Download or read book Microstructure and Mechanical Properties of Electroless Copper and Their Influence on the Reliability of Printed circuit Boards written by Kuanchih Lin and published by . This book was released on 1990 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Dissertation Abstracts International written by and published by . This book was released on 1991 with total page 758 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book American Doctoral Dissertations written by and published by . This book was released on 1990 with total page 768 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Microelectronics Packaging Handbook written by Rao Tummala and published by Springer Science & Business Media. This book was released on 1997-01-31 with total page 662 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.

Download or read book Metals Abstracts written by and published by . This book was released on 1999 with total page 1014 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Extended Abstracts written by Electrochemical Society and published by . This book was released on 1988 with total page 1142 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book The ELFNET Book on Failure Mechanisms Testing Methods and Quality Issues of Lead Free Solder Interconnects written by Günter Grossmann and published by Springer Science & Business Media. This book was released on 2011-05-12 with total page 313 pages. Available in PDF, EPUB and Kindle. Book excerpt: The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is the work of the European network ELFNET which was founded by the European Commission in the 6th Framework Programme. It brings together contributions from the leading European experts in lead-free soldering. The limited validity of testing methods originating from tin-lead solder was a major point of concern in ELFNET members' discussions. As a result, the network's reliability group decided to bring together the material properties of lead-free solders, as well as the basics of material science, and to discuss their influence on the procedures for accelerated testing. This has led to a matrix of failure mechanisms and their activation and, as a result, to a comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints. The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is written for scientists, engineers and researchers involved with lead-free electronics.

Download or read book Mechanics and Materials for Electronic Packaging Design and process issues in electronic packaging written by American Society of Mechanical Engineers. Applied Mechanics Division and published by . This book was released on 1994 with total page 244 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Chemical Abstracts written by and published by . This book was released on 2002 with total page 2540 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Journal of Electronic Packaging written by and published by . This book was released on 1991 with total page 464 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Development of Microstructure and Its Relationship to the Mechanical Properties of Drawn Copper written by R. B. Nethercott and published by . This book was released on 1977 with total page 9 pages. Available in PDF, EPUB and Kindle. Book excerpt: Dislocation microstructures formed during drawing of copper to strains up to 7, at deformation temperature between 77 and 473K, have been investigated, together with their relationship to the resulting mechanical properties. The changes in microstructure and tensile flow stress are explained by dynamic recovery and recrystallization processes; correlations of mechanical properties are made with parameters describing the dislocation microstructure. (Author).

Download or read book Copper Electrodeposition for Nanofabrication of Electronics Devices written by Kazuo Kondo and published by Springer Science & Business Media. This book was released on 2013-11-20 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.

Download or read book Microelectronics Manufacturing Diagnostics Handbook written by Abraham Landzberg and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 663 pages. Available in PDF, EPUB and Kindle. Book excerpt: The world of microelectronics is filled with cusses measurement systems, manufacturing many success stories. From the use of semi control techniques, test, diagnostics, and fail ure analysis. It discusses methods for modeling conductors for powerful desktop computers to their use in maintaining optimum engine per and reducing defects, and for preventing de formance in modem automobiles, they have fects in the first place. The approach described, clearly improved our daily lives. The broad while geared to the microelectronics world, has useability of the technology is enabled, how applicability to any manufacturing process of similar complexity. The authors comprise some ever, only by the progress made in reducing their cost and improving their reliability. De of the best scientific minds in the world, and fect reduction receives a significant focus in our are practitioners of the art. The information modem manufacturing world, and high-quality captured here is world class. I know you will diagnostics is the key step in that process. find the material to be an excellent reference in of product failures enables step func Analysis your application. tion improvements in yield and reliability. which works to reduce cost and open up new Dr. Paul R. Low applications and technologies. IBM Vice President and This book describes the process ofdefect re of Technology Products General Manager duction in the microelectronics world.

Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1994 with total page 892 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceedings written by and published by . This book was released on 1994 with total page 1158 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Effect of Sample Size on Microstructure and Mechanical Properties of OFHC Copper Processed by Equal Channel Angular Pressing written by and published by . This book was released on 2015 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Progress in Adhesion and Adhesives Volume 4 written by K. L. Mittal and published by John Wiley & Sons. This book was released on 2019-07-01 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt: A solid collection of interdisciplinary review articles on the latest developments in adhesion science and adhesives technology With the ever-increasing amount of research being published, it is a Herculean task to be fully conversant with the latest research developments in any field, and the arena of adhesion and adhesives is no exception. Thus, topical review articles provide an alternate and very efficient way to stay abreast of the state-of-the-art in many subjects representing the field of adhesion science and adhesives. Based on the success of the preceding volumes in this series "Progress in Adhesion and Adhesives"), the present volume comprises 9 review articles published in Volume 6 (2018) of Reviews of Adhesion and Adhesives. The subject of these reviews fall into the following general areas: 1. Adhesion to wood and wood bonds 2. Adhesive joints 3. Adhesion in microelectronic packaging 4. Surface modification 5. Contact angle, wettability and surface free energy. The topics covered include: Adhesion phenomena in microelectronic packaging; adhesives for wood and lignocellulosic materials; adhesion to wood and lignocellulosic materials; adhesively bonded lap joints having bi-adhesive and modulus-graded bondlines; adhesion between compounded elastomers; applications of contact angle measurements in pharmaceuticals and foods; oxygen or ammonia plasma treatment of polyolefin surfaces; surface free energy determination of powders and particles; wood bonds; and dispersion adhesion forces between macroscopic objects.