Download or read book Monolithic Integration of III V Compound Semiconductor Devices in Silicon based Electronics written by Jong-Won Lee and published by . This book was released on 1997 with total page 526 pages. Available in PDF, EPUB and Kindle. Book excerpt: Investigates semiconductor materials that may facilitate epitaxial growth of laser devices on Si substrates. Presents solutions to the main problems in achieving monolithic integration: growth of low defect density III-V epilayers on Si [Silicon] and growth of light-emitting material on Si. GaP [Gallium Phosphide] can be grown only on off-axis Si, light-emitting GaInP [Gallium Indium Phosphide] island on on-axis, and using selective area growth, on-axis GaP surface on the epilayer can be recovered. Also demonstrates room temperature electroluminescence of GaInP islands.

Download or read book III V Compound Semiconductors written by Tingkai Li and published by CRC Press. This book was released on 2016-04-19 with total page 588 pages. Available in PDF, EPUB and Kindle. Book excerpt: Silicon-based microelectronics has steadily improved in various performance-to-cost metrics. But after decades of processor scaling, fundamental limitations and considerable new challenges have emerged. The integration of compound semiconductors is the leading candidate to address many of these issues and to continue the relentless pursuit of more

Download or read book Monolithic Integration of Three five Semiconductor Materials and Devices with Silicon written by Steve Ming Ting and published by . This book was released on 1999 with total page 152 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Platform for Monolithic Integration of III V Devices with Si CMOS Technology written by Nan Yang Pacella and published by . This book was released on 2012 with total page 176 pages. Available in PDF, EPUB and Kindle. Book excerpt: Monolithic integration of III-V compound semiconductors and Si complementary metal-oxide- semiconductor (CMOS) enables the creation of advanced circuits with new functionalities. In order to merge the two technologies, compatible substrate platforms and processing approaches must be developed. The Silicon on Lattice Engineered Silicon (SOLES) substrate allows monolithic integration. It is a Si substrate with embedded III-V template layer, which supports epitaxial IIIV device growth, consistent with present II-V technology. The structure is capped with a silicon-on-insulator (SOI) layer, which enables processing of CMOS devices. The processes required for fabricating and utilizing SOLES wafers which have Ge or InP as the III-V template layers are explored. Allowable thermal budgets are important to consider because the substrate must withstand the thermal budget of all subsequent device processing steps. The maximum processing temperature of Ge SOLES is found to be limited by its melting point. However, Ge diffuses through the buried Si0 2 and must be contained. Solutions include 1) limiting device processing thermal budgets, 2) improving buried silicon dioxide quality and 3) incorporating a silicon nitride diffusion barrier. InP SOLES substrates are created using wafer bonding and layer transfer of silicon, SOI and InP-on-Si wafers, established using a two-step growth method. Two different InP SOLES structures are demonstrated and their allowable thermal budgets are investigated. The thermal budgets appear to be limited by low quality silicon dioxide used for wafer bonding. For ultimate integration, parallel metallization of the III-V and CMOS devices is sought. A method of making ohmic contact to III-V materials through Si encapsulation layers, using Si CMOS technology, is established. The metallurgies and electrical characteristics of nickel silicide structures on Si/III-V films are investigated and the NiSi/Si/III-V structure is found to be optimal. This structure is composed of a standard NiSi/Si interface and novel Si/III-V interface. Specific contact resistivity of the double hetero-interface stack can be tuned by controlling Si/IIIV band alignments at the epitaxial growth interface. P-type Si/GaAs interfaces and n-type Si/InGaAs interfaces create ohmic contacts with the lowest specific contact resistivity and present viable structures for integration. A Si-encapsulated GaAs/AlGaAs laser with NiSi front-side contact is demonstrated and confirms the feasibility of these contact structures.

Download or read book Fundamentals of III V Semiconductor Mosfets written by Serge Oktyabrsky and published by . This book was released on 2010-09-13 with total page 464 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Physics and Chemistry of III V Compound Semiconductor Interfaces written by Carl Wilmsen and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 472 pages. Available in PDF, EPUB and Kindle. Book excerpt: The application of the 111-V compound semiconductors to device fabrica tion has grown considerably in the last few years. This process has been stimulated, in part, by the advancement in the understanding of the interface physics and chemistry of the III-V's. The literature on this subject is spread over the last 15 years and appears in many journals and conference proceedings. Understanding this literature requires consider able effort by the seasoned researcher, and even more for those starting out in the field or by engineers and scientists who wish to apply this knowledge to the fabrication of devices. The purpose of this book is to bring together much of the fundamental and practical knowledge on the physics and chemistry of the 111-V compounds with metals and dielectrics. The authors of this book have endeavored to provide concise overviews of these areas with many tahles ancI grarhs whic. h c. omr>are and summarize the literature. In this way, the book serves as both an insightful treatise on III-V interfaces and a handy reference to the literature. The selection of authors was mandated by the desire to include both fundamental and practical approaches, covering device and material aspects of the interfaces. All of the authors are recognized experts on III-V interfaces and each has worked for many years in his subject area. This experience is projected in the breadth of understanding in each chapter.

Download or read book Monolithic Integration of Mid infrared III V Semiconductor Materials and Devices Onto Silicon written by Evangelia Delli and published by . This book was released on 2020 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Compound Semiconductor Integrated Circuits written by Tho T. Vu and published by World Scientific. This book was released on 2003 with total page 363 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the book version of a special issue of the International Journal of High Speed Electronics and Systems, reviewing recent work in the field of compound semiconductor integrated circuits. There are fourteen invited papers covering a wide range of applications, frequencies and materials. These papers deal with digital, analog, microwave and millimeter-wave technologies, devices and integrated circuits for wireline fiber-optic lightwave transmissions, and wireless radio-frequency microwave and millimeter-wave communications. In each case, the market is young and experiencing rapid growth for both commercial and millitary applications. Many new semiconductor technologies compete for these new markets, leading to an alphabet soup of semiconductor materials described in these papers. Contents: Present and Future of High-Speed Compound Semiconductor IC's (T Otsuji); Transforming MMIC (E J Martinez); Distributed Amplifier for Fiber-Optic Communication Systems (H Shigematsu et al.); Microwave GaN-Based Power Transistors on Large-Scale Silicon Wafers (S Manohar et al.); Radiation Effects in High Speed III-V Integrated Circuits (T R Weatherford); Radiation Effects in III-V Semiconductor Electronics (B D Weaver et al.); Reliability and Radiation Hardness of Compound Semiconductors (S A Kayali & A H Johnston); and other papers. Readership: Engineers, scientists and graduate students working on high speed electronics and systems, and in the area of compound semiconductor integrated circuits.

Download or read book Nano Semiconductors written by Krzysztof Iniewski and published by CRC Press. This book was released on 2018-09-03 with total page 600 pages. Available in PDF, EPUB and Kindle. Book excerpt: With contributions from top international experts from both industry and academia, Nano-Semiconductors: Devices and Technology is a must-read for anyone with a serious interest in future nanofabrication technologies. Taking into account the semiconductor industry’s transition from standard CMOS silicon to novel device structures—including carbon nanotubes (CNT), graphene, quantum dots, and III-V materials—this book addresses the state of the art in nano devices for electronics. It provides an all-encompassing, one-stop resource on the materials and device structures involved in the evolution from micro- to nanoelectronics. The book is divided into three parts that address: Semiconductor materials (i.e., carbon nanotubes, memristors, and spin organic devices) Silicon devices and technology (i.e., BiCMOS, SOI, various 3D integration and RAM technologies, and solar cells) Compound semiconductor devices and technology This reference explores the groundbreaking opportunities in emerging materials that will take system performance beyond the capabilities of traditional CMOS-based microelectronics. Contributors cover topics ranging from electrical propagation on CNT to GaN HEMTs technology and applications. Approaching the trillion-dollar nanotech industry from the perspective of real market needs and the repercussions of technological barriers, this resource provides vital information about elemental device architecture alternatives that will lead to massive strides in future development.

Download or read book Optoelectronic Integrated Circuit Design and Device Modeling written by Jianjun Gao and published by John Wiley & Sons. This book was released on 2011-09-19 with total page 258 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Optoelectronic Integrated Circuit Design and Device Modeling, Professor Jianjun Gao introduces the fundamentals and modeling techniques of optoelectronic devices used in high-speed optical transmission systems. Gao covers electronic circuit elements such as FET, HBT, MOSFET, as well as design techniques for advanced optical transmitter and receiver front-end circuits. The book includes an overview of optical communication systems and computer-aided optoelectronic IC design before going over the basic concept of laser diodes. This is followed by modeling and parameter extraction techniques of lasers and photodiodes. Gao covers high-speed electronic semiconductor devices, optical transmitter design, and optical receiver design in the final three chapters. Addresses a gap within the rapidly growing area of transmitter and receiver modeling in OEICs Explains diode physics before device modeling, helping readers understand their equivalent circuit models Provides comprehensive explanations for E/O and O/E conversions done with laser and photodiodes Covers an extensive range of devices for high-speed applications Accessible for students new to microwaves Presentation slides available for instructor use This book is primarily aimed at practicing engineers, researchers, and post-graduates in the areas of RF, microwaves, IC design, photonics and lasers, and solid state devices. The book is also a strong supplement for senior undergraduates taking courses in RF and microwaves. Lecture materials for instructors available at www.wiley.com/go/gao

Download or read book Monolithic Integration of Electronics and MEMS in 6H Silicon Carbide for Use in Harsh Environment Applications written by Eskinder Hailu and published by . This book was released on 2003 with total page 482 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Monolithic Integration of III V Optoelectronics on Si written by Ojin Kwon and published by . This book was released on 2005 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Abstract: Integration of III-V materials on Si substrates has been a driving force in the area of lattice-mismatched growth to selectively provide the complementary material properties of compound semiconductors within conventional Si technology. This materials integration potentially serves as a novel host for next generation technologies to maintain the current rate of progress in data speed and capacity. There are barriers present to integrate III-V materials to Si such as mismatches in lattice constant (for example, 4% between GaAs and Si, 8% for InP), crystal symmetry (polar vs. non-polar), thermal characteristics (typically over 250% thermal expansion coefficient difference between III-V materials and Si), and chemistry. Extensive efforts have focused on achieving successful integration of III-As materials (mainly GaAs/AlGaAs) on Si via heteroepitaxy, while advances in materials integration led state-of-the-art device performance by leveraging heteroepitaxial versatility to tailor material properties among compound III-V materials. Recent progress on graded SiGe relaxed buffers produced successful results with low threading dislocation density of [approx.] 1x106 cm−2 achieved for the relaxed Ge over large area Si wafers, consequently leading to outstanding device-quality GaAs materials grown on Si and high-performance optoelectronic devices. However, optoelectronic devices emitting in the visible portion of the spectrum have yet to be explored using this promising approach. The present work explores the untapped opportunities of integrated III-P materials on Si enabled by relaxed SiGe/Si, therefore verifying the concept of SiGe/Si that is broadly applicable for monolithically integrating optical and electronic technologies at the wafer level. One of the ultimate proofs for examining the quality of the materials being integrated is a demonstration of the stimulated emission. The generation of coherent light originates from interaction between photons and population-inverted minority carriers; therefore the epitaxial defects from the integration process are extremely critical. To date, the optical coherency of integrated III-P/Si materials in the visible spectrum have yet to be explored and there have been no reports made to achieve this goal by any means of heteroepitaxial integrations. This thesis reviews efforts toward achieving room temperature operating visible AlGaInP laser diodes grown on the relaxed SiGe/Si substrates by molecular beam epitaxy.

Download or read book Modeling and Simulation in Engineering written by Jan Valdman and published by BoD – Books on Demand. This book was released on 2020-12-09 with total page 242 pages. Available in PDF, EPUB and Kindle. Book excerpt: The general aim of this book is to present selected chapters of the following types: chapters with more focus on modeling with some necessary simulation details and chapters with less focus on modeling but with more simulation details. This book contains eleven chapters divided into two sections: Modeling in Continuum Mechanics and Modeling in Electronics and Engineering. We hope our book entitled "Modeling and Simulation in Engineering - Selected Problems" will serve as a useful reference to students, scientists, and engineers.

Download or read book Junction Level Heterogeneous Integration of III V Materials with Si CMOS for Novel Asymmetric Field Effect Transistors written by Yoon Jung Chang and published by . This book was released on 2016 with total page 173 pages. Available in PDF, EPUB and Kindle. Book excerpt: Driven by Moore's law, semiconductor chips have become faster, denser and cheaper through aggressive dimension scaling. The continued scaling not only led to dramatic performance improvements in digital logic applications but also in mixed-mode and/or communication applications. Moreover, size/weight/power (SWAP) restrictions on all high-performance system components have resulted in multi-functional integration of multiple integrated circuits (ICs)/dies in 3D packages/ICs by various system-level approaches. However, these approaches still possess shortcomings and in order to truly benefit from the most advanced digital technologies, the future high-speed/high power devices for communication applications need to be fully integrated into a single CMOS chip. Due to limitations in Si device performance in high-frequency/power applications as well as expensive III-V compound semiconductor devices with low integration density, heterogeneous integration of compound semiconductor materials/devices with Si CMOS platform has emerged as a viable solution to low-cost high-performance ICs. In this study, we first discuss on channel and drain engineering approaches in the state-of-the-art multiple-gate field-effect transistor to integrate III-V compound semiconductor materials with Si CMOS for improved device performance in mixed-mode and/or communication applications. Then, growth, characterization and electrical analysis on small-area (diameter

Download or read book Substrate Engineering for Monolithic Integration of III V Semiconductors with Si CMOS Technology written by Carl Lawrence Dohrman and published by . This book was released on 2008 with total page 172 pages. Available in PDF, EPUB and Kindle. Book excerpt: (cont.) Adaptation of standard GaAs on Ge processes to this heteroepitaxial system resulted in mostly non-planar growth (similar to typical GaP growth on Si) with only limited regions of planar GaAsyP1-y layers on Si0.2Ge0.8 virtual substrates. Planar growth of GaAsyP1-y on Si0.3Ge0.7 virtual substrates was enabled by minimizing the atmospheric exposure of the Si0.3Ge0.7 as it is transferred between growth reactors, establishing that the GaAsyP1-y growth process on Si1-xGex is strongly affected by atmospheric contaminants. Further minimization of air exposure, through use of Si1-xGex homoepitaxial buffers and growth of Si1-xGex and GaAsyP1-y in a single reactor, is expected to further improve epitaxial quality across the entire lattice-matched GaAsyP1-y/Si1-xGex range, including GaP on Si.

Download or read book Heterogeneous Integration of III V and II IV Semiconductor Sheets Onto Silicon Substrate Through Electric Field Assisted Assembly for Device Applications written by Scott Levin and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Market forces are creating a strong need to make value-added enhancements to silicon (Si) complementary metal-oxide semiconductor (CMOS) integrated circuit (IC) technology. One approach to achieve this goal is through continued scaling following Moore's law. With the future of device scaling being relatively uncertain in the next 10-20 years, it is important to find new ways to add value to CMOS. Theoretical projections show that monolithic three-dimensional (3D) integration of compound semiconductor (CS) devices can enhance the performance and functionality of future CMOS-based IC's. This becomes increasingly important with continued scaling. With each new technology node the interconnect pitch is reduced, increasing the RC delay. The net result is an increase in response time between circuit components, resulting in a greater need for 3D integration to minimize the length of the contact lines between CMOS and other non-digital functionalities. To achieve this complex goal, a flexible heterogeneous integration strategy is required that can incorporate a diverse selection of materials all onto a single substrate. Electric-field assisted assembly is a promising technique that allows for fast, low temperature and versatile integration of a large variety of materials onto alternative substrates. In this technique, particles can be assembled from solution at high yields, achieving sub-micron alignment registration to predefined features on the substrate. The approach is not limited by mismatch in coefficient of thermal expansion (CTE) and lattice constant, offering the flexibility to apply materials at the device layer, or any subsequent layer in the CMOS backend. In this thesis research, electric-field assisted assembly of micron-sized compound semiconductor (CS) sheets is studied through a combination of experiment and finite element method (FEM) modeling. This work presents a clear picture of charge distribution within an assembled particle on the substrate, and uses the model to accurately predict the preferred assembly position. The assembly position is confirmed experimentally, demonstrating reproducible sub-micron alignment accuracy with respect to patterned features on a substrate. Through a combination of electric-field assisted assembly and top down fabrication, a novel heterogeneous integration strategy is demonstrated. As a proof of concept, this technique is used to create In0.53Ga0.47As fin geometry p+-i-n+ junctions directly on Si substrates. The as-etched fin devices are not rectifying, but with annealing at 350oC in N2 for 20 minutes, the electrical properties are restored. This process is further developed to implement fin tunnel field-effect transistors (TFETs) and metal-oxide semiconductor field-effect transistors (MOSFETs) integrated on Si. While dry etch-induced damage degrades the TFET device performance, fin MOSFETs show considerably better device performance due to their majority carrier device operation. Fin MOSFETs have a subthreshold slope of 280mV/decade and an on/off ratio of ~103 at 100mV. Through technology aided computer design (TCAD) simulations, it is shown that MOSFET performance can be improved by implementing an optimized doping design. To further emphasize the versatility of this heterogeneous integration strategy, solution-synthesized germanium selenide (GeSe) particles are assembled onto Si substrates. GeSe offers promise for phase change memory applications and non-toxic solar cells, due to its bandgap in the visible spectrum and use of earth-abundant non-toxic elements. GeSe nanobelts are measured both with 2-pt and 4-pt single particle measurements, and a resistivity of 360 [omega]-cm is determined. This integration strategy is a reproducible technique for single particle measurements of solution-synthesized materials, something significantly lacking in the field. With such a technique, solution-synthesized particles can be evaluated for their use in future device applications.

Download or read book III Nitride Based Semiconductor Electronics and Optical Devices and Thirty Fourth State of the Art Program on Compound Semiconductors SOTAPOCS XXXIV written by F. Ren and published by The Electrochemical Society. This book was released on 2001 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt: