Download or read book Proceedings 1962 Electronic Components Conference written by and published by . This book was released on 1962 with total page 238 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of the National Electronics Conference written by and published by . This book was released on 1963 with total page 840 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliability Abstracts and Technical Reviews written by and published by . This book was released on 1962 with total page 704 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Index of Conference Proceedings Received written by British Library. Lending Division and published by . This book was released on 1984 with total page 888 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings 1965 Electronic Components Conference Washington D C written by and published by . This book was released on 1965 with total page 406 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Argonne List of Serials written by Argonne National Laboratory. Library Services Department and published by . This book was released on 1968 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electrical Contacts written by Milenko Braunovic and published by CRC Press. This book was released on 2017-12-19 with total page 640 pages. Available in PDF, EPUB and Kindle. Book excerpt: Various factors affect the performance of electrical contacts, including tribological, mechanical, electrical, and materials aspects. Although these behaviors have been studied for many years, they are not widely used or understood in practice. Combining approaches used across the globe, Electrical Contacts: Fundamentals, Applications, and Technology integrates advances in research and development in the tribological, material, and analytical aspects of electrical contacts with new data on electrical current transfer at the micro- and nanoscales. Taking an application-oriented approach, the authors illustrate how material characteristics, tribological behavior, and loading impact the degradation of contacts, formation of intermetallics, and overall reliability and performance. Coverage is divided broadly into three sections, with the first focused on mechanics, tribology, materials, current and heat transfer, and basic reliability issues of electrical contacts. The next section explores applications, such as power connections, electronic connections, and sliding contacts, while the final section presents the diagnostic and monitoring techniques used to investigate and measure phenomena occurring at electrical contact interfaces. Numerous references to current literature reflect the fact that this book is the most comprehensive survey in the field. Explore an impressive collection of data, theory, and practical applications in Electrical Contacts: Fundamentals, Applications, and Technology, a critical tool for anyone investigating or designing electrical equipment with improved performance and reliability in mind.
Download or read book Preindications of Failure in Electronic Components written by J. W. Klapheke and published by . This book was released on 1965 with total page 68 pages. Available in PDF, EPUB and Kindle. Book excerpt: This report discusses state-of-the-art information and techniques concerned with indications of potential degradation and catastrophic failure in electronic components. The objective of this survey is to present a comprehensive description of past, present, and future planned work on preindicators of failure for certain electronic components. This study is intended to provide basic information for future development in automatic checkout equipment. The following electronic parts were covered in the survey: semiconductors (transistors, diodes, and microcircuits), resistors, capacitors, inductors, computer cores, other items used in a computer, and vacuum tubes. Such items as wire, insulation, lamps, relays, and rotary devices were not considered. Precursors of failure have been investigated for electronic components but few have been identified at the present time. Most of these investigations were undertaken as part of programs directed at physics of failure, screening, or accelerated testing. The results of this study show that predictors of failure for semiconductors (transistors, diodes, and microcircuits) have received more attention than other types of parts. Current noise (l/f noise) and infrared emission profiles show promise as precursors that would apply to all types of semiconductors. Apparently computer cores and inductors are the least considered. (Author).
Download or read book SCR written by and published by . This book was released on 1962 with total page 34 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advanced Flip Chip Packaging written by Ho-Ming Tong and published by Springer Science & Business Media. This book was released on 2013-03-20 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Download or read book Nano Bio Electronic Photonic and MEMS Packaging written by C. P.(Ching-Ping) Wong and published by Springer Nature. This book was released on 2021-03-17 with total page 582 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging for nano devices with applications to electronics, photonics, biological and biomedical research and products. It covers topics such as bio sensing electronics, bio device packaging, MEMS for bio devices and much more, including: Offers a comprehensive overview of nano and bio packaging and their materials based on their chemical and physical sciences and mechanical, electrical and material engineering perspectives; Discusses nano materials as power energy sources, computational analyses of nano materials including molecular dynamic (MD) simulations and DFT calculations; Analyzes nanotubes, superhydrophobic self-clean Lotus surfaces; Covers nano chemistry for bio sensor/bio material device packaging. This second edition includes new chapters on soft materials-enabled packaging for stretchable and wearable electronics, state of the art miniaturization for active implantable medical devices, recent LED packaging and progress, nanomaterials for recent energy storage devices such as lithium ion batteries and supercapacitors and their packaging. Nano- Bio- Electronic, Photonic and MEMS Packaging is the ideal book for all biomedical engineers, industrial electronics packaging engineers, and those engaged in bio nanotechnology applications research.
Download or read book Handbook of Polymer Coatings for Electronics written by James J. Licari and published by William Andrew. This book was released on 1990-12-31 with total page 409 pages. Available in PDF, EPUB and Kindle. Book excerpt: This completely revised edition remains the only comprehensive treatise on polymer coatings for electronics. Since the original edition, the applications of coatings for the environmental protection of electronic systems have greatly increased, largely driven by the competitive need to reduce costs, weight and volume. The demands for high-speed circuits for the rapid processing of signals and data, high-density circuits for the storage and retrieval of megabits of memory, and the improved reliability required of electronics for guiding and controlling weapons and space vehicles have triggered the development of many new and improved coating polymers and formulations. Both the theoretical aspects of coatings (molecular structure of polymer types and their correlation with electrical and physical properties) and applied aspects (functions, deposition processes, applications, testing) are covered in the book. Over 100 proprietary coating formulations were reviewed, their properties collated, and tables of comparative properties prepared. This book is useful as both a primer and as a handbook for collecting properties data.
Download or read book Solar Energy written by United States. Energy Research and Development Administration. Technical Information Center and published by . This book was released on 1976 with total page 602 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Influence of Temperature on Microelectronics and System Reliability written by Pradeep Lall and published by CRC Press. This book was released on 2020-07-09 with total page 327 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
Download or read book The ELFNET Book on Failure Mechanisms Testing Methods and Quality Issues of Lead Free Solder Interconnects written by Günter Grossmann and published by Springer Science & Business Media. This book was released on 2011-05-12 with total page 313 pages. Available in PDF, EPUB and Kindle. Book excerpt: The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is the work of the European network ELFNET which was founded by the European Commission in the 6th Framework Programme. It brings together contributions from the leading European experts in lead-free soldering. The limited validity of testing methods originating from tin-lead solder was a major point of concern in ELFNET members' discussions. As a result, the network's reliability group decided to bring together the material properties of lead-free solders, as well as the basics of material science, and to discuss their influence on the procedures for accelerated testing. This has led to a matrix of failure mechanisms and their activation and, as a result, to a comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints. The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is written for scientists, engineers and researchers involved with lead-free electronics.
Download or read book Environmental Testing Techniques for Electronics and Materials written by Geoffrey W. A. Dummer and published by Elsevier. This book was released on 2013-10-22 with total page 473 pages. Available in PDF, EPUB and Kindle. Book excerpt: Environmental Testing Techniques for Electronics and Materials reviews environmental testing techniques for evaluating the performance of electronic equipment, components, and materials. Environmental test planning, test methods, and instrumentation are described, along with the general environmental conditions under which equipment must operate. This book is comprised of 15 chapters and begins by explaining why environmental testing is necessary and describing the environment in which electronics must operate. The next chapter considers how an environmental test plan is designed; the methods for the environmental testing of components and materials; instrumentation and control of test chambers; shock and vibration test instrumentation; and requirements for specification writing. The reader is then introduced to factors that might affect the reliability of equipment, including high humidity environment; galvanic corrosion problems; high- and low-temperature environments; mechanical and associated hazards; transport hazards; and long-term storage. Problems posed by high altitude and space environments, nuclear radiation, and acoustic noise are also discussed. The final chapter is devoted to environmental protection techniques and looks at the effects of climatic environments on radio interference as well as the effects of the environment on the human operator. This monograph will be of value to materials scientists and electronics engineers as well as those engaged in the design, development, and production of professional and military equipment.
Download or read book National symposium on space electronics and telemetry written by and published by . This book was released on 1962 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt:
