Download or read book PCB Multi Issue Microsection Wall Poster written by and published by . This book was released on 2010 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Materials and Processes written by Barrie D. Dunn and published by Springer. This book was released on 2015-12-29 with total page 677 pages. Available in PDF, EPUB and Kindle. Book excerpt: The objective of this book is to assist scientists and engineers select the ideal material or manufacturing process for particular applications; these could cover a wide range of fields, from light-weight structures to electronic hardware. The book will help in problem solving as it also presents more than 100 case studies and failure investigations from the space sector that can, by analogy, be applied to other industries. Difficult-to-find material data is included for reference. The sciences of metallic (primarily) and organic materials presented throughout the book demonstrate how they can be applied as an integral part of spacecraft product assurance schemes, which involve quality, material and processes evaluations, and the selection of mechanical and component parts. In this successor edition, which has been revised and updated, engineering problems associated with critical spacecraft hardware and the space environment are highlighted by over 500 illustrations including micrographs and fractographs. Space hardware captured by astronauts and returned to Earth from long durations in space are examined. Information detailed in the Handbook is applicable to general terrestrial applications including consumer electronics as well as high reliability systems associated with aeronautics, medical equipment and ground transportation. This Handbook is also directed to those involved in maximizing the relia bility of new materials and processes for space technology and space engineering. It will be invaluable to engineers concerned with the construction of advanced structures or mechanical and electronic sub-systems.
Download or read book High Speed Digital System Design written by Anatoly Belous and published by Springer Nature. This book was released on 2019-11-13 with total page 933 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes for readers the entire, interconnected complex of theoretical and practical aspects of designing and organizing the production of various electronic devices, the general and main distinguishing feature of which is the high speed of processing and transmitting of digital signals. The authors discuss all the main stages of design - from the upper system level of the hierarchy (telecommunications system, 5G mobile communications) to the lower level of basic semiconductor elements, printed circuit boards. Since the developers of these devices in practice deal with distorted digital signals that are transmitted against a background of interference, the authors not only explain the physical nature of such effects, but also offer specific solutions as to how to avoid such parasitic effects, even at the design stage of high-speed devices.
Download or read book Design and Manufacturing of Active Microsystems written by Stephanus Büttgenbach and published by Springer Science & Business Media. This book was released on 2011-03-04 with total page 447 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the design and manufacturing of microsystems as well as necessary key technologies developed within the Collaborative Research Center 516. The research efforts of this collaboration are focused on active micro systems which are based on the electromagnetic actuator principle. The travel of the investigated actuator systems is on the order of several millimeters. The total construction size of the actuator is on the range of several centimeters whereas essential structures being several micrometers. The methods and the production technologies that are investigated on the basis of various research models incorporate the fundamental process chains of microsystems.
Download or read book PCB Design Guide to Via and Trace Currents and Temperatures written by Douglas Brooks and published by Artech House. This book was released on 2021-02-28 with total page 246 pages. Available in PDF, EPUB and Kindle. Book excerpt: A very important part of printed circuit board (PCB) design involves sizing traces and vias to carry the required current. This exciting new book will explore how hot traces and vias should be and what board, circuit, design, and environmental parameters are the most important. PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces are covered. The IPC curves found in IPC 2152, the equations that fit those curves and computer simulations that fit those curves and equations are detailed. Sensitivity analyses that show what happens when environments are varied, including adjacent traces and planes, changing trace lengths, and thermal gradients are presented. Via temperatures and what determines them are explored, along with fusing issues and what happens when traces are overloaded. Voltage drops across traces and vias, the thermal effects going around right-angle corners, and frequency effects are covered. Readers learn how to measure the thermal conductivity of dielectrics and how to measure the resistivity of copper traces and why many prior attempts to do so have been doomed to failure. Industrial CT Scanning, and whether or not they might replace microsections for measuring trace parameters are also considered.
Download or read book Flexible Circuit Technology written by Joseph Fjelstad and published by J C Fjelstad & Associates. This book was released on 1998 with total page 217 pages. Available in PDF, EPUB and Kindle. Book excerpt: Explains the design, fabrication and assembly of flexible circuits, and how, when and why they are best used. The second edition is expanded with new ways flexible circuits are being used to solve complex electronic packaging problems. Annotation c. Book News, Inc., Portland, OR (booknews.com).
Download or read book Thermal Management of Electronic Systems II written by E. Beyne and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt: For the second time, the Eurotherm Committee has chosen Thermal Managment of Electronic Systems as the subject for its 45th Seminar, held at IMEC in Leuven, Belgium, from 20 to 22 September 1995. After the successfui first edition of this seminar in Delft, June 14-16, 1993, it was decided to repeat this event on a two year basis. This volume constitutes the edited proceedings of the Seminar. Thermal management of electronic systems is gaining importance. Whereas a few years ago papers on this subject where mainly devoted to applications in high end markets, such as mainframes and telecommunication switching equipment, we see a growing importance in the "lower" end applications. This may be understood from the growing impact of electronics on every day life, from car electronics, GSM phones, personal computers to electronic games. These applications add new requirements to the thermal design. The thermal problem and the applicable cooling strategies are quite different from those in high end products. In this seminar the latest developments in many of the different aspects of the thermal design of electronic systems were discussed. Particular attention was given to thermal modelling, experimental characterisation and the impact of thermal design on the reliability of electronic systems.
Download or read book Basics of Cutting and Abrasive Processes written by Hans Kurt Toenshoff and published by Springer Science & Business Media. This book was released on 2013-06-12 with total page 405 pages. Available in PDF, EPUB and Kindle. Book excerpt: Manufacturing is the basic industrial activity generating real value. Cutting and abrasive technologies are the backbone of precision production in machine, automotive and aircraft building as well as of production of consumer goods. We present the knowledge of modern manufacturing in these technologies on the basis of scientific research. The theory of cutting and abrasive processes and the knowledge about their application in industrial practice are a prerequisite for the studies of manufacturing science and an important part of the curriculum of the master study in German mechanical engineering. The basis of this book is our lecture “Basics of cutting and abrasive processes” (4 semester hours/3 credit hours) at the Leibniz University Hannover, which we offer to the diploma and master students specializing in manufacturing science.
Download or read book Guidebook for Managing Silicon Chip Reliability written by Michael Pecht and published by CRC Press. This book was released on 2017-11-22 with total page 224 pages. Available in PDF, EPUB and Kindle. Book excerpt: Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future? Chapters discuss: failure sites, operational loads, and failure mechanism intrinsic device sensitivities electromigration hot carrier aging time dependent dielectric breakdown mechanical stress induced migration alpha particle sensitivity electrostatic discharge (ESD) and electrical overstress latch-up qualification screening guidelines for designing reliability Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.
Download or read book Failure Modes and Mechanisms in Electronic Packages written by P. Singh and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 391 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.
Download or read book Adhesion Promotion Techniques written by K.L. Mittal and published by CRC Press. This book was released on 1999-02-02 with total page 426 pages. Available in PDF, EPUB and Kindle. Book excerpt: Presents the state of the art in improving bond strength between different materials for many manufacturing processes. The text explores up-to-date, high-quality adhesion technologies for a wide variety of materials, explaining current capabilities of adhesion promotion for both students and seasoned researchers. It reviews the suitable chemistry or morphology for enhanced adhesion to metal, plastic and wood surfaces.
Download or read book Isostatic Pressing written by M. Koizumi and published by Springer Science & Business Media. This book was released on 1991-06-30 with total page 410 pages. Available in PDF, EPUB and Kindle. Book excerpt: This updated volume is intended as a reference text on the technology of hot and cold isostatic pressing together with applications for development of new materials.
Download or read book Archaeometallurgy Materials Science Aspects written by Andreas Hauptmann and published by Springer Nature. This book was released on 2020-11-21 with total page 595 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book successfully connects archaeology and archaeometallurgy with geoscience and metallurgy. It addresses topics concerning ore deposits, archaeological field evidence of early metal production, and basic chemical-physical principles, as well as experimental ethnographic works on a low handicraft base and artisanal metal production to help readers better understand what happened in antiquity. The book is chiefly intended for scholars and students engaged in interdisciplinary work.
Download or read book Qualification and Performance Specification for Rigid Printed Boards written by and published by . This book was released on 2020 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book My Life with the Printed Circuit written by Paul Eisler and published by Lehigh University Press. This book was released on 1989 with total page 180 pages. Available in PDF, EPUB and Kindle. Book excerpt: The autobiography of Paul Eisler, recounting his invention and pioneering of the printed circuit in the midst of the blitz on London during World War II. It ranges from a fascinating behind-the scenes report of how the invention was used during the war to an examination of the patent system itself and the evolutionary process from idea to product.
Download or read book Change Your Dam Thinking written by Gray McQuarrie and published by Bound Publishing. This book was released on 2010 with total page 241 pages. Available in PDF, EPUB and Kindle. Book excerpt: Each chapter in this book consists of stories. There is a moral to all of these stories: you will grow as a flow thinker and you will be damned as a dam thinker. The choice is yours. What is DAM thinking? The book presents five dams, for example the ego dam stops the flow of productivity. How? If there is a serious problem and you fail to ask for help, what is stopping you? Ego. What does that block? Production. Why is this important? Companies with DAM thinking suffer from stagnation, pollution, and pressure. Nothing much matters in a DAM thinking company, because not much gets done. Companies that FLOW and GROW deliver their product and service with velocity and quality. But more than that a FLOW thinking company develops market disruptive methods and technologies that emerge from the collective intelligence of the work force. Flow companies are all about Velocity, Quality, and Emergence. Flow companies are all about people. Work is social. People's behaviors lead business results. People's behavior is governed by their thinking. This book will show you how to find and develop something called complex solutions and show you how you can develop your own unique complex plan; your own unique business improvement system. Companies that understand these three statements that 1) work is social, 2) our behaviors lead results, and 3) behaviors are governed by our thinking don't just perform well, they completely dominate the markets they serve. This book not only provides understanding, but detail on how you can move forward and design your own company that flows and grows.
Download or read book Area Array Interconnection Handbook written by Karl J. Puttlitz and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 1250 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
