Download or read book Pressure Fluctuations in the Hermetric sic Cavity written by Andreĭ Ivanovich Naumenko and published by . This book was released on 1963 with total page 20 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1991 with total page 252 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Semiconductor Wafer Bonding Science Technology and Applications V written by Charles E. Hunt and published by The Electrochemical Society. This book was released on 2001 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book SiC Materials and Devices written by Michael Shur and published by World Scientific. This book was released on 2007 with total page 143 pages. Available in PDF, EPUB and Kindle. Book excerpt: Silicon carbide is known to have been investigated since 1907 when Captain H J Round demonstrated yellow and blue emission by applying bias between a metal needle and an SiC crystal. The potential of using SiC in semiconductor electronics was already recognized half a century ago. Despite its well-known properties, it has taken a few decades to overcome the exceptional technological difficulties of getting silicon carbide material to reach device quality and travel the road from basic research to commercialization.This second of two volumes reviews four important additional areas: the growth of SiC substrates; the deep defects in different SiC polytypes, which after many years of research still define the properties of bulk SiC and the performance and reliability of SiC devices; recent work on SiC JFETs; and the complex and controversial issues important for bipolar devices.Recognized leaders in the field, the contributors to this volume provide up-to-date reviews of further state-of-the-art areas in SiC technology and materials and device research.
Download or read book An Introduction to Microelectromechanical Systems Engineering written by Nadim Maluf and published by Artech House. This book was released on 2004 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Bringing you up-to-date with the latest developments in MEMS technology, this major revision of the best-selling An Introduction to Microelectromechanical Systems Engineering offers you a current understanding of this cutting-edge technology. You gain practical knowledge of MEMS materials, design, and manufacturing, and learn how it is being applied in industrial, optical, medical and electronic markets. The second edition features brand new sections on RF MEMS, photo MEMS, micromachining on materials other than silicon, reliability analysis, plus an expanded reference list. With an emphasis on commercialized products, this unique resource helps you determine whether your application can benefit from a MEMS solution, understand how other applications and companies have benefited from MEMS, and select and define a manufacturable MEMS process for your application. You discover how to use MEMS technology to enable new functionality, improve performance, and reduce size and cost. The book teaches you the capabilities and limitations of MEMS devices and processes, and helps you communicate the relative merits of MEMS to your company's management. From critical discussions on design operation and process fabrication of devices and systems, to a thorough explanation of MEMS packaging, this easy-to-understand book clearly explains the basics of MEMS engineering, making it an invaluable reference for your work in the field.
Download or read book Physics and Technology of Silicon Carbide Devices written by George Gibbs and published by . This book was released on 2016-10-01 with total page 284 pages. Available in PDF, EPUB and Kindle. Book excerpt: Silicon (Si) is by far the most widely used semiconductor material for power devices. On the other hand, Si-based power devices are approaching their material limits, which has provoked a lot of efforts to find alternatives to Si-based power devices for better performance. With the rapid innovations and developments in the semiconductor industry, Silicon Carbide (SiC) power devices have progressed from immature prototypes in laboratories to a viable alternative to Si-based power devices in high-efficiency and high-power density applications. SiC devices have numerous persuasive advantages--high-breakdown voltage, high-operating electric field, high-operating temperature, high-switching frequency and low losses. Silicon Carbide (SiC) devices belong to the so-called wide band gap semiconductor group, which offers a number of attractive characteristics for high voltage power semiconductors when compared to commonly used silicon (Si). Recently, some SiC power devices, for example, Schottky-barrier diodes (SBDs), metal-oxide-semiconductor field-effecttransistors (MOSFETs), junction FETs (JFETs), and their integrated modules have come onto the market. Physics and Technology of Silicon Carbide Devices abundantly describes recent technologies on manufacturing, processing, characterization, modeling, etc. for SiC devices.
Download or read book Semiconductor Packaging written by Andrea Chen and published by CRC Press. This book was released on 2016-04-19 with total page 216 pages. Available in PDF, EPUB and Kindle. Book excerpt: In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Download or read book Expanding the Vision of Sensor Materials written by Committee on New Sensor Technologies: Materials and Applications and published by National Academies Press. This book was released on 1995-07-06 with total page 146 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in materials science and engineering have paved the way for the development of new and more capable sensors. Drawing upon case studies from manufacturing and structural monitoring and involving chemical and long wave-length infrared sensors, this book suggests an approach that frames the relevant technical issues in such a way as to expedite the consideration of new and novel sensor materials. It enables a multidisciplinary approach for identifying opportunities and making realistic assessments of technical risk and could be used to guide relevant research and development in sensor technologies.
Download or read book Silicon Carbide written by Peter Friedrichs and published by John Wiley & Sons. This book was released on 2011-04-08 with total page 528 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book prestigiously covers our current understanding of SiC as a semiconductor material in electronics. Its physical properties make it more promising for high-powered devices than silicon. The volume is devoted to the material and covers methods of epitaxial and bulk growth. Identification and characterization of defects is discussed in detail. The contributions help the reader to develop a deeper understanding of defects by combining theoretical and experimental approaches. Apart from applications in power electronics, sensors, and NEMS, SiC has recently gained new interest as a substrate material for the manufacture of controlled graphene. SiC and graphene research is oriented towards end markets and has high impact on areas of rapidly growing interest like electric vehicles. The list of contributors reads like a "Who's Who" of the SiC community, strongly benefiting from collaborations between research institutions and enterprises active in SiC crystal growth and device development.
Download or read book Hermeticity Testing of MEMS and Microelectronic Packages written by Suzanne Costello and published by Artech House. This book was released on 2013-10-01 with total page 197 pages. Available in PDF, EPUB and Kindle. Book excerpt: Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required. This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book includes up-to-date and applicable test methods for today’s package types. The authors cover the history and development of packaging, along with a view to understanding initial hermeticity testing requirements and the subsequent limitations of these methods when applied to new package types.
Download or read book Optical Thermal Response of Laser Irradiated Tissue written by Ashley J. Welch and published by Springer Science & Business Media. This book was released on 2011-01-15 with total page 951 pages. Available in PDF, EPUB and Kindle. Book excerpt: The second edition maintains the standard of excellence established in the first edition, while adjusting the content to reflect changes in tissue optics and medical applications since 1995. The material concerning light propagation now contains new chapters devoted to electromagnetic theory for coherent light. The material concerning thermal laser-tissue interactions contains a new chapter on pulse ablation of tissue. The medical applications section now includes several new chapters on Optical Coherent Tomography, acoustic imaging, molecular imaging, forensic optics and nerve stimulation. A detailed overview is provided of the optical and thermal response of tissue to laser irradiation along with diagnostic and therapeutic examples including fiber optics. Sufficient theory is included in the book so that it is suitable for a one or two semester graduate or for senior elective courses. Material covered includes (1) light propagation and diagnostic application; (2) the thermal response of tissue and therapeutic application; (3) denaturation; and (4) ablation. The theory and applications provide researchers with sufficient detail that this volume will become the primary reference for laser-tissue interactions and medical applications.
Download or read book The Hermetic and Alchemical Writings of Aureolus Philippus Theophrastus Bombast of Hohenheim Called Paracelsus the Great written by Paracelsus and published by . This book was released on 1894 with total page 420 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book National Electrical Code written by National Fire Protection Association and published by NationalFireProtectionAssoc. This book was released on 2007 with total page 14 pages. Available in PDF, EPUB and Kindle. Book excerpt: Presents the latest electrical regulation code that is applicable for electrical wiring and equipment installation for all buildings, covering emergency situations, owner liability, and procedures for ensuring public and workplace safety.
Download or read book Semiconductor Laser Engineering Reliability and Diagnostics written by Peter W. Epperlein and published by John Wiley & Sons. This book was released on 2013-01-25 with total page 522 pages. Available in PDF, EPUB and Kindle. Book excerpt: This reference book provides a fully integrated novel approach to the development of high-power, single-transverse mode, edge-emitting diode lasers by addressing the complementary topics of device engineering, reliability engineering and device diagnostics in the same book, and thus closes the gap in the current book literature. Diode laser fundamentals are discussed, followed by an elaborate discussion of problem-oriented design guidelines and techniques, and by a systematic treatment of the origins of laser degradation and a thorough exploration of the engineering means to enhance the optical strength of the laser. Stability criteria of critical laser characteristics and key laser robustness factors are discussed along with clear design considerations in the context of reliability engineering approaches and models, and typical programs for reliability tests and laser product qualifications. Novel, advanced diagnostic methods are reviewed to discuss, for the first time in detail in book literature, performance- and reliability-impacting factors such as temperature, stress and material instabilities. Further key features include: practical design guidelines that consider also reliability related effects, key laser robustness factors, basic laser fabrication and packaging issues; detailed discussion of diagnostic investigations of diode lasers, the fundamentals of the applied approaches and techniques, many of them pioneered by the author to be fit-for-purpose and novel in the application; systematic insight into laser degradation modes such as catastrophic optical damage, and a wide range of technologies to increase the optical strength of diode lasers; coverage of basic concepts and techniques of laser reliability engineering with details on a standard commercial high power laser reliability test program. Semiconductor Laser Engineering, Reliability and Diagnostics reflects the extensive expertise of the author in the diode laser field both as a top scientific researcher as well as a key developer of high-power highly reliable devices. With invaluable practical advice, this new reference book is suited to practising researchers in diode laser technologies, and to postgraduate engineering students.
Download or read book Seals and Sealing Handbook written by Ronald Horace Warring and published by . This book was released on 1981 with total page 452 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Museum microclimates written by Tim Padfield and published by . This book was released on 2007 with total page 283 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Handbook of Wafer Bonding written by Peter Ramm and published by John Wiley & Sons. This book was released on 2012-02-13 with total page 435 pages. Available in PDF, EPUB and Kindle. Book excerpt: The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
