Download or read book Microstructure and Mechanical Properties of Electrodeposited Copper Films written by Xiaoning Song and published by . This book was released on 2011 with total page 110 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microstructural and Mechanical Characterization of Electrodeposited Gold Films4 written by DT. Read and published by . This book was released on 2001 with total page 16 pages. Available in PDF, EPUB and Kindle. Book excerpt: The effects of temperature and duration of thermal treatments on the microstructure and mechanical properties of electrodeposited gold films were evaluated. Specimens were synthesized by electrodeposition of gold on copper foil substrates followed by application of novel photolithographic and microetching techniques so as to produce a series of free-standing gold thin-films of dimensions 2.5 by 200 by 800 ?m supported by copper foil frames. Seven different heat treatments, spanning temperatures from 25 to 300°C and up to 8 h in duration, were studied. In each case, thermal annealing of the samples was carried out in an inert atmosphere after the copper foil substrate beneath the tensile coupons had been removed by CuCl2 etchants. X-ray diffraction was used to assess the microstructures. The crystalline texture of the films changed from predominantly 111 (perpendicular to the plane) to strongly 100, and then back toward 111 with heat treatment. No evidence for grain growth was seen in the X-ray diffraction results. Tensile-strength analyses were performed using a piezo-actuated microtensile testing system. The properties of the heat-treated specimens varied significantly from those of the nontreated material. Tensile strength generally decreased with longer heat treatment. Cyclic fluctuations in the elongation-to-failure, strikingly similar to those in the ratio of 200 to 111 diffracted X-ray intensities, were observed as a function of increasing heattreatment temperature.
Download or read book Mechanical Properties of Structural Films written by Christopher L. Muhlstein and published by ASTM International. This book was released on 2001 with total page 333 pages. Available in PDF, EPUB and Kindle. Book excerpt: Recent advances in the mechanical properties of structural films are described in these papers from a November 2000 symposium held in Orlando, Florida. Papers are organized in sections on fracture and fatigue of structural films, elastic behavior and residual stress in thin films, tensile testing of
Download or read book The Structure and Mechanical Properties of Electrodeposited Copper Single Crystals written by Richard Sard and published by . This book was released on 1967 with total page 314 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Mechanical Properties and Deformation Behavior of Materials Having Ultra Fine Microstructures written by M. Nastasi and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: In an attempt to meet the demand for new ultra-high strength materials, the processing of novel material configurations with unique microstructure is being explored in systems which are further and further from equilibrium. One such class of emerging materials is the so-called nanophased or nanostructured materials. This class of materials includes metals and alloys, ceramics, and polymers characterized by controlled ultra-fine microstructural features in the form oflayered, fibrous, or phase and grain distribution. While it is clear that these materials are in an early stage of development, there is now a sufficient body of literature to fuel discussion of how the mechanical properties and deformation behavior can be controlled through control of the microstructure. This NATO-Advanced Study Institute was convened in order to assess our current state of knowledge in the field of mechanical properties and deformation behavior in materials with ultra fine microstructure, to identify opportunities and needs for further research, and to identify the potential for technological applications. The Institute was the first international scientific meeting devoted to a discussion on the mechanical properties and deformation behavior of materials having grain sizes down to a few nanometers. Included in these discussions were the topics of superplasticity, tribology, and the supermodulus effect. Lectures were also presented which covered a variety of other themes including synthesis, characterization, thermodynamic stability, and general physical properties.
Download or read book Physical and Mechanical Properties of Electrodeposited Copper written by and published by . This book was released on 1970 with total page 105 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microstructure and Mechanical Properties of Electroless Copper and Their Influence on the Reliability of Printed circuit Boards written by Kuanchih Lin and published by . This book was released on 1990 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Nanocoatings written by Mahmood Aliofkhazraei and published by Springer Science & Business Media. This book was released on 2011-03-29 with total page 262 pages. Available in PDF, EPUB and Kindle. Book excerpt: Size effect in structures has been taken into consideration over the last years. In comparison with coatings with micrometer-ranged thickness, nanostructured coatings usually enjoy better and appropriate properties, such as strength and resistance. These coatings enjoy unique magnetic properties and are used with the aim of producing surfaces resistant against erosion, lubricant system, cutting tools, manufacturing hardened sporadic alloys, being resistant against oxidation and corrosion. This book reviews researches on fabrication and classification of nanostructured coatings with focus on size effect in nanometric scale. Size effect on electrochemical, mechanical and physical properties of nanocoatings are presented.
Download or read book Microstructure Evolution in Electrodeposited Copper Thin Films for Advanced Microelectronic Applications written by Nidal Khalaf Alshwawreh and published by . This book was released on 2012 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microstructure and Properties of Copper Thin Films on Silicon Substrates written by Vibhor Vinodkumar Jain and published by . This book was released on 2010 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Copper has become the metal of choice for metallization, owing to its high electrical and thermal conductivity, relatively higher melting temperature and correspondingly lower rate of diffusivity. Most of the current studies can get high strength copper thin films but on an expense of conductivity. This study proposes a technique to deposit high strength and high conductivity copper thin films on different silicon substrates at room temperature. Single crystal Cu (100) and Cu (111) have been grown on Si (100) and Si (110) substrates, respectively. Single crystal Cu (111) films have a high density of growth twins, oriented parallel to the substrate surface due to low twin boundary energy and a high deposition rate. The yield strengths of these twinned Cu films are much higher than that of bulk copper, with an electrical resistivity value close to that of bulk copper. X-ray diffraction, transmission electron microscopy and nanoindentation techniques were used to show that high density twins are sole reason for the increase in hardness of these thin films. The formation of growth twins and their roles in enhancing the mechanical strength of Cu films while maintaining low resistivity are discussed.
Download or read book THERMEC 2021 written by Mihail Ionescu and published by Trans Tech Publications Ltd. This book was released on 2021-01-05 with total page 1937 pages. Available in PDF, EPUB and Kindle. Book excerpt: International Conference on Processing & Manufacturing of Advanced Materials Processing, Fabrication, Properties, Applications Selected, peer-reviewed papers from the International Conference on Processing & Manufacturing of Advanced Materials Processing, Fabrication, Properties, Applications (THERMEC 2021), May 10-14, 2021, Vienna, Austria
Download or read book Metallization written by S. P. Murarka and published by Butterworth-Heinemann. This book was released on 1993 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt: This title covers fundemental concepts, properties and applicabilities of metals and alloys for use in various metallization schemes. Metallizations form the key components on electronic circuits - controlling device properties and providing power and device interconnections with the outside world or with other devices. The recent advent of submicron dimensions and increasingly faster devices in the semiconductor have challenged researchers to keep metallization schemes in line with new demanding requirements.
Download or read book Research of the Microstructure and Mechanical Properties of Copper and CuZn36 Developing during Deformation into the Equal Channel Speed Matrix with High Intensity Cooling written by and published by . This book was released on 2016 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Room Temperature Evolution of Microstructure and Resistivity in Electroplated Copper Films written by C. Cabral and published by . This book was released on 1998 with total page 7 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Effect of Sample Size on Microstructure and Mechanical Properties of OFHC Copper Processed by Equal Channel Angular Pressing written by and published by . This book was released on 2015 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1990 with total page 240 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Room Temperature Evolution of Microstructure and Resistivity in Electroplated Copper Films written by International Business Machines Corporation. Research Division and published by . This book was released on 1998 with total page 7 pages. Available in PDF, EPUB and Kindle. Book excerpt: Abstract: "We demonstrate that at room temperature (21 C̊), electroplated Cu films undergo microstructural changes which are manifested by a large decrease in resistivity. The electroplated, 1 [mu]m thick films were monitored in situ using resistance and stress analysis and ex situ using focused ion beam (FIB), theta-theta x-ray diffraction (XRD) and pole figure analysis. The films, while held at 21 C̊, undergo a 20 to 25% decrease in resistivity and a decrease in compressive stress to near zero values. The resistance and stress changes are driven by complete recrystallization of the film where grains grow in size by over an order of magnitude. The recrystallization leads to a microstructure which has a stronger Cu(111) fiber texture. The effective activation energy for the process was calculated using the Kissinger analysis method applied to plots of in situ resistance as a function of temperature with varied heating ramp rates. The processes involved in the evolution of the new microstructure in the electroplated Cu films have an effective activation energy of 0.92 [+ or -] 0.04 eV, which is consistent with grain boundary diffusion as the dominant mechanism."
