Download or read book Microelectronic System Interconnections written by Stuart K. Tewksbury and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1994 with total page 536 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic system interconnections provides a uniques approach to the subject.
Download or read book Microelectronic Interconnections and Assembly written by G.G. Harman and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 295 pages. Available in PDF, EPUB and Kindle. Book excerpt: MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.
Download or read book Microelectronic Systems written by Albert Heuberger and published by Springer Science & Business Media. This book was released on 2011-12-27 with total page 366 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is dedicated to Prof. Dr. Heinz Gerhäuser on the occasion of his retirement both from the position of Executive Director of the Fraunhofer Institute for Integrated Circuits IIS and from the Endowed Chair of Information Technologies with a Focus on Communication Electronics (LIKE) at the Friedrich-Alexander-Universität Erlangen-Nürnberg. Heinz Gerhäuser's vision and entrepreneurial spirit have made the Fraunhofer IIS one of the most successful and renowned German research institutions. He has been Director of the Fraunhofer IIS since 1993, and under his leadership it has grown to become the largest of Germany's 60 Fraunhofer Institutes, a position it retains to this day, currently employing over 730 staff. Likely his most important scientific as well as application-related contribution was his pivotal role in the development of the mp3 format, which would later become a worldwide success. The contributions to this Festschrift were written by both Fraunhofer IIS staff and external project team members in appreciation of Prof. Dr. Gerhäuser's lifetime academic achievements and his inspiring leadership at the Fraunhofer IIS. The papers reflect the broad spectrum of the institute's research activities and are grouped into sections on circuits, information systems, visual computing, and audio and multimedia. They provide academic and industrial researchers in fields like signal processing, sensor networks, microelectronics, and integrated circuits with an up-to-date overview of research results that have a huge potential for cutting-edge industrial applications.
Download or read book A Functional Description of the Edvac an Automatically sequence Serial Binary Electronic Digital Computer written by Moore School of Electrical Engineering and published by . This book was released on 1949 with total page 1794 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Analytical Methodology of Tree Microstrip Interconnects Modelling For Signal Distribution written by Blaise Ravelo and published by Springer Nature. This book was released on 2019-11-21 with total page 239 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the modelling methodology of microstrip interconnects, discussing various structures of single-input multiple-output (SIMO) tree interconnects for signal integrity (SI) engineering. Further, it describes lumped and distributed transmission line elements based on single-input single-output (SIMO) models of symmetric and asymmetric trees, and investigates more complicated phenomenon, such as interbranch coupling. The modelling approaches are based on the analytical methods using the Z-, Y- and T-matrices. The established method enables the S-parameters and voltage transfer function of SIMO tree to be determined. Providing illustrative results with frequency and time domain analyses for each tree interconnect structure, the book is a valuable resource for researchers, engineers, and graduate students in fields of analogue, RF/microwave, digital and mixed circuit design, SI and manufacturing engineering.
Download or read book Electronic Connection Techniques and Equipment 1968 69 written by G.W.A. Dummer and published by Elsevier. This book was released on 2013-10-02 with total page 571 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic Connection Techniques and Equipment 1968–69 presents the methods and equipment used in the wide field of electronic connections. This book describes all connection methods, including automated systems and microelectronic interconnections. This text covers all aspects of electronic connections, such as the system selection parameters and applications, as well as information on reliability. This book provides information on a wide range of methods and equipment in use and available in the United States of America and in the United Kingdom. Information is also included on welding, smoldering, wrapping, bonding, and crimping. The materials are extensively illustrated with diagrams and photographs describing system, equipment, application, and operation. This book is a valuable resource for readers who are interested in the connection and interconnection of electronic components, equipment, and devices.
Download or read book Microelectronic Interconnects and Packages written by and published by . This book was released on 1991 with total page 694 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book High Performance Clock Distribution Networks written by Eby G. Friedman and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 163 pages. Available in PDF, EPUB and Kindle. Book excerpt: A number of fundamental topics in the field of high performance clock distribution networks is covered in this book. High Performance Clock Distribution Networks is composed of ten contributions from authors at academic and industrial institutions. Topically, these contributions can be grouped within three primary areas. The first topic area deals with exploiting the localized nature of clock skew. The second topic area deals with the implementation of these clock distribution networks, while the third topic area considers more long-range aspects of next-generation clock distribution networks. High Performance Clock Distribution Networks presents a number of interesting strategies for designing and building high performance clock distribution networks. Many aspects of the ideas presented in these contributions are being developed and applied today in next-generation high-performance microprocessors.
Download or read book Physics of Failure Based Handbook of Microelectronic Systems written by Shahrzad Salemi and published by RIAC. This book was released on 2008 with total page 271 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Quality Conformance and Qualification of Microelectronic Packages and Interconnects written by Michael Pecht and published by John Wiley & Sons. This book was released on 1994-12-13 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt: All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don't cost-effectively address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests. This book's groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today's high-performancemicroelectronics. It does this with powerful... * Techniques for identifying and modeling failure mechanismsearlier in the design cycle, breaking the need to rely on fielddata * Physics-of-failure product reliability assessment methods thatcan be proactively implemented throughout the design andmanufacture of the product * Process controls that decrease variabilities in the end productand reduce end-of-line screening and testing A wide range of microelectronic package and interconnectconfigurations for both single-and multi-chip modules is examined,including chip and wire-bonds, tape-automated (TAB), flip-TAB,flip-chip bonds, high-density interconnects, chip-on-board designs(COB), MCM, 3-D stack, and many more. The remaining packageelements, such as die attachment, case and lid, leads, and lid andlead seals are also discussed in detail. The product of a distinguished team of authors and editors, thisbook's guidelines for avoiding potential high-risk manufacturingand qualification problems, as well as for implementing ongoingquality assurance, are sure to prove invaluable to both studentsand practicing professionals. For the professional engineer involved in the design andmanufacture of products containing electronic components, here is acomprehensive handbook to the theory and methods surrounding theassembly of microelectronic and electronic components. The bookfocuses on computers and consumer electronic products with internalsubsystems that reflect mechanical design constraints, costlimitations, and aesthetic and ergonomic concerns. Taking a totalsystem approach to packaging, the book systematically examines:basic chip and computer architecture; design and layout;interassembly and interconnections; cooling scheme; materialsselection, including ceramics, glasses, and metals; stress,vibration, and acoustics; and manufacturing and assemblytechnology. 1994 (0-471-53299-1) 800 pp. INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGNGUIDELINES: A Focus on Reliability --Michael Pecht This comprehensive guide features a uniquely organized time-phasedapproach to design, development, qualification, manufacture, andin-service management. It provides step-by-step instructions on howto define realistic system requirements, define the system usageenvironment, identify potential failure modes, characterizematerials and processes by the key control label factors, and useexperiment, step-stress, and accelerated methods to ensure optimumdesign before production begins. Topics covered include: detaileddesign guidelines for substrate...wire and wire, tape automated,and flip-chip bonding...element attachment and case, lead, lead andlid seals--incorporating dimensional and geometric configurationsof package elements, manufacturing and assembly conditions,materials selection, and loading conditions. 1993 (0-471-59446-6)454 pp.
Download or read book Research and Technology Program Digest written by United States. National Aeronautics and Space Administration and published by . This book was released on with total page 792 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microelectronics Packaging Handbook written by R.R. Tummala and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 1060 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Download or read book Introduction to Microelectronics to Nanoelectronics written by Manoj Kumar Majumder and published by CRC Press. This book was released on 2020-11-24 with total page 373 pages. Available in PDF, EPUB and Kindle. Book excerpt: Focussing on micro- and nanoelectronics design and technology, this book provides thorough analysis and demonstration, starting from semiconductor devices to VLSI fabrication, designing (analog and digital), on-chip interconnect modeling culminating with emerging non-silicon/ nano devices. It gives detailed description of both theoretical as well as industry standard HSPICE, Verilog, Cadence simulation based real-time modeling approach with focus on fabrication of bulk and nano-devices. Each chapter of this proposed title starts with a brief introduction of the presented topic and ends with a summary indicating the futuristic aspect including practice questions. Aimed at researchers and senior undergraduate/graduate students in electrical and electronics engineering, microelectronics, nanoelectronics and nanotechnology, this book: Provides broad and comprehensive coverage from Microelectronics to Nanoelectronics including design in analog and digital electronics. Includes HDL, and VLSI design going into the nanoelectronics arena. Discusses devices, circuit analysis, design methodology, and real-time simulation based on industry standard HSPICE tool. Explores emerging devices such as FinFETs, Tunnel FETs (TFETs) and CNTFETs including their circuit co-designing. Covers real time illustration using industry standard Verilog, Cadence and Synopsys simulations.
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1994 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microelectronics written by Jerry C. Whitaker and published by CRC Press. This book was released on 2018-10-03 with total page 485 pages. Available in PDF, EPUB and Kindle. Book excerpt: When it comes to electronics, demand grows as technology shrinks. From consumer and industrial markets to military and aerospace applications, the call is for more functionality in smaller and smaller devices. Culled from the second edition of the best-selling Electronics Handbook, Microelectronics, Second Edition presents a summary of the current state of microelectronics and its innovative directions. This book focuses on the materials, devices, and applications of microelectronics technology. It details the IC design process and VLSI circuits, including gate arrays, programmable logic devices and arrays, parasitic capacitance, and transmission line delays. Coverage ranges from thermal properties and semiconductor materials to MOSFETs, digital logic families, memory devices, microprocessors, digital-to-analog and analog-to-digital converters, digital filters, and multichip module technology. Expert contributors discuss applications in machine vision, ad hoc networks, printing technologies, and data and optical storage systems. The book also includes defining terms, references, and suggestions for further reading. This edition features two new sections on fundamental properties and semiconductor devices. With updated material and references in every chapter, Microelectronics, Second Edition is an essential reference for work with microelectronics, electronics, circuits, systems, semiconductors, logic design, and microprocessors.
Download or read book Interfacial Compatibility in Microelectronics written by Tomi Laurila and published by Springer Science & Business Media. This book was released on 2012-01-13 with total page 221 pages. Available in PDF, EPUB and Kindle. Book excerpt: Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the “traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced. In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: solutions to several common reliability issues in microsystem technology, methods to understand and predict failure mechanisms at interfaces between dissimilar materials and an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA. Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.
Download or read book The Electrical Engineering Handbook Second Edition written by Richard C. Dorf and published by CRC Press. This book was released on 1997-09-26 with total page 2758 pages. Available in PDF, EPUB and Kindle. Book excerpt: In 1993, the first edition of The Electrical Engineering Handbook set a new standard for breadth and depth of coverage in an engineering reference work. Now, this classic has been substantially revised and updated to include the latest information on all the important topics in electrical engineering today. Every electrical engineer should have an opportunity to expand his expertise with this definitive guide. In a single volume, this handbook provides a complete reference to answer the questions encountered by practicing engineers in industry, government, or academia. This well-organized book is divided into 12 major sections that encompass the entire field of electrical engineering, including circuits, signal processing, electronics, electromagnetics, electrical effects and devices, and energy, and the emerging trends in the fields of communications, digital devices, computer engineering, systems, and biomedical engineering. A compendium of physical, chemical, material, and mathematical data completes this comprehensive resource. Every major topic is thoroughly covered and every important concept is defined, described, and illustrated. Conceptually challenging but carefully explained articles are equally valuable to the practicing engineer, researchers, and students. A distinguished advisory board and contributors including many of the leading authors, professors, and researchers in the field today assist noted author and professor Richard Dorf in offering complete coverage of this rapidly expanding field. No other single volume available today offers this combination of broad coverage and depth of exploration of the topics. The Electrical Engineering Handbook will be an invaluable resource for electrical engineers for years to come.
