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Book Microcircuit Device Reliability Field Experience Database  Spring 1985

Download or read book Microcircuit Device Reliability Field Experience Database Spring 1985 written by David J. Mahar and published by . This book was released on 1985 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Failure event

    Book Details:
  • Author : David J. Mahar
  • Publisher :
  • Release : 1985
  • ISBN :
  • Pages : 0 pages

Download or read book Failure event written by David J. Mahar and published by . This book was released on 1985 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Field data

    Book Details:
  • Author : David J. Mahar
  • Publisher :
  • Release : 1985
  • ISBN :
  • Pages : 0 pages

Download or read book Field data written by David J. Mahar and published by . This book was released on 1985 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book The GEC Journal of Research

Download or read book The GEC Journal of Research written by and published by . This book was released on 1987 with total page 284 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Electronics

Download or read book Electronics written by and published by . This book was released on 1985 with total page 1130 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Evaluation Engineering

Download or read book Evaluation Engineering written by and published by . This book was released on 1986 with total page 780 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Microcircuit Device Reliability  Linear Interface Data

Download or read book Microcircuit Device Reliability Linear Interface Data written by and published by . This book was released on 1984 with total page 342 pages. Available in PDF, EPUB and Kindle. Book excerpt: This report, a compendium of linear/interface microcircuit reliability data, contains data accumulated on the testing and field experience of these part types. The data is separated into two major sections; one section containing the field activity, testing performed, and subsequent results; the other section contains only verified failure information obtained from failure analysis studies. In each of the two sections, the detailed data is presented along with summaries prepared from the detailed section for each functional group, linear or interface. The summaries of the field data along with residual plots provide a quick insight into a comparison of the observed field failure rates and MIL-HDBK-217 predicted values. Originator-supplied keywords include: Linear integrated circuits; Interface circuits; Reliability; Failure mode; and Failure analysis results.

Book Microcircuit Device Reliability

Download or read book Microcircuit Device Reliability written by Mark R. Klein and published by . This book was released on 1978 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt: This compendium of microcircuit device reliability is separated into two parts: Digital Failure Rate Summarized Data and Digital Device Data - Detailed Listings. The summaries pertain to warranty experience, plastic encapsulated I.C. lot acceptance information, and generic field, reliability demonstration, equipment checkout and life test data. The detailed listings consist of field, reliability demonstration, and equipment checkout experience as well as life test results arranged by operational type, manufacturer, and part number. MIL-HDBK-217B parameters have been incorporated into the entries to permit comparisons with predicted values. (Author).

Book Scientific and Technical Aerospace Reports

Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1987 with total page 1126 pages. Available in PDF, EPUB and Kindle. Book excerpt: Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.

Book Microcircuit Device Reliability

Download or read book Microcircuit Device Reliability written by Mark R. Klein and published by . This book was released on 1976 with total page 225 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Microcircuit Device Reliability  Hybrid Circuit Data

Download or read book Microcircuit Device Reliability Hybrid Circuit Data written by Timothy E. Turner and published by . This book was released on 1978 with total page 210 pages. Available in PDF, EPUB and Kindle. Book excerpt: This compendium of Hybrid Microcircuit Reliability Data contains both detailed and summarized information. The detailed data have been collected from both military and commercial applications and consist of field experience, reliability demonstration results, screening fallout, life tests, and equipment check-out results. A full description of the construction of each device as well as the manufacturer and all test parameters have been included. The summarized data show the distribution of failure causes for hybrids subjected to various conditions, failure rates of components used within hybrids, the screening fallout distribution and a comparison between field data and MIL-HDBK-217B predictions. (Author).

Book Microcircuit Device Reliability  Digital Evaluation and Generic Failure Analysis Data

Download or read book Microcircuit Device Reliability Digital Evaluation and Generic Failure Analysis Data written by David B. Nicholls and published by . This book was released on 1979 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: This report of digital evaluation and generic failure analysis data is one of a series of annual microcircuit device reliability data publications compiled by the Reliability Analysis Center. This compendium provides burn-in and environmental/screening data on SSI and MSI digital microcircuits. Each document in the series contains analyzed reliability information in addition to a detailed presentation of field and test results. This information aids in determining device fallout rates and the operational test and field characteristics of devices. Life test results can be reviewed. The relative risks of screening decisions may also be determined. Additionally, information is available to form the foundation for failure mode effects and criticality analyses(FMECA). Through the data presented, these publications are intended to actively complement such publications as MIL-STD-883 and MIL-HDBK-217B. The user is cautioned, however, that the listed data may not be used in lieu of contractually cited references.

Book Government Reports Announcements   Index

Download or read book Government Reports Announcements Index written by and published by . This book was released on 1985-10 with total page 1060 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Practical Reliability Engineering

Download or read book Practical Reliability Engineering written by Patrick O'Connor and published by Wiley. This book was released on 1997-02-24 with total page 72 pages. Available in PDF, EPUB and Kindle. Book excerpt: This classic textbook/reference contains a complete integration of the processes which influence quality and reliability in product specification, design, test, manufacture and support. Provides a step-by-step explanation of proven techniques for the development and production of reliable engineering equipment as well as details of the highly regarded work of Taguchi and Shainin. New to this edition: over 75 pages of self-assessment questions plus a revised bibliography and references. The book fulfills the requirements of the qualifying examinations in reliability engineering of the Institute of Quality Assurance, UK and the American Society of Quality Control.

Book Semiconductor Packaging

Download or read book Semiconductor Packaging written by Andrea Chen and published by CRC Press. This book was released on 2016-04-19 with total page 216 pages. Available in PDF, EPUB and Kindle. Book excerpt: In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.