Download or read book Power Integrity for Nanoscale Integrated Systems written by Raj Nair and published by McGraw-Hill Education. This book was released on 2014-03-19 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.Proven methods for noise-tolerant nanoscale integrated circuit design This leading-edge guide discusses the impact of power integrity from a design perspective, emphasizing phenomena and problems induced by power integrity degradation and the latest design trends, including low-power design. Power Integrity for Nanoscale Integrated Systems describes how these problems can be forecast early in the design process and the countermeasures that can be used to address them, such as the inclusion of inductance and accurate modeling for PI analysis, as well as robust circuit design. Detailed examples and a case study on the IBM POWER7+ processor illustrate real-world applications of the techniques presented in this practical resource. Coverage includes: Significance of power integrity for integrated circuits Supply and substrate noise impact on circuits Clock generation and distribution with power integrity Signal and power integrity design for I/O circuits Power integrity degradation and modeling Lumped, distributed, and 3D modeling for power integrity Chip temperature and PI impact Low-power techniques and PI impact Power integrity case study using the IBM POWER7+ processor chip Carbon nanotube interconnects for power delivery

Download or read book Power Integrity Analysis and Management for Integrated Circuits written by Raj Nair and published by Prentice-Hall PTR. This book was released on 2010 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: As chips continue to scale, power integrity issues are introducing unexpected project complexity and cost. In this book, two leading industry innovators thoroughly discuss the power integrity challenges that engineers face in designing at nanoscale levels, introduce new analysis and management techniques for addressing these issues, and provide breakthrough tools for hands-on problem solving. --

Download or read book Power Integrity for Nanoscale Integrated Systems written by Masanori Hashimoto and published by McGraw Hill Professional. This book was released on 2014-03-07 with total page 417 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proven methods for noise-tolerant nanoscale integrated circuit design This leading-edge guide discusses the impact of power integrity from a design perspective, emphasizing phenomena and problems induced by power integrity degradation and the latest design trends, including low-power design. Power Integrity for Nanoscale Integrated Systems describes how these problems can be forecast early in the design process and the countermeasures that can be used to address them, such as the inclusion of inductance and accurate modeling for PI analysis, as well as robust circuit design. Detailed examples and a case study on the IBM POWER7+ processor illustrate real-world applications of the techniques presented in this practical resource. Coverage includes: Significance of power integrity for integrated circuits Supply and substrate noise impact on circuits Clock generation and distribution with power integrity Signal and power integrity design for I/O circuits Power integrity degradation and modeling Lumped, distributed, and 3D modeling for power integrity Chip temperature and PI impact Low-power techniques and PI impact Power integrity case study using the IBM POWER7+ processor chip Carbon nanotube interconnects for power delivery

Download or read book e Learning e Education and Online Training written by Guanglu Sun and published by Springer Nature. This book was released on 2019-11-18 with total page 449 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the proceedings of the 5th International Conference on e-Learning, e-Education, and Online Training, eLEOT 2019, held in Kunming, China, in August 2019. The 46 revised full papers presented were carefully reviewed and selected from 99 submissions. They focus on most recent and innovative trends in this broad area, ranging from distance education to collaborative learning, from interactive learning environments to the modelling of STEM (Science, Technology, Mathematics, Engineering) curricula.

Download or read book Electrical Modeling and Design for 3D System Integration written by Er-Ping Li and published by John Wiley & Sons. This book was released on 2012-04-10 with total page 394 pages. Available in PDF, EPUB and Kindle. Book excerpt: New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.

Download or read book Power Integrity for I O Interfaces written by Vishram S. Pandit and published by Pearson Education. This book was released on 2010-10-13 with total page 464 pages. Available in PDF, EPUB and Kindle. Book excerpt: Foreword by Joungho Kim The Hands-On Guide to Power Integrity in Advanced Applications, from Three Industry Experts In this book, three industry experts introduce state-of-the-art power integrity design techniques for today’s most advanced digital systems, with real-life, system-level examples. They introduce a powerful approach to unifying power and signal integrity design that can identify signal impediments earlier, reducing cost and improving reliability. After introducing high-speed, single-ended and differential I/O interfaces, the authors describe on-chip, package, and PCB power distribution networks (PDNs) and signal networks, carefully reviewing their interactions. Next, they walk through end-to-end PDN and signal network design in frequency domain, addressing crucial parameters such as self and transfer impedance. They thoroughly address modeling and characterization of on-chip components of PDNs and signal networks, evaluation of power-to-signal coupling coefficients, analysis of Simultaneous Switching Output (SSO) noise, and many other topics. Coverage includes The exponentially growing challenge of I/O power integrity in high-speed digital systems PDN noise analysis and its timing impact for single-ended and differential interfaces Concurrent design and co-simulation techniques for evaluating all power integrity effects on signal integrity Time domain gauges for designing and optimizing components and systems Power/signal integrity interaction mechanisms, including power noise coupling onto signal trace and noise amplification through signal resonance Performance impact due to Inter Symbol Interference (ISI), crosstalk, and SSO noise, as well as their interactions Validation techniques, including low impedance VNA measurements, power noise measurements, and characterization of power-to-signal coupling effects Power Integrity for I/O Interfaces will be an indispensable resource for everyone concerned with power integrity in cutting-edge digital designs, including system design and hardware engineers, signal and power integrity engineers, graduate students, and researchers.

Download or read book Synthesis of Power Distribution to Manage Signal Integrity in Mixed Signal ICs written by Balsha R. Stanisic and published by Springer Science & Business Media. This book was released on 1996-05-31 with total page 240 pages. Available in PDF, EPUB and Kindle. Book excerpt: The move to higher levels of integration has increased the fraction of application-specific integrated circuit (ASIC) designs containing both analog and digital circuits. While the die area for the analog portion of these chips is modest, the design time is often significant. This has motivated the development of automated analog physical design tools for cell-level place-and-route and system-level signal-integrity-routing. To date, there is no tool that has specifically addressed the critical design task of synthesizing the power distribution for the analog portion of an analog or mixed-signal ASIC. Synthesis of Power Distribution to Manage Signal Integrity in Mixed-Signal ICs describes algorithms for analog power distribution synthesis and demonstrates their effectiveness. Existing digital power bus synthesis algorithms have failed to address critical concerns for analog circuitry, thus yielding unacceptable results. These tools synthesize only the bus component of power distribution networks and only consider simplified DC aspects of macros and busses. Readers of the companion book in this series, Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits (Kluwer Academic Publishers), already recognize the inadequacy of this simplified view of the noise and power distribution problem in mixed-signal integrated circuits. Synthesis of Power Distribution to Manage Signal Integrity in Mixed-Signal ICs addresses power distribution synthesis for mixed-signal integrated circuits. Several key challenges in power distribution design are identified and automated methods to overcome them are described. This book presents a new formulation for the analog power distribution synthesis problem which synthesizes both the power busses power I/O cell assignment by evaluating DC, AC, and transient interaction between the macros, busses, chip substrate, and package. Furthermore, algorithms are introduced which simultaneously optimize power I/O cell assignment, macro cell substrate coupling, power bus topology selection and power bus sizing. Synthesis of Power Distribution to Manage Signal Integrity in Mixed-Signal ICs will be of interest to CAD designers and researchers specializing in physical design, modelling and circuit synthesis.

Download or read book Power Integrity Modeling and Design for Semiconductors and Systems written by Madhavan Swaminathan and published by Prentice-Hall PTR. This book was released on 2008 with total page 504 pages. Available in PDF, EPUB and Kindle. Book excerpt: Madhavan Swaminathanreceived his B.E. in Electronics and Communication from Regional Engineering College, Tiruchirapalli in 1985 and his M.S. and Ph.D. degrees in Electrical Engineering from Syracuse University in 1989 and 1991, respectively. He is currently the Joseph M. Pettit Professor in Electronics in the School of Electrical and Computer Engineering and Deputy Director of the Packaging Research Center, Georgia Tech. He is also the cofounder of Jacket Micro Devices, a company specializing in RF modules for wireless applications. Prior to joining Georgia Tech he was with IBM where he worked on packaging for super computers. His work on Power Integrity has won several awards and he was made an IEEE Fellow for his contributions in this area. Ege Enginreceived his B.S. and M.S. degrees in electrical engineering from Middle East Technical University, Ankara, Turkey, and from University of Paderborn, Germany. From 2001 to 2004 he was with the Fraunhofer-Institute for Reliability and Microintegration in Berlin. During this time he also received his Ph.D. from the University of Hannover, Germany. He is currently a Research Engineer in the School of Electrical and Computer Engineering and an Assistant Research Director of the Packaging Research Center at Georgia Tech. He has more than 40 publications in refereed journals and conferences in the areas of signal and power integrity modeling and simulation. The First Comprehensive, Example-Rich Guide to Power Integrity Modeling Professionals need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high-speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art. Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise. The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications. The authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain plane modeling, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for time- and frequency-domain analysis Introduce three leading time domain simulation methods: rational function methods, signal flow graphs, and MNA Present these and other advanced case studies: high-speed servers, high-speed differential signaling, chip package analysis, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that takes advantage of high-speed systems. During my (M.S) undergraduate days in a little town called Tiruchirapalli in Southern India, we used to have frequent voltage and current surges that knocked out all the electrical equipment such as fans and lights in our rooms. Frustrated, my friend once remarked, "We are Powerless to solve the Current problem." Of course, he meant this in jest, but little did I realize that this would become the theme of my research for many years. Though my area is on Semiconductors and computer system

Download or read book Power Integrity for I O Interfaces written by Vishram S. Pandit and published by . This book was released on 1900 with total page 417 pages. Available in PDF, EPUB and Kindle. Book excerpt: Foreword by Joungho Kim The Hands-On Guide to Power Integrity in Advanced Applications, from Three Industry Experts In this book, three industry experts introduce state-of-the-art power integrity design techniques for today's most advanced digital systems, with real-life, system-level examples. They introduce a powerful approach to unifying power and signal integrity design that can identify signal impediments earlier, reducing cost and improving reliability. After introducing high-speed, single-ended and differential I/O interfaces, the authors describe on-chip, package, and PCB p.

Download or read book Circuits at the Nanoscale written by Krzysztof Iniewski and published by CRC Press. This book was released on 2018-10-08 with total page 686 pages. Available in PDF, EPUB and Kindle. Book excerpt: Circuits for Emerging Technologies Beyond CMOS New exciting opportunities are abounding in the field of body area networks, wireless communications, data networking, and optical imaging. In response to these developments, top-notch international experts in industry and academia present Circuits at the Nanoscale: Communications, Imaging, and Sensing. This volume, unique in both its scope and its focus, addresses the state-of-the-art in integrated circuit design in the context of emerging systems. A must for anyone serious about circuit design for future technologies, this book discusses emerging materials that can take system performance beyond standard CMOS. These include Silicon on Insulator (SOI), Silicon Germanium (SiGe), and Indium Phosphide (InP). Three-dimensional CMOS integration and co-integration with Microelectromechanical (MEMS) technology and radiation sensors are described as well. Topics in the book are divided into comprehensive sections on emerging design techniques, mixed-signal CMOS circuits, circuits for communications, and circuits for imaging and sensing. Dr. Krzysztof Iniewski is a director at CMOS Emerging Technologies, Inc., a consulting company in Vancouver, British Columbia. His current research interests are in VLSI ciruits for medical applications. He has published over 100 research papers in international journals and conferences, and he holds 18 international patents granted in the United States, Canada, France, Germany, and Japan. In this volume, he has assembled the contributions of over 60 world-reknown experts who are at the top of their field in the world of circuit design, advancing the bank of knowledge for all who work in this exciting and burgeoning area.

Download or read book Graduate Programs in Engineering Applied Sciences 2011 Grad 5 written by Peterson's and published by Peterson's. This book was released on 2011-05-01 with total page 2072 pages. Available in PDF, EPUB and Kindle. Book excerpt: Peterson's Graduate Programs in Engineering & Applied Sciences contains a wealth of information on colleges and universities that offer graduate degrees in the fields of Aerospace/Aeronautical Engineering; Agricultural Engineering & Bioengineering; Architectural Engineering, Biomedical Engineering & Biotechnology; Chemical Engineering; Civil & Environmental Engineering; Computer Science & Information Technology; Electrical & Computer Engineering; Energy & Power engineering; Engineering Design; Engineering Physics; Geological, Mineral/Mining, and Petroleum Engineering; Industrial Engineering; Management of Engineering & Technology; Materials Sciences & Engineering; Mechanical Engineering & Mechanics; Ocean Engineering; Paper & Textile Engineering; and Telecommunications. Up-to-date data, collected through Peterson's Annual Survey of Graduate and Professional Institutions, provides valuable information on degree offerings, professional accreditation, jointly offered degrees, part-time and evening/weekend programs, postbaccalaureate distance degrees, faculty, students, degree requirements, entrance requirements, expenses, financial support, faculty research, and unit head and application contact information. As an added bonus, readers will find a helpful "See Close-Up" link to in-depth program descriptions written by some of these institutions. These Close-Ups offer detailed information about the specific program or department, faculty members and their research, and links to the program Web site. In addition, there are valuable articles on financial assistance and support at the graduate level and the graduate admissions process, with special advice for international and minority students. Another article discusses important facts about accreditation and provides a current list of accrediting agencies.

Download or read book Physical Design for 3D Integrated Circuits written by Aida Todri-Sanial and published by CRC Press. This book was released on 2017-12-19 with total page 397 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.

Download or read book Peterson s Graduate Programs in Engineering Applied Sciences Aerospace Aeronautical Engineering Agricultural Engineering Bioengineering and Architectural Engineering 2011 written by Peterson's and published by Peterson's. This book was released on 2011-05-01 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt: Peterson's Graduate Programs in Engineering & Applied Sciences, Aerospace/Aeronautical Engineering, Agricultural Engineering & Bioengineering, and Architectural Engineering contains a wealth of information on colleges and universities that offer graduate work these exciting fields. The institutions listed include those in the United States and Canada, as well as international institutions that are accredited by U.S. accrediting bodies. Up-to-date information, collected through Peterson's Annual Survey of Graduate and Professional Institutions, provides valuable information on degree offerings, professional accreditation, jointly offered degrees, part-time and evening/weekend programs, postbaccalaureate distance degrees, faculty, students, degree requirements, entrance requirements, expenses, financial support, faculty research, and unit head and application contact information. Readers will find helpful links to in-depth descriptions that offer additional detailed information about a specific program or department, faculty members and their research, and much more. In addition, there are valuable articles on financial assistance, the graduate admissions process, advice for international and minority students, and facts about accreditation, with a current list of accrediting agencies.

Download or read book Analytical Methodology of Tree Microstrip Interconnects Modelling For Signal Distribution written by Blaise Ravelo and published by Springer Nature. This book was released on 2019-11-21 with total page 233 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the modelling methodology of microstrip interconnects, discussing various structures of single-input multiple-output (SIMO) tree interconnects for signal integrity (SI) engineering. Further, it describes lumped and distributed transmission line elements based on single-input single-output (SIMO) models of symmetric and asymmetric trees, and investigates more complicated phenomenon, such as interbranch coupling. The modelling approaches are based on the analytical methods using the Z-, Y- and T-matrices. The established method enables the S-parameters and voltage transfer function of SIMO tree to be determined. Providing illustrative results with frequency and time domain analyses for each tree interconnect structure, the book is a valuable resource for researchers, engineers, and graduate students in fields of analogue, RF/microwave, digital and mixed circuit design, SI and manufacturing engineering.

Download or read book Intelligent System and Computing written by Yang Yi and published by BoD – Books on Demand. This book was released on 2020-04-29 with total page 296 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book “Intelligent System and Computing” reports the theory, mathematical models, algorithms, design methods, and applications of intelligent systems and computing. It covers various disciplines including computer and information science, electrical and computer engineering, natural sciences, economics, and neuroscience. The broad-ranging discussion covers the key disciplines in computational science and artificial intelligence as well as advances in neuromorphic computing, deep learning, the Internet of Things, computer vision, and many others. This volume provides both academics and professionals with a comprehensive overview of the field and presents areas for future research.

Download or read book Computer Aided Design of Analog Integrated Circuits and Systems written by Rob A. Rutenbar and published by John Wiley & Sons. This book was released on 2002-05-06 with total page 773 pages. Available in PDF, EPUB and Kindle. Book excerpt: The tools and techniques you need to break the analog design bottleneck! Ten years ago, analog seemed to be a dead-end technology. Today, System-on-Chip (SoC) designs are increasingly mixed-signal designs. With the advent of application-specific integrated circuits (ASIC) technologies that can integrate both analog and digital functions on a single chip, analog has become more crucial than ever to the design process. Today, designers are moving beyond hand-crafted, one-transistor-at-a-time methods. They are using new circuit and physical synthesis tools to design practical analog circuits; new modeling and analysis tools to allow rapid exploration of system level alternatives; and new simulation tools to provide accurate answers for analog circuit behaviors and interactions that were considered impossible to handle only a few years ago. To give circuit designers and CAD professionals a better understanding of the history and the current state of the art in the field, this volume collects in one place the essential set of analog CAD papers that form the foundation of today's new analog design automation tools. Areas covered are: * Analog synthesis * Symbolic analysis * Analog layout * Analog modeling and analysis * Specialized analog simulation * Circuit centering and yield optimization * Circuit testing Computer-Aided Design of Analog Integrated Circuits and Systems is the cutting-edge reference that will be an invaluable resource for every semiconductor circuit designer and CAD professional who hopes to break the analog design bottleneck.

Download or read book Noise Contamination in Nanoscale VLSI Circuits written by Selahattin Sayil and published by Springer Nature. This book was released on 2022-08-31 with total page 142 pages. Available in PDF, EPUB and Kindle. Book excerpt: This textbook provides readers with a comprehensive introduction to various noise sources that significantly reduce performance and reliability in nanometer-scale integrated circuits. The author covers different types of noise, such as crosstalk noise caused by signal switching of adjacent wires, power supply noise or IR voltage drop in the power line due to simultaneous buffer / gate switching events, substrate coupling noise, radiation-induced transients, thermally induced noise and noise due to process and environmental Coverages also includes the relationship between some of these noise sources, as well as compound effects, and modeling and mitigation of noise mechanisms.