Mrad(Si)), high-density (16 Mb, 0.9-volt DRAM), high-speed (several GHz) and low-voltage (0.5 V) SOI circuits have been demonstrated. Strategic choices in favor of the use of SOI for low-voltage, low-power portable systems have been made by several major semiconductor manufacturers. Silicon-on-Insulator Technology: Materials to VLSI, 2nd Edition presents a complete and state-of-the-art review of SOI materials, devices and circuits. SOI fabrication and characterization techniques, SOI device processing, the physics of the SOI MOSFET as well as that of SOI other devices, and the performances of SOI circuits are discussed in detail. The SOI specialist will find this book invaluable as a source of compiled references covering the different aspects of SOI technology. For the non-specialist, the book serves as an excellent introduction to the topic with detailed, yet simple and clear explanations. Silicon-on-Insulator Technology: Materials to VLSI, 2nd Edition is recommended for use as a textbook for classes on semiconductor device processing and physics. The level of the book is appropriate for teaching at both the undergraduate and graduate levels. Silicon-on-Insulator Technology: Materials to VLSI, 2nd Edition includes the new materials, devices, and circuit concepts which have been devised since the publication of the first edition. The circuit sections, in particular, have been updated to present the performances of SOI devices for low-voltage, low-power applications, as well as for high-temperature, smart-power, and DRAM applications. The other sections, such as those describing SOI materials, the physics of the SOI MOSFET and other devices have been updated to present the state of the art in SOI technology.

Download or read book Neural Networks and Micromechanics written by Ernst Kussul and published by Springer Science & Business Media. This book was released on 2009-12-01 with total page 225 pages. Available in PDF, EPUB and Kindle. Book excerpt: Micromechanical manufacturing based on microequipment creates new possibi- ties in goods production. If microequipment sizes are comparable to the sizes of the microdevices to be produced, it is possible to decrease the cost of production drastically. The main components of the production cost - material, energy, space consumption, equipment, and maintenance - decrease with the scaling down of equipment sizes. To obtain really inexpensive production, labor costs must be reduced to almost zero. For this purpose, fully automated microfactories will be developed. To create fully automated microfactories, we propose using arti?cial neural networks having different structures. The simplest perceptron-like neural network can be used at the lowest levels of microfactory control systems. Adaptive Critic Design, based on neural network models of the microfactory objects, can be used for manufacturing process optimization, while associative-projective neural n- works and networks like ART could be used for the highest levels of control systems. We have examined the performance of different neural networks in traditional image recognition tasks and in problems that appear in micromechanical manufacturing. We and our colleagues also have developed an approach to mic- equipment creation in the form of sequential generations. Each subsequent gene- tion must be of a smaller size than the previous ones and must be made by previous generations. Prototypes of ?rst-generation microequipment have been developed and assessed.

Download or read book Handbook of Adhesives and Sealants written by Philippe Cognard and published by Elsevier. This book was released on 2005-07-14 with total page 511 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Adhesives and Sealants is the most comprehensive Adhesives and Sealants Handbook ever published, with the cooperation of around 35 authors from all over the world – each one a specialist in their field. It will include 80 chapters dealing with general information, theory of bonding and sealing, design of bonding parts, technical characteristics, chemistry, types of adhesives, application, equipment, controls, standards etc. Industrial applications such as automotive, aeronautics, building and civil engineering, electronics, packaging, wood, furniture, metals, plastics and composites, textiles, footwear etc. - Over 1,000 real-life examples illustrate the do's and don'ts of using adhesives - Every scientific and technical issue concerning every chemical type in every industry - Designed to help solve problems quickly, the content is structured to allow readers to navigate this comprehensive resource in 4 different ways