Download or read book Microstructure and Electromigration Effects in A1 and A1 Alloy Thin Films written by John Espinoza Sanchez (Jr) and published by . This book was released on 1991 with total page 276 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microstructure and Electromigration Effects in AL and AL ALLOY Thin Films written by John E. Sanchez and published by . This book was released on 1991 with total page 254 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book The Microstructural Mechanism of Electromigration Failure in Narrow Interconnects of A1 Alloys written by Choongun Kim and published by . This book was released on 1993 with total page 464 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book The Electromigration Effects in Tin Base Alloy Thin Films written by Prabjit Singh and published by . This book was released on 1973 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electromigration in Thin Films and Electronic Devices written by Choong-Un Kim and published by Elsevier. This book was released on 2011-08-28 with total page 353 pages. Available in PDF, EPUB and Kindle. Book excerpt: Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area.Part one consists of three introductory chapters, covering modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation and x-ray microbeam studies of electromigration. Part two deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure. Finally, part three covers electromigration in solder, with chapters discussing topics such as electromigration-induced microstructural evolution and electromigration in flip-chip solder joints.With its distinguished editor and international team of contributors, Electromigration in thin films and electronic devices is an essential reference for materials scientists and engineers in the microelectronics, packaging and interconnects industries, as well as all those with an academic research interest in the field. - Provides up-to-date coverage of the continued development of advanced copper interconnects for integrated circuits - Comprehensively reviews modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation, and x-ray microbeam studies of electromigration - Deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure
Download or read book Effect of Microstructure of Aluminum Alloys on the Electromigration limited Reliability of VLSI Interconnects written by Jaeshin Cho and published by . This book was released on 1990 with total page 444 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Preparation and Properties of Thin Films written by K. N. Tu and published by Elsevier. This book was released on 2013-10-22 with total page 351 pages. Available in PDF, EPUB and Kindle. Book excerpt: Treatise on Materials Science and Technology, Volume 24: Preparation and Properties of Thin Films covers the progress made in the preparation of thin films and the corresponding study of their properties. The book discusses the preparation and property correlations in thin film; the variation of microstructure of thin films; and the molecular beam epitaxy of superlattices in thin film. The text also describes the epitaxial growth of silicon structures (thermal-, laser-, and electron-beam-induced); the characterization of grain boundaries in bicrystalline thin films; and the mechanical properties of thin films on substrates. The ion beam modification of thin film; the use of thin alloy films for metallization in microelectronic devices; and the fabrication and physical properties of ultrasmall structures are also encompassed. Materials scientists and materials engineers will find the book invaluable.
Download or read book Effect of Microstructure of Aluminum Alloys on the Electromigration limited Reliability of VLSI Interconnects written by and published by . This book was released on 1990 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: By Jaeshin Cho.
Download or read book Nuclear Science Abstracts written by and published by . This book was released on 1971 with total page 1022 pages. Available in PDF, EPUB and Kindle. Book excerpt: NSA is a comprehensive collection of international nuclear science and technology literature for the period 1948 through 1976, pre-dating the prestigious INIS database, which began in 1970. NSA existed as a printed product (Volumes 1-33) initially, created by DOE's predecessor, the U.S. Atomic Energy Commission (AEC). NSA includes citations to scientific and technical reports from the AEC, the U.S. Energy Research and Development Administration and its contractors, plus other agencies and international organizations, universities, and industrial and research organizations. References to books, conference proceedings, papers, patents, dissertations, engineering drawings, and journal articles from worldwide sources are also included. Abstracts and full text are provided if available.
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1994 with total page 836 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 1 f Noise and Electromigration in A1 Ti Thin Films written by James N. Bisnett and published by . This book was released on 1986 with total page 46 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Energy Research Abstracts written by and published by . This book was released on 1993 with total page 900 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electromigration Testing of Al Alloy Films written by P. B. Ghate and published by . This book was released on 1980 with total page 85 pages. Available in PDF, EPUB and Kindle. Book excerpt: A search for reliability improvement of Al film interconnections has led to the introduction of Al-Alloy films such as Al+Cu, Al+Cu+Si and so on. This report describes the results of an in-depth study of Al, Al+Cu (2 wt % Cu) and Al+Cu+Si (2 wt % Cu + 1% Si) film interconnections and Silicon/Al-Alloy film contacts as they impact reliability of integrated circuits. Resistivity, microstructure and composition of Al-Alloy films vacuum deposited from an induction heated source (IN-Source) and dc magnetron sputter deposition techniques have been investigated and it is concluded that IN-Source and dc magnetron sputter deposition tecniques are equally capable of producing Al, Al+Cu (2 wt %) and Al+Cu+Si (2 wt % Cu + 1% Si) films of comparable compositions, resistivity and microstructure. Chemical Analysis X-Ray Fluorescence Electron Microprobe, Scanning and Transmission Electron Microscopy and Ion Microprobe have been employed for Al-Alloy film characterization. Availability of automated dc magnetron sputter (M-S) deposition equipment was a primary factor in the selection of magnetron sputter deposited Al-Alloy films for electromigration testing. (Author).
Download or read book Microstructural Configuration Influence on Electromigration in Sn Cu Thin Films written by Yi Xu and published by . This book was released on 1994 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microstructural Modification of Thin Films and Its Relation to the Electromigration limited Reliability of VLSI Interconnects written by Hai Pham Longworth and published by . This book was released on 1992 with total page 524 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electromigration in Thin Film Aluminum Alloy Interconnects written by Lawrence Edward Felton and published by . This book was released on 1986 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Metals Abstracts written by and published by . This book was released on 1997 with total page 782 pages. Available in PDF, EPUB and Kindle. Book excerpt:
