Download or read book Optical Polymers in High Speed Board Level Optical Interconnects written by and published by Information Gatekeepers Inc. This book was released on with total page 26 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Optical Interconnects for Data Centers written by Tolga Tekin and published by Woodhead Publishing. This book was released on 2016-11-01 with total page 431 pages. Available in PDF, EPUB and Kindle. Book excerpt: Current data centre networks, based on electronic packet switches, are experiencing an exponential increase in network traffic due to developments such as cloud computing. Optical interconnects have emerged as a promising alternative offering high throughput and reduced power consumption. Optical Interconnects for Data Centers reviews key developments in the use of optical interconnects in data centres and the current state of the art in transforming this technology into a reality. The book discusses developments in optical materials and components (such as single and multi-mode waveguides), circuit boards and ways the technology can be deployed in data centres. Optical Interconnects for Data Centers is a key reference text for electronics designers, optical engineers, communications engineers and R&D managers working in the communications and electronics industries as well as postgraduate researchers. - Summarizes the state-of-the-art in this emerging field - Presents a comprehensive review of all the key aspects of deploying optical interconnects in data centers, from materials and components, to circuit boards and methods for integration - Contains contributions that are drawn from leading international experts on the topic
Download or read book Optical Interconnects written by Ray T. Chen and published by Morgan & Claypool Publishers. This book was released on 2007 with total page 105 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical interconnects, many stumbling blocks need to be addressed such as thin-film transmitter and detector, thermal management, process compatibility, reliability, cost effective fabrication process, and easy integration. The material presented eventually will relieve such concerns and make the integration of optical interconnection highly feasible. The hybrid integration of the optical interconnection layer and electrical layers is ongoing.
Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Download or read book Integrated Microsystems written by Krzysztof Iniewski and published by CRC Press. This book was released on 2017-12-19 with total page 760 pages. Available in PDF, EPUB and Kindle. Book excerpt: As rapid technological developments occur in electronics, photonics, mechanics, chemistry, and biology, the demand for portable, lightweight integrated microsystems is relentless. These devices are getting exponentially smaller, increasingly used in everything from video games, hearing aids, and pacemakers to more intricate biomedical engineering and military applications. Edited by Kris Iniewski, a revolutionary in the field of advanced semiconductor materials, Integrated Microsystems: Electronics, Photonics, and Biotechnology focuses on techniques for optimized design and fabrication of these intelligent miniaturized devices and systems. Composed of contributions from experts in academia and industry around the world, this reference covers processes compatible with CMOS integrated circuits, which combine computation, communications, sensing, and actuation capabilities. Light on math and physics, with a greater emphasis on microsystem design and configuration and electrical engineering, this book is organized in three sections—Microelectronics and Biosystems, Photonics and Imaging, and Biotechnology and MEMs. It addresses key topics, including physical and chemical sensing, imaging, smart actuation, and data fusion and management. Using tables, figures, and equations to help illustrate concepts, contributors examine and explain the potential of emerging applications for areas including biology, nanotechnology, micro-electromechanical systems (MEMS), microfluidics, and photonics.
Download or read book VLSI Micro and Nanophotonics written by El-Hang Lee and published by CRC Press. This book was released on 2018-09-03 with total page 632 pages. Available in PDF, EPUB and Kindle. Book excerpt: Addressing the growing demand for larger capacity in information technology, VLSI Micro- and Nanophotonics: Science, Technology, and Applications explores issues of science and technology of micro/nano-scale photonics and integration for broad-scale and chip-scale Very Large Scale Integration photonics. This book is a game-changer in the sense that it is quite possibly the first to focus on "VLSI Photonics". Very little effort has been made to develop integration technologies for micro/nanoscale photonic devices and applications, so this reference is an important and necessary early-stage perspective on this field. New demand for VLSI photonics brings into play various technological and scientific issues, as well as evolutionary and revolutionary challenges—all of which are discussed in this book. These include topics such as miniaturization, interconnection, and integration of photonic devices at micron, submicron, and nanometer scales. With its "disruptive creativity" and unparalleled coverage of the photonics revolution in information technology, this book should greatly impact the future of micro/nano-photonics and IT as a whole. It offers a comprehensive overview of the science and engineering of micro/nanophotonics and photonic integration. Many books on micro/nanophotonics focus on understanding the properties of individual devices and their related characteristics. However, this book offers a full perspective from the point of view of integration, covering all aspects of benefits and advantages of VLSI-scale photonic integration—the key technical concept in developing a platform to make individual devices and components useful and practical for various applications.
Download or read book High Speed Photonics Interconnects written by Lukas Chrostowski and published by CRC Press. This book was released on 2017-12-19 with total page 227 pages. Available in PDF, EPUB and Kindle. Book excerpt: Dramatic increases in processing power have rapidly scaled on-chip aggregate bandwidths into the Tb/s range. This necessitates a corresponding increase in the amount of data communicated between chips, so as not to limit overall system performance. To meet the increasing demand for interchip communication bandwidth, researchers are investigating the use of high-speed optical interconnect architectures. Unlike their electrical counterparts, optical interconnects offer high bandwidth and negligible frequency-dependent loss, making possible per-channel data rates of more than 10 Gb/s. High-Speed Photonics Interconnects explores some of the groundbreaking technologies and applications that are based on photonics interconnects. From the Evolution of High-Speed I/O Circuits to the Latest in Photonics Interconnects Packaging and Lasers Featuring contributions by experts from academia and industry, the book brings together in one volume cutting-edge research on various aspects of high-speed photonics interconnects. Contributors delve into a wide range of technologies, from the evolution of high-speed input/output (I/O) circuits to recent trends in photonics interconnects packaging. The book discusses the challenges associated with scaling I/O data rates and current design techniques. It also describes the major high-speed components, channel properties, and performance metrics. The book exposes readers to a myriad of applications enabled by photonics interconnects technology. Learn about Optical Interconnect Technologies Suitable for High-Density Integration with CMOS Chips This richly illustrated work details how optical interchip communication links have the potential to fully leverage increased data rates provided through complementary metal-oxide semiconductor (CMOS) technology scaling at suitable power-efficiency levels. Keeping the mathematics to a minimum, it gives engineers, researchers, graduate students, and entrepreneurs a comprehensive overview of the dynamic landscape of high-speed photonics interconnects.
Download or read book Integrated Interconnect Technologies for 3D Nanoelectronic Systems written by Muhannad S. Bakir and published by Artech House. This book was released on 2008-11-30 with total page 551 pages. Available in PDF, EPUB and Kindle. Book excerpt: This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.
Download or read book WDM Systems and Networks written by Neophytos (Neo) Antoniades and published by Springer Science & Business Media. This book was released on 2011-12-08 with total page 536 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modeling, Simulation, Design and Engineering of WDM Systems and Networks provides readers with the basic skills, concepts, and design techniques used to begin design and engineering of optical communication systems and networks at various layers. The latest semi-analytical system simulation techniques are applied to optical WDM systems and networks, and a review of the various current areas of optical communications is presented. Simulation is mixed with experimental verification and engineering to present the industry as well as state-of-the-art research. This contributed volume is divided into three parts, accommodating different readers interested in various types of networks and applications. The first part of the book presents modeling approaches and simulation tools mainly for the physical layer including transmission effects, devices, subsystems, and systems), whereas the second part features more engineering/design issues for various types of optical systems including ULH, access, and in-building systems. The third part of the book covers networking issues related to the design of provisioning and survivability algorithms for impairment-aware and multi-domain networks. Intended for professional scientists, company engineers, and university researchers, the text demonstrates the effectiveness of computer-aided design when it comes to network engineering and prototyping.
Download or read book Search of Excellence ANTEC 91 written by Society of Plastic Engineers and published by CRC Press. This book was released on 1991-05-01 with total page 2914 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Indoor Infrared Optical Wireless Communications written by Ke Wang and published by CRC Press. This book was released on 2019-12-23 with total page 201 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book aims to give an overview of recent developments in indoor near-infrared optical wireless communication technologies and systems, including basic theories, operating fundamentals, system architectures, modelling, experimental demonstrations, advanced techniques, and most recently, the research efforts towards integrations. Both line-of-sight and diffusive-signals-based options will be reviewed, to provide readers a complete picture about this rapidly developing area, which targets the provision of high-speed wireless connectivity to end- users in indoor environments, such as offices, homes and shopping centres, to satisfy the growing high-speed communication requirement. Provides a systematic approach for the fundamentals of indoor optical wireless communications. Provides an overview of recent developments in indoor infrared optical wireless communications, including theoretical fundamentals. Examines system architectures, modelling, experimental demonstrations, and the research efforts towards integrations. Dr. Ke Wang is an Australian Research Council (ARC) DECRA Fellow and a senior lecturer in the School of Engineering, Royal Melbourne Institute of Technology (RMIT University), VIC, Australia. He worked with the University of Melbourne, Australia, and Stanford University, California, before joining RMIT University. He has published over 110 peer-reviewed papers in top journals and leading international conferences, including over 20 invited papers. He has been awarded several prestigious national and international awards as recognition of research contributions, such as the Victoria Fellowship, the AIPS Young Tall Poppy Science Award, and the Marconi Society Paul Baran Young Scholar Award. His major areas of interest include: silicon photonics integration, opto-electronics integrated devices and circuits, nanophotonics, optical wireless technology for short-range applications, quasi-passive reconfigurable devices and applications and optical interconnects in data -centres and high-performance computing.
Download or read book International Aerospace Abstracts written by and published by . This book was released on 1998 with total page 988 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advanced Materials for Integrated Optical Waveguides written by Xingcun Colin Tong Ph.D and published by Springer Science & Business Media. This book was released on 2013-10-17 with total page 574 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive introduction to integrated optical waveguides for information technology and data communications. Integrated coverage ranges from advanced materials, fabrication, and characterization techniques to guidelines for design and simulation. A concluding chapter offers perspectives on likely future trends and challenges. The dramatic scaling down of feature sizes has driven exponential improvements in semiconductor productivity and performance in the past several decades. However, with the potential of gigascale integration, size reduction is approaching a physical limitation due to the negative impact on resistance and inductance of metal interconnects with current copper-trace based technology. Integrated optics provides a potentially lower-cost, higher performance alternative to electronics in optical communication systems. Optical interconnects, in which light can be generated, guided, modulated, amplified, and detected, can provide greater bandwidth, lower power consumption, decreased interconnect delays, resistance to electromagnetic interference, and reduced crosstalk when integrated into standard electronic circuits. Integrated waveguide optics represents a truly multidisciplinary field of science and engineering, with continued growth requiring new developments in modeling, further advances in materials science, and innovations in integration platforms. In addition, the processing and fabrication of these new devices must be optimized in conjunction with the development of accurate and precise characterization and testing methods. Students and professionals in materials science and engineering will find Advanced Materials for Integrated Optical Waveguides to be an invaluable reference for meeting these research and development goals.
Download or read book Self Organized 3D Integrated Optical Interconnects written by Tetsuzo Yoshimura and published by CRC Press. This book was released on 2021-03-09 with total page 363 pages. Available in PDF, EPUB and Kindle. Book excerpt: Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve “short line distances of the cm–mm order” and “large line counts of hundreds-thousands.” This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules. This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects.
Download or read book Optical Attenuation in Siloxane Polymer Waveguides written by Shashikant Hegde and published by Lulu.com. This book was released on with total page 115 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Nanoscale VLSI written by Rohit Dhiman and published by Springer Nature. This book was released on 2020-10-03 with total page 319 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes methodologies in the design of VLSI devices, circuits and their applications at nanoscale levels. The book begins with the discussion on the dominant role of power dissipation in highly scaled devices.The 15 Chapters of the book are classified under four sections that cover design, modeling, and simulation of electronic, magnetic and compound semiconductors for their applications in VLSI devices, circuits, and systems. This comprehensive volume eloquently presents the design methodologies for ultra–low power VLSI design, potential post–CMOS devices, and their applications from the architectural and system perspectives. The book shall serve as an invaluable reference book for the graduate students, Ph.D./ M.S./ M.Tech. Scholars, researchers, and practicing engineers working in the frontier areas of nanoscale VLSI design.
