Download or read book Microstructural Characterization of Ultra Thin Copper Interconnects written by Hee-Dong Yang and published by . This book was released on 2004 with total page 274 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microstructural Characterization of Copper Films Deposited in Titanium Substrates written by Lois Diane Harper Walsh and published by . This book was released on 1984 with total page 108 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-04-02 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
Download or read book ITHERM written by and published by . This book was released on 2004 with total page 798 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microstructural Mechanisms for Early Failures of Integrated Circuit Interconnects and Characterization of A1 Y Alloy Thin Films for Interconnects written by Yongkun Liu and published by . This book was released on 1998 with total page 284 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Metrology and Diagnostic Techniques for Nanoelectronics written by Zhiyong Ma and published by CRC Press. This book was released on 2017-03-27 with total page 1454 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanoelectronics is changing the way the world communicates, and is transforming our daily lives. Continuing Moore’s law and miniaturization of low-power semiconductor chips with ever-increasing functionality have been relentlessly driving R&D of new devices, materials, and process capabilities to meet performance, power, and cost requirements. This book covers up-to-date advances in research and industry practices in nanometrology, critical for continuing technology scaling and product innovation. It holistically approaches the subject matter and addresses emerging and important topics in semiconductor R&D and manufacturing. It is a complete guide for metrology and diagnostic techniques essential for process technology, electronics packaging, and product development and debugging—a unique approach compared to other books. The authors are from academia, government labs, and industry and have vast experience and expertise in the topics presented. The book is intended for all those involved in IC manufacturing and nanoelectronics and for those studying nanoelectronics process and assembly technologies or working in device testing, characterization, and diagnostic techniques.
Download or read book Microstructural Characterization of Impact Welded Copper copper Interfaces written by Michael James Borden and published by . This book was released on 1987 with total page 320 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book High Cycle Fatigue of Al and Cu Thin Films by a Novel High Throughput Method written by Sofie Burger and published by KIT Scientific Publishing. This book was released on 2014-05-19 with total page 172 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the last two decades, the reliability of small electronic devices used in automotive or consumer electronics gained researchers attention. Thus, there is the need to understand the fatigue properties and damage mechanisms of thin films. In this thesis a novel high-throughput testing method for thin films on Si substrate is presented. The specialty of this method is to test one sample at different strain amplitudes at the same time and measure an entire lifetime curve with only one experiment.
Download or read book Characterization and Metrology for ULSI Technology 2000 written by David G. Seiler and published by . This book was released on 2001 with total page 734 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Copper Interconnects New Contact Metallurgies structures and Low k Interlevel Dielectrics II written by G. S. Mathad and published by The Electrochemical Society. This book was released on 2003 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Copper Interconnects New Contact Metallurgies structures and Low k Interlevel Dielectrics written by and published by The Electrochemical Society. This book was released on 2003 with total page 364 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Mechanics of Solder Alloy Interconnects written by Darrel R. Frear and published by Springer Science & Business Media. This book was released on 1994-01-31 with total page 434 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.
Download or read book Direct Copper Interconnection for Advanced Semiconductor Technology written by Dongkai Shangguan and published by CRC Press. This book was released on 2024-06-28 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1995 with total page 704 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Effect of Downscaling Copper Interconnects on the Microstructure Revealed by High Resolution Tem Orientation Mapping written by Jai Ganesh Kameswaran and published by . This book was released on 2011 with total page 412 pages. Available in PDF, EPUB and Kindle. Book excerpt: The scaling required to accommodate faster chip performance in microelectronic devices has necessitated a reduction in the dimensions of copper interconnects at the back end of the line. The constant downscaling of copper interconnects has resulted in changes to the microstructure, and these variations are known to impact electrical resistivity and reliability issues in interconnects. In this work, a novel electron diffraction technique called Diffraction Scanning Transmission Electron Microscopy (D-STEM) has been developed and coupled with precession electron microscopy to obtain quantitative local texture information in damascene copper lines (1.8 \mu m to 70 nm in width) with a spatial resolution of less than 5 nm. Misorientation and trace analysis has been performed to investigate the the grain boundary distribution in these lines. The results reveal strong variations in texture and grain boundary distribution of the copper lines upon downscaling. 1.8 \mu m wide lines exhibit strong 111 normal texture and comprise large bamboo-type grains. Upon downscaling to 180 nm, a {111} 110 biaxial texture has been observed. In contrast, narrower lines of widths 120 nm and 70 nm reveal sidewall growth of {111} grains and a dominant 110 normal texture. The fraction of coherent twin boundaries also reduces with decreasing line width. The microstructure changes from bamboo-type in wider lines to one comprising clusters of small grains separated by high angle boundaries in the vicinity of large grains. The evolution of such a microstructure has been discussed in terms of overall energy minimization and dimensional constraints. Finite element analysis has been performed to correlate misorientations between grains and local thermal stresses associated with stress migration. Effect of variations in the copper interconnect microstructure on electromigration flux divergence has also been discussed.
Download or read book Microstructure and Reliability of Copper Interconnects written by Changsup Ryu and published by . This book was released on 1998 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Solar Energy Update written by and published by . This book was released on 1983-11 with total page 196 pages. Available in PDF, EPUB and Kindle. Book excerpt:
