Download or read book Pem Inst 001 Instructions for Plastic Encapsulated Microcircuit Pem Selection Screening and Qualification written by National Aeronautics and Space Adm Nasa and published by Independently Published. This book was released on 2018-09-20 with total page 50 pages. Available in PDF, EPUB and Kindle. Book excerpt: Potential users of plastic encapsulated microcircuits (PEMs) need to be reminded that unlike the military system of producing robust high-reliability microcircuits that are designed to perform acceptably in a variety of harsh environments, PEMs are primarily designed for use in benign environments where equipment is easily accessed for repair or replacement. The methods of analysis applied to military products to demonstrate high reliability cannot always be applied to PEMs. This makes it difficult for users to characterize PEMs for two reasons: 1. Due to the major differences in design and construction, the standard test practices used to ensure that military devices are robust and have high reliability often cannot be applied to PEMs that have a smaller operating temperature range and are typically more frail and susceptible to moisture absorption. In contrast, high-reliability military microcircuits usually utilize large, robust, high-temperature packages that are hermetically sealed. 2. Unlike the military high-reliability system, users of PEMs have little visibility into commercial manufacturers proprietary design, materials, die traceability, and production processes and procedures. There is no central authority that monitors PEM commercial product for quality, and there are no controls in place that can be imposed across all commercial manufacturers to provide confidence to high-reliability users that a common acceptable level of quality exists for all PEMs manufacturers. Consequently, there is no guaranteed control over the type of reliability that is built into commercial product, and there is no guarantee that different lots from the same manufacturer are equally acceptable. And regarding application, there is no guarantee that commercial products intended for use in benign environments will provide acceptable performance and reliability in harsh space environments. The qualification and screening processes contained in this document are intended to detect
Download or read book Pem Inst 001 written by Alexander Teverovsky and published by BiblioGov. This book was released on 2013-07 with total page 52 pages. Available in PDF, EPUB and Kindle. Book excerpt: The NASA Technical Reports Server (NTRS) houses half a million publications that are a valuable means of information to researchers, teachers, students, and the general public. These documents are all aerospace related with much scientific and technical information created or funded by NASA. Some types of documents include conference papers, research reports, meeting papers, journal articles and more. This is one of those documents.
Download or read book The Test and Launch Control Technology for Launch Vehicles written by Zhengyu Song and published by Springer. This book was released on 2018-04-19 with total page 255 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents technologies and solutions related to the test and launch control of rockets and other vehicles, and offers the first comprehensive and systematic introduction to the contributions of the Chinese Long March (Chang Zheng in Chinese, or abbreviated as CZ) rockets in this field. Moreover, it discusses the role of this technology in responsive, reliable, and economical access to space, which is essential for the competitiveness of rockets. The need for rapid development of the aerospace industry for both governmental and commercial projects is addressed. This book is a valuable reference resource for practitioners, and many examples and resources are included, not only from Chinese rockets but also from many other vehicles. It covers guidelines, technologies, and solutions on testing and launch control before rocket takeoff, covering equipment-level testing, system-level testing, simulation tests, etc.
Download or read book Reliable Application of Plastic Encapsulated Microcircuits RAC Parts Seclection Application and Control Series written by and published by . This book was released on 1996 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This report summarizes and analyzes the issues relating to Plastic Encapsulated Microcircuit (PEM) Reliability. Included is: (1) discussion of current research efforts within the government and industry, (2) failure modes and mechanisms associated with PEMs, (3) test data on PEMs subjected to HAST, life test, Autoclave, high temperature storage, 85 deg C/85%RH tests, (4) field reliability data, (5) analysis of both test data and field data, (6) a reliability assessment model derived from the data and (7) conclusions regarding the selection and applications of PEMs.
Download or read book Requirements for Plastic Encapsulated Microcircuits in Military and Avionics Applications written by CE-12 Solid State Devices and published by . This book was released on 2018 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This SAE Aerospace Standard (AS) documents and establishes common industry practices, and screening and qualification testing, of Plastic Encapsulated Microcircuits (PEMs) for use in military and avionics application environments. This document provides requirements for screening and qualification for use of plastic encapsulated microcircuits (PEMs) in military and avionics applications. The level of testing on PEMs depends on the application and reliability requirements of the system allocated to the PEMs. It is the responsibility of the user to assure compliance with the requirements specified herein, or to assure that any tailoring of requirements meets the end application requirements. This document addresses many of the concerns associated with PEM construction and manufacturing, primarily the non-hermetic packaging and the supply chain situation of multiple material sets and assembly sites.The approach to establishing PEM reliability defined herein leverages several existing industry standards, including AEC Q100, JESD47, MSFC-STD-3012, and SAE SSB-1.
Download or read book Reliable Application of Plastic Encapsulated Microcircuits RAC Parts Seclection Application and Control Series written by William Denson and published by . This book was released on 1996 with total page 164 pages. Available in PDF, EPUB and Kindle. Book excerpt: This report summarizes and analyzes the issues relating to Plastic Encapsulated Microcircuit (PEM) Reliability. Included is: (1) discussion of current research efforts within the government and industry, (2) failure modes and mechanisms associated with PEMs, (3) test data on PEMs subjected to HAST, life test, Autoclave, high temperature storage, 85 deg C/85%RH tests, (4) field reliability data, (5) analysis of both test data and field data, (6) a reliability assessment model derived from the data and (7) conclusions regarding the selection and applications of PEMs.
Download or read book Requirements for Plastic Encapsulated Microcircuits in Space Applications written by CE-12 Solid State Devices and published by . This book was released on 2017 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This document establishes common industry practices and recommended screening, qualification, and lot acceptance testing of Plastic Encapsulated Microcircuits (PEMs) for use in space application environments. This document defines the requirements for screening, qualification and lot acceptance testing for use of plastic encapsulated microcircuits (PEMs) in space flight applications. The level of testing on PEMs should be dependent on a risk based approach, the application, reliability and radiation requirements of the mission. It shall be the responsibility of the user to have the tests conducted using the requirements specified herein. Reporting procedures shall be documented on how the tests are conducted and results obtained. This document addresses many of the concerns associated with PEMs such as narrower operating temperature ranges and greater susceptibility to infant mortality and moisture absorption than space grade products.
Download or read book Commerce Business Daily written by and published by . This book was released on 1999-03 with total page 2040 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Semiconductor Packaging written by Andrea Chen and published by CRC Press. This book was released on 2016-04-19 with total page 216 pages. Available in PDF, EPUB and Kindle. Book excerpt: In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Download or read book NUREG CR written by U.S. Nuclear Regulatory Commission and published by . This book was released on 1977 with total page 48 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Moisture Sensitivity of Plastic Packages of IC Devices written by X.J. Fan and published by Springer Science & Business Media. This book was released on 2010-07-23 with total page 573 pages. Available in PDF, EPUB and Kindle. Book excerpt: Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
Download or read book Plastic Encapsulated Microelectronics written by Michael Pecht and published by Wiley-Interscience. This book was released on 1995-02-20 with total page 520 pages. Available in PDF, EPUB and Kindle. Book excerpt: Until now, professionals in search of detailed information about the latest developments in PEM design and production have had to waste valuable time browsing through countless professional journals, monographs, and databases.
Download or read book Smart Card Handbook written by Wolfgang Rankl and published by John Wiley & Sons. This book was released on 2004-04-02 with total page 1123 pages. Available in PDF, EPUB and Kindle. Book excerpt: Building on previous editions, this third edition of the Smart Card Handbook offers a completely updated overview of the state of the art in smart card technology. Everything you need to know about smart cards and their applications is covered! Fully revised, this handbook describes the advantages and disadvantages of smart cards when compared with other systems, such as optical cards and magnetic stripe cards and explains the basic technologies to the reader. This book also considers the actual status of appropriate European and international standards. Features include: New sections on: smart card applications (PKCS #15, USIM, Tachosmart). smart card terminals: M.U.S.C.L.E., OCF, MKT, PC/SC. contactless card data transmission with smart cards. Revised and updated chapters on: smart cards in the telecommunications industry (GSM, UMTS, (U)SIM application toolkit, decoding of the files of a GSM card). smart card security (new attacks, new protection methods against attacks). A detailed description of the physical and technical properties and the fundamental principles of information processing techniques. Explanations of the architecture of smart card operating systems, data transfer to and from the smart card, command set and implementation of the security mechanisms and the function of the smart card terminals. Current applications of the technology on mobile telephones, telephone cards, the electronic purse and credit cards. Discussions on future developments of smart cards: USB, MMU on microcontroller, system on card, flash memory and their usage. Practical guidance on the future applications of smart cards, including health insurance cards, e-ticketing, wireless security, digital signatures and advanced electronic payment methods. “The book is filled with information that students, enthusiasts, managers, experts, developers, researchers and programmers will find useful. The book is well structured and provides a good account of smart card state-of-the-art technology… There is a lot of useful information in this book and as a practicing engineer I found it fascinating, and extremely useful.” Review of second edition in Measurement and Control. 'The standard has got a lot higher, if you work with smart cards then buy it! Highly recommended.’ Review of second edition in Journal of the Association of C and C++ Programmers. Visit the Smart Card Handbook online at www.wiley.co.uk/commstech/
Download or read book Failure Modes and Mechanisms in Electronic Packages written by P. Singh and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 391 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.
Download or read book Failure Analysis written by Marius Bazu and published by John Wiley & Sons. This book was released on 2011-03-08 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt: Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
Download or read book AGARD Conference Proceedings written by North Atlantic Treaty Organization. Advisory Group for Aerospace Research and Development and published by . This book was released on 1994 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Copper Wire Bonding written by Preeti S Chauhan and published by Springer Science & Business Media. This book was released on 2013-09-20 with total page 254 pages. Available in PDF, EPUB and Kindle. Book excerpt: This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.
