Download or read book Plasma Processes for Semiconductor Fabrication written by W. N. G. Hitchon and published by Cambridge University Press. This book was released on 1999-01-28 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt: Plasma processing is a central technique in the fabrication of semiconductor devices. This self-contained book provides an up-to-date description of plasma etching and deposition in semiconductor fabrication. It presents the basic physics and chemistry of these processes, and shows how they can be accurately modeled. The author begins with an overview of plasma reactors and discusses the various models for understanding plasma processes. He then covers plasma chemistry, addressing the effects of different chemicals on the features being etched. Having presented the relevant background material, he then describes in detail the modeling of complex plasma systems, with reference to experimental results. The book closes with a useful glossary of technical terms. No prior knowledge of plasma physics is assumed in the book. It contains many homework exercises and serves as an ideal introduction to plasma processing and technology for graduate students of electrical engineering and materials science. It will also be a useful reference for practicing engineers in the semiconductor industry.
Download or read book Applications of Plasma Processes to VLSI Technology written by Takuo Sugano and published by Wiley-Interscience. This book was released on 1985-09-24 with total page 426 pages. Available in PDF, EPUB and Kindle. Book excerpt: Presents state-of-the-art research in microelectronic processing for very large scale integration. Emphasizing applications and techniques, this book provides considerable insight into Japan's technological effort in this important area of science. Focuses on research involving plasma deposition and dry etching. Considerable attention is devoted to MOS gate fabrication, the studies of the influence of process parameters on electrical properties, dry processing technologies, and the theory of plasma chemical reactions.
Download or read book Plasma Processing of Materials written by National Research Council and published by National Academies Press. This book was released on 1991-02-01 with total page 88 pages. Available in PDF, EPUB and Kindle. Book excerpt: Plasma processing of materials is a critical technology to several of the largest manufacturing industries in the worldâ€"electronics, aerospace, automotive, steel, biomedical, and toxic waste management. This book describes the relationship between plasma processes and the many industrial applications, examines in detail plasma processing in the electronics industry, highlights the scientific foundation underlying this technology, and discusses education issues in this multidisciplinary field. The committee recommends a coordinated, focused, and well-funded research program in this area that involves the university, federal laboratory, and industrial sectors of the community. It also points out that because plasma processing is an integral part of the infrastructure of so many American industries, it is important for both the economy and the national security that America maintain a strong leadership role in this technology.
Download or read book Plasma Processing of Semiconductors written by P.F. Williams and published by Springer Science & Business Media. This book was released on 2013-11-11 with total page 610 pages. Available in PDF, EPUB and Kindle. Book excerpt: Plasma Processing of Semiconductors contains 28 contributions from 18 experts and covers plasma etching, plasma deposition, plasma-surface interactions, numerical modelling, plasma diagnostics, less conventional processing applications of plasmas, and industrial applications. Audience: Coverage ranges from introductory to state of the art, thus the book is suitable for graduate-level students seeking an introduction to the field as well as established workers wishing to broaden or update their knowledge.
Download or read book Plasma Etching in Semiconductor Fabrication written by Russ A. Morgan and published by North-Holland. This book was released on 1985-01-01 with total page 316 pages. Available in PDF, EPUB and Kindle. Book excerpt: Hardbound. This book is based on a post-graduate study carried out by the author on plasma etching mechanisms of semiconductor materials such as silicon, silicon dioxide, photoresist and aluminium films used in integrated circuit fabrication. In this book he gives an extensive review of the chemistry of dry etching, sustaining mechanisms and reactor architecture. He also describes a study made on the measurement of the electrical characteristics and ionization conditions existing in a planar reactor. In addition, practical problems such as photoresist mask erosion have been investigated and the reader will find the photoresist chemistry very useful. The book contains a great deal of practical information on plasma etching processes. The electronics industry is continually seeking ways to improve the miniaturization of devices, and this account of the author's findings should be a useful contribution to the work of miniaturization.
Download or read book Fundamentals of Semiconductor Manufacturing and Process Control written by Gary S. May and published by John Wiley & Sons. This book was released on 2006-05-26 with total page 428 pages. Available in PDF, EPUB and Kindle. Book excerpt: A practical guide to semiconductor manufacturing from processcontrol to yield modeling and experimental design Fundamentals of Semiconductor Manufacturing and Process Controlcovers all issues involved in manufacturing microelectronic devicesand circuits, including fabrication sequences, process control,experimental design, process modeling, yield modeling, and CIM/CAMsystems. Readers are introduced to both the theory and practice ofall basic manufacturing concepts. Following an overview of manufacturing and technology, the textexplores process monitoring methods, including those that focus onproduct wafers and those that focus on the equipment used toproduce wafers. Next, the text sets forth some fundamentals ofstatistics and yield modeling, which set the foundation for adetailed discussion of how statistical process control is used toanalyze quality and improve yields. The discussion of statistical experimental design offers readers apowerful approach for systematically varying controllable processconditions and determining their impact on output parameters thatmeasure quality. The authors introduce process modeling concepts,including several advanced process control topics such asrun-by-run, supervisory control, and process and equipmentdiagnosis. Critical coverage includes the following: * Combines process control and semiconductor manufacturing * Unique treatment of system and software technology and managementof overall manufacturing systems * Chapters include case studies, sample problems, and suggestedexercises * Instructor support includes electronic copies of the figures andan instructor's manual Graduate-level students and industrial practitioners will benefitfrom the detailed exami?nation of how electronic materials andsupplies are converted into finished integrated circuits andelectronic products in a high-volume manufacturingenvironment. An Instructor's Manual presenting detailed solutions to all theproblems in the book is available from the Wiley editorialdepartment. An Instructor Support FTP site is also available.
Download or read book Semiconductor IC Plasma Dry Etching Process written by Kung Linliu and published by Independently Published. This book was released on 2020-02-11 with total page 57 pages. Available in PDF, EPUB and Kindle. Book excerpt: Semiconductor market value of 2018 was around 468.8 billion US dollars. It is increased for about 13.7% than year 2017. For 2019, it is estimated decrease about 10% to 13% which is 422 to 408 billion US dollars.This market is in a way winner takes all, for example, TSMC (Taiwan Semiconductor Manufacturing Company) which is the world leading semiconductor foundry company has more than 50% market share. Intel has more than 90% market share of personal computer CPU (Central Process Unit) for many years. However, the semiconductor IC process technology sometimes might change the rule of market. Just recently, AMD (Advanced Micro Devices, Inc.) has more than 17% market share of personal computer CPU because they use foundry of TSMC with 7nm EUV technology node (Extreme Ultraviolet, its wavelength is 13.5 nm, shorter wavelength has better critical dimension (CD) resolution for IC process).For the present time, there are four leading semiconductor companies in the world with EUV technology process node which are as follows: (1)Samsung: the world leading semiconductor IC process company for commodity IC such as DRAM、Flash memory and IC for cell phone. The world leading company in cell phone market share, Samsung has highest volume unit of mobile phone which is 75.1 million unit representing 23% of world market share. Samsung also is the leading company in OLED (organic light emitting diode) process technology and display panel which is more than 90% of world market share.(2)Intel: is the world leading company in personal computer CPU which has more than 90% market share of personal computer CPU (Central Process Unit) for many years. Intel is actually a world leading semiconductor IC technology in DRAM (many years ago) and Flash (at the present time) memory.(3)TSMC: TSMC is brief of Taiwan Semiconductor Manufacturing Company which is the world leading semiconductor foundry company has more than 50% market share. The author worked there for a few years as an R & D manager many years ago.(4)Micron: a world leading in DRAM and Flash memory IC.
Download or read book Plasma Etching Processes for Sub quarter Micron Devices written by G. S. Mathad and published by The Electrochemical Society. This book was released on 2000 with total page 396 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Plasma Processing of Nanomaterials written by R. Mohan Sankaran and published by CRC Press. This book was released on 2017-12-19 with total page 432 pages. Available in PDF, EPUB and Kindle. Book excerpt: We are at a critical evolutionary juncture in the research and development of low-temperature plasmas, which have become essential to synthesizing and processing vital nanoscale materials. More and more industries are increasingly dependent on plasma technology to develop integrated small-scale devices, but physical limits to growth, and other challenges, threaten progress. Plasma Processing of Nanomaterials is an in-depth guide to the art and science of plasma-based chemical processes used to synthesize, process, and modify various classes of nanoscale materials such as nanoparticles, carbon nanotubes, and semiconductor nanowires. Plasma technology enables a wide range of academic and industrial applications in fields including electronics, textiles, automotives, aerospace, and biomedical. A prime example is the semiconductor industry, in which engineers revolutionized microelectronics by using plasmas to deposit and etch thin films and fabricate integrated circuits. An overview of progress and future potential in plasma processing, this reference illustrates key experimental and theoretical aspects by presenting practical examples of: Nanoscale etching/deposition of thin films Catalytic growth of carbon nanotubes and semiconductor nanowires Silicon nanoparticle synthesis Functionalization of carbon nanotubes Self-organized nanostructures Significant advances are expected in nanoelectronics, photovoltaics, and other emerging fields as plasma technology is further optimized to improve the implementation of nanomaterials with well-defined size, shape, and composition. Moving away from the usual focus on wet techniques embraced in chemistry and physics, the author sheds light on pivotal breakthroughs being made by the smaller plasma community. Written for a diverse audience working in fields ranging from nanoelectronics and energy sensors to catalysis and nanomedicine, this resource will help readers improve development and application of nanomaterials in their own work. About the Author: R. Mohan Sankaran received the American Vacuum Society’s 2011 Peter Mark Memorial Award for his outstanding contributions to tandem plasma synthesis.
Download or read book Plasma Etching written by M. Sugawara and published by OUP Oxford. This book was released on 1998-05-28 with total page 362 pages. Available in PDF, EPUB and Kindle. Book excerpt: The focus of this book is the remarkable advances in understanding of low pressure RF (radio frequency) glow discharges. A basic analytical theory and plasma physics are explained. Plasma diagnostics are also covered before the practicalities of etcher use are explored.
Download or read book Handbook of Advanced Plasma Processing Techniques written by R.J. Shul and published by Springer Science & Business Media. This book was released on 2011-06-28 with total page 664 pages. Available in PDF, EPUB and Kindle. Book excerpt: Pattern transfer by dry etching and plasma-enhanced chemical vapor de position are two of the cornerstone techniques for modern integrated cir cuit fabrication. The success of these methods has also sparked interest in their application to other techniques, such as surface-micromachined sen sors, read/write heads for data storage and magnetic random access memory (MRAM). The extremely complex chemistry and physics of plasmas and their interactions with the exposed surfaces of semiconductors and other materi als is often overlooked at the manufacturing stage. In this case, the process is optimized by an informed "trial-and-error" approach which relies heavily on design-of-experiment techniques and the intuition of the process engineer. The need for regular cleaning of plasma reactors to remove built-up reaction or precursor gas products adds an extra degree of complexity because the interaction of the reactive species in the plasma with the reactor walls can also have a strong effect on the number of these species available for etching or deposition. Since the microelectronics industry depends on having high process yields at each step of the fabrication process, it is imperative that a full understanding of plasma etching and deposition techniques be achieved.
Download or read book Dry Etching Technology for Semiconductors written by Kazuo Nojiri and published by Springer. This book was released on 2014-10-25 with total page 126 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc.
Download or read book Plasma Electronics written by Toshiaki Makabe and published by CRC Press. This book was released on 2006-03-27 with total page 355 pages. Available in PDF, EPUB and Kindle. Book excerpt: Without plasma processing techniques, recent advances in microelectronics fabrication would not have been possible. But beyond simply enabling new capabilities, plasma-based techniques hold the potential to enhance and improve many processes and applications. They are viable over a wide range of size and time scales, and can be used for deposition,
Download or read book Advances in Neural Networks ISNN 2006 written by Jun Wang and published by Springer Science & Business Media. This book was released on 2006-05-11 with total page 1429 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is Volume III of a three volume set constituting the refereed proceedings of the Third International Symposium on Neural Networks, ISNN 2006. 616 revised papers are organized in topical sections on neurobiological analysis, theoretical analysis, neurodynamic optimization, learning algorithms, model design, kernel methods, data preprocessing, pattern classification, computer vision, image and signal processing, system modeling, robotic systems, transportation systems, communication networks, information security, fault detection, financial analysis, bioinformatics, biomedical and industrial applications, and more.
Download or read book Plasma Processes for Renewable Energy Technologies written by Masaaki Okubo and published by MDPI. This book was released on 2020-01-07 with total page 118 pages. Available in PDF, EPUB and Kindle. Book excerpt: The use of renewable energy is an effective solution for the prevention of global warming. On the other hand, environmental plasmas are one of powerful means to solve global environmental problems on nitrogen oxides, (NOx), sulfur oxides (SOx), particulate matter (PM), volatile organic compounds (VOC), and carbon dioxides (CO2) in the atmosphere. By combining both technologies, we can develop an extremely effective environmental improvement technology. Based on this background, a Special Issue of the journal Energies on plasma processes for renewable energy technologies is planned. On the issue, we focus on environment plasma technologies that can effectively utilize renewable electric energy sources, such as photovoltaic power generation, biofuel power generation, wind turbine power generation, etc. However, any latest research results on plasma environmental improvement processes are welcome for submission. We are looking, among others, for papers on the following technical subjects in which either plasma can use renewable energy sources or can be used for renewable energy technologies: · Plasma decomposition technology of harmful gases, such as the plasma denitrification method; · Plasma removal technology of harmful particles, such as electrostatic precipitation; · Plasma decomposition technology of harmful substances in liquid, such as gas–liquid interfacial plasma; · Plasma-enhanced flow induction and heat transfer enhancement technologies, such as ionic wind device and plasma actuator; · Plasma-enhanced combustion and fuel reforming; · Other environment plasma technologies.
Download or read book Plasma Surface Metallurgy written by Zhong Xu and published by Springer. This book was released on 2017-09-21 with total page 269 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive introduction to and technical description of a unique patented surface-modification technology: plasma surface metallurgy with double-glow discharge plasma process, known as the Xu-Tec process. As such it promotes further attention and interest in scientific research and engineering development in this area, as well as industrial utilization and product commercialization. The Xu-Tec process has opened up a new material engineering field of “Plasma Surface Metallurgy”. This surface-modification process can transform many low-grade and low-cost industrial engineering materials into “gold” materials with a high value and high grade or special functions. This improved material can be widely used in industrial production to improve the surface performance and quality of mechanical parts and manufacturing products, and to conserve expensive alloying elements for the benefit of all mankind. “This book will be valuable to those in the general area of surface metallurgy. The substantial description of the Xu-Tec process is very important and should assist in expanding the use of this superior technique. The in-depth explanation of glow discharges and their use in general will also serve as a valuable reference in the field.” James E. Thompson, Prof. Fellow of the IEEE Dean of Engineering Emeritus University of Missouri, Columbia, Missouri, USA November, 2016 "A BREAKTHROUGH IN MAKING METAL TOUGHER". ---- SCIENCE & TECHNOLOGY Business Week, July 24, 1989 “NOVEL SURFACE ALLOYING PROCESS” --- THE LEADING EDGE TECHNOLOGY WORDWIDE Materials and Processing Report, Dec. 1987
Download or read book Plasma Etching Processes for Interconnect Realization in VLSI written by Nicolas Posseme and published by Elsevier. This book was released on 2015-04-14 with total page 123 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the first of two books presenting the challenges and future prospects of plasma etching processes for microelectronics, reviewing the past, present and future issues of etching processes in order to improve the understanding of these issues through innovative solutions.This book focuses on back end of line (BEOL) for high performance device realization and presents an overview of all etch challenges for interconnect realization as well as the current etch solutions proposed in the semiconductor industry. The choice of copper/low-k interconnect architecture is one of the keys for integrated circuit performance, process manufacturability and scalability. Today, implementation of porous low-k material is mandatory in order to minimize signal propagation delay in interconnections. In this context, the traditional plasma process issues (plasma-induced damage, dimension and profile control, selectivity) and new emerging challenges (residue formation, dielectric wiggling) are critical points of research in order to control the reliability and reduce defects in interconnects. These issues and potential solutions are illustrated by the authors through different process architectures available in the semiconductor industry (metallic or organic hard mask strategies). Presents the difficulties encountered for interconnect realization in very large-scale integrated (VLSI) circuits Focused on plasma-dielectric surface interaction Helps you further reduce the dielectric constant for the future technological nodes
