Download or read book Physical Design of Optoelectronic System on a chip package Using Electrical and Optical Interconnects written by Chung-Seok Seo and published by . This book was released on 2004 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Current electrical systems are faced with the limitation in performance by the electrical interconnect technology determining overall processing speed. In addition, the electrical interconnects containing many long distance interconnects require high power to drive. One of the best ways to overcome these bottlenecks is through the use of optical interconnect to limit interconnect latency and power. This research explores new computer-aided design algorithms for developing optoelectronic systems. These algorithms focus on place and route problems using optical interconnections covering system-on-a-chip design as well as system-on-a-package design. In order to design optoelectronic systems, optical interconnection models are developed at first. The CAD algorithms include optical interconnection models and solve place and route problems for optoelectronic systems. The MCNC and GSRC benchmark circuits are used to evaluate these algorithms.
Download or read book Dissertation Abstracts International written by and published by . This book was released on 2005 with total page 884 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Computer Aided Design of Optoelectronic Multi chip Modules written by Jiao Fan and published by . This book was released on 1994 with total page 404 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Optoelectronic Interconnects Integrated Circuits and Packaging written by Louay A. Eldada and published by SPIE-International Society for Optical Engineering. This book was released on 2002 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Selected Papers on Optical Interconnects and Packaging written by Sing H. Lee and published by SPIE-International Society for Optical Engineering. This book was released on 1997 with total page 744 pages. Available in PDF, EPUB and Kindle. Book excerpt: SPIE Milestones are collections of seminal papers from the world literature covering important discoveries and developments in optics and photonics.
Download or read book Proceedings written by and published by . This book was released on 2004 with total page 1220 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Monolithic Optoelectronic VLSI Circuit Design and Fabrication for Optical Interconnects written by Krishna Vaughn Shenoy and published by . This book was released on 1995 with total page 398 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of the ACM Great Lakes Symposium on VLSI written by and published by . This book was released on 2004 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Polymers in Electronics written by Zulkifli Ahmad and published by Elsevier. This book was released on 2023-07-28 with total page 450 pages. Available in PDF, EPUB and Kindle. Book excerpt: Polymers in Electronics: Optoelectronic Properties, Design, Fabrication, and Applications brings together the fundamentals and latest advances in polymeric materials for electronic device applications, supporting researchers, scientists and advanced students, and approaching the topic from a range of disciplines. The book begins by introducing polymeric materials, their dielectric, optical, and thermal properties, and the essential principles and techniques for polymers as applied to electronics. This is followed by detailed coverage of the key steps in the preparation of polymeric materials for opto-electronic devices, including fabrication methods, materials design, rheology, encapsulation, and conductive polymer mechanisms. The final part of the book focuses on the latest developments in advanced devices, covering the areas of photovoltaics, transistors, light-emitting diodes, and stretchable electronics. In addition, it explains mechanisms, design, fabrication techniques, and end applications. This is a highly valuable resource for researchers, advanced students, engineers and R&D professionals from a range of disciplines. Offers introductory coverage of polymeric materials for electronics, including principles, design, properties, fabrication and applications Focuses on key issues such as materials selection, structure-property relationships and challenges in application Explores advanced applications of polymers in photovoltaics, transistors, sensors, light-emitting diodes and stretchable electronics
Download or read book Optoelectronic Interconnects Integrated Circuits and Packaging written by Louay A. Eldada and published by SPIE-International Society for Optical Engineering. This book was released on 2002 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book System on Package written by Rao Tummala and published by McGraw Hill Professional. This book was released on 2007-07-22 with total page 807 pages. Available in PDF, EPUB and Kindle. Book excerpt: System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
Download or read book Journal of the Optical Society of America written by and published by . This book was released on 1986 with total page 880 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electrical Electronics Abstracts written by and published by . This book was released on 1997 with total page 2240 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Optical Interconnects for Data Centers written by Tolga Tekin and published by Woodhead Publishing. This book was released on 2016-11-01 with total page 431 pages. Available in PDF, EPUB and Kindle. Book excerpt: Current data centre networks, based on electronic packet switches, are experiencing an exponential increase in network traffic due to developments such as cloud computing. Optical interconnects have emerged as a promising alternative offering high throughput and reduced power consumption. Optical Interconnects for Data Centers reviews key developments in the use of optical interconnects in data centres and the current state of the art in transforming this technology into a reality. The book discusses developments in optical materials and components (such as single and multi-mode waveguides), circuit boards and ways the technology can be deployed in data centres. Optical Interconnects for Data Centers is a key reference text for electronics designers, optical engineers, communications engineers and R&D managers working in the communications and electronics industries as well as postgraduate researchers. Summarizes the state-of-the-art in this emerging field Presents a comprehensive review of all the key aspects of deploying optical interconnects in data centers, from materials and components, to circuit boards and methods for integration Contains contributions that are drawn from leading international experts on the topic
Download or read book International Aerospace Abstracts written by and published by . This book was released on 1997 with total page 940 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Heterogeneous Integrations written by John H. Lau and published by Springer. This book was released on 2019-04-03 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Download or read book SPIE Publications Index written by and published by . This book was released on 1991 with total page 782 pages. Available in PDF, EPUB and Kindle. Book excerpt:
