Download or read book Proceedings of the 1980 International Microelectronics Symposium written by and published by . This book was released on 1980 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of the International Microelectronics Symposium written by and published by . This book was released on 1981 with total page 482 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of the International Symposium on Microelectronics written by and published by . This book was released on 1995 with total page 592 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings written by and published by . This book was released on 1984 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book National Union Catalog written by and published by . This book was released on 1981 with total page 1032 pages. Available in PDF, EPUB and Kindle. Book excerpt: Includes entries for maps and atlases.
Download or read book Proceedings of the 3rd International Microelectronics Conference written by and published by . This book was released on 1984 with total page 524 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 1995 International Symposium on Microelectronics written by International Symposium on Microelectronics and published by . This book was released on 1995 with total page 584 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book written by 国立国会図書館 (Japan) and published by . This book was released on 1972 with total page 672 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Download or read book RF and Microwave Microelectronics Packaging written by Ken Kuang and published by Springer Science & Business Media. This book was released on 2009-12-01 with total page 295 pages. Available in PDF, EPUB and Kindle. Book excerpt: RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
Download or read book 1987 Proceedings written by and published by . This book was released on 1987 with total page 696 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Index of Conference Proceedings Received written by British Library. Lending Division and published by . This book was released on 1988 with total page 492 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Printed Films written by Maria Prudenziati and published by Elsevier. This book was released on 2012-08-30 with total page 609 pages. Available in PDF, EPUB and Kindle. Book excerpt: Whilst printed films are currently used in varied devices across a wide range of fields, research into their development and properties is increasingly uncovering even greater potential. Printed films provides comprehensive coverage of the most significant recent developments in printed films and their applications.Materials and properties of printed films are the focus of part one, beginning with a review of the concepts, technologies and materials involved in their production and use. Printed films as electrical components and silicon metallization for solar cells are discussed, as are conduction mechanisms in printed film resistors, and thick films in packaging and microelectronics. Part two goes on to review the varied applications of printed films in devices. Printed resistive sensors are considered, as is the role of printed films in capacitive, piezoelectric and pyroelectric sensors, mechanical micro-systems and gas sensors. The applications of printed films in biosensors, actuators, heater elements, varistors and polymer solar cells are then explored, followed by a review of screen printing for the fabrication of solid oxide fuel cells and laser printed micro- and meso-scale power generating devices.With its distinguished editors and international team of expert contributors, Printed films is a key text for anyone working in such fields as microelectronics, fuel cell and sensor technology in both industry and academia. - Provides a comprehensive analysis of the most significant recent developments in printed films and their applications - Reviews the concepts, properties, technologies and materials involved in the production and use of printed films - Analyses the varied applications of printed films in devices, including printed restrictive sensors for physical quantities and printed thick film mechanical micro-systems (MEMS), among others
Download or read book Electronics Packaging Forum written by James E. Morris and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 459 pages. Available in PDF, EPUB and Kindle. Book excerpt: Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter.
Download or read book Influence of Temperature on Microelectronics and System Reliability written by Pradeep Lall and published by CRC Press. This book was released on 2020-07-09 with total page 327 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
Download or read book Product Reliability Maintainability and Supportability Handbook written by Michael Pecht and published by CRC Press. This book was released on 1995-05-04 with total page 450 pages. Available in PDF, EPUB and Kindle. Book excerpt: This unique publication addresses the role of reliability, maintainability, and supportability in the life-cycle of a product, in the context of product effectiveness and worth. It emphasizes all aspects of producing an effective electrical or mechanical system. This is the only handbook available on this subject and the only book that is this comprehensive and informative. The Product Reliability, Maintainability, and Supportability Handbook examines the logistics, cost, and the physics of failure-topics never before found in a single volume on reliability. It describes the factors that affect product effectiveness and worth: performance, reliability, design effectiveness and margin for error, availability, affordability, use effectiveness, and logistic effectiveness. The handbook contains 13 in-depth chapters, opening with an introduction on product effectiveness and worth and concluding with reliability and maintainability data that can be combined with performance data to assess overall effectiveness of the product. The pages are filled with valuable information that can be easily and quickly put to practical use. Basic principles of the mathematical theory of probability and necessary background are provided. Concepts and basic theory of reliability in terms of probability and statistical inference are also given. Techniques for deriving probabilistic models from observational data as well as reliability models and associated validation techniques are detailed. Software and software reliability, quality, and safety are all covered, including the development life-cycle process and mechanisms by which software errors are introduced. The book presents design guidelines and techniques and the requirements for materials, manufacturing, and assembly. Learn how to analyze the reliability of redundant and fault-tolerant products. Use the methods for modeling and analyzing failures of repairable products that normally exhibit wearout characteristics. The Product Reliability, Maintainability, and Supportability Handbook also provides reliability improvement techniques to improve the competitiveness of existing products. The book includes helpful summaries and numerous problem sections to reinforce and test learned information. This reference source is the guide that professionals and technical managers should turn to when they need a comprehensive and detailed overview of everything that goes into producing systems and products that meet customer needs in an effective and timely manner.
Download or read book The Social and Economic Impact of New Technology 1978 84 A Select Bibliography written by Leslie Grayson and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 92 pages. Available in PDF, EPUB and Kindle. Book excerpt: Silicon chip technology; microprocessor technology; information technology; or quite simply new technology. These are some of the names representing the microelectronics revolution depending upon the audience being addressed by speaker or writer. No previous new industrial development has caused such widespread publicity and discussion amongst users and researchers as the new technology. Concern is being expressed about the effects of new technology on employment, job satisfaction, social life, leisure activities and the economics of commerce and industry. The late 70s saw many doom-laden predictions of those effects but by 1983 both management and trade unions were taking a more objective view of the social and economic impacts, and many correspondents now see the new technology as a means of opening up new industries and overcoming the effects of world recessions. The "chip" has involved the factory floor, the office, the supermarket and the home. Electronic funds transfer, electronic shopping, microelectronic domestic appliances, word processors and microprocessor-controlled machinery mean that the new technology has pervaded all aspects of social and economic life, and the developed countries are now coming to accept it as part of society as a whole. Inevitably the flood of literature on the social and economic impacts of new technology has been overwhelming. Unfortunately the quality of information and arguments propagated at conferences, in journal papers and research reports has indicated that there has been little quantifiable evidence available on the effects of these impacts.
