Download or read book MEMS Pressure Sensors Fabrication and Process Optimization written by Parvej Ahmad Alvi and published by Lulu.com. This book was released on 2014-07-14 with total page 176 pages. Available in PDF, EPUB and Kindle. Book excerpt: MEMS Pressure Sensors: Fabrication and Process Optimization - describs the step by step fabrication process sequence along with flow chart for fabrication of micro pressure sensors taking into account various aspects of fabrication and designing of the pressure sensors as well as fabrication process optimization. A complete experimental detail before and after each step of fabrication of the sensor has also been discussed. This leads to the uniqueness of the book. MEMS Pressure Sensors: Fabrication and Process Optimization will greatly benefit undergraduate and postgraduate students of MEMS and NEMS courses. Process engineers and technologists in the microelectronics industry including MEMS-based sensors manufacturers.

Download or read book Poly SiGe for MEMS above CMOS Sensors written by Pilar Gonzalez Ruiz and published by Springer Science & Business Media. This book was released on 2013-07-17 with total page 210 pages. Available in PDF, EPUB and Kindle. Book excerpt: Polycrystalline SiGe has emerged as a promising MEMS (Microelectromechanical Systems) structural material since it provides the desired mechanical properties at lower temperatures compared to poly-Si, allowing the direct post-processing on top of CMOS. This CMOS-MEMS monolithic integration can lead to more compact MEMS with improved performance. The potential of poly-SiGe for MEMS above-aluminum-backend CMOS integration has already been demonstrated. However, aggressive interconnect scaling has led to the replacement of the traditional aluminum metallization by copper (Cu) metallization, due to its lower resistivity and improved reliability. Poly-SiGe for MEMS-above-CMOS sensors demonstrates the compatibility of poly-SiGe with post-processing above the advanced CMOS technology nodes through the successful fabrication of an integrated poly-SiGe piezoresistive pressure sensor, directly fabricated above 0.13 m Cu-backend CMOS. Furthermore, this book presents the first detailed investigation on the influence of deposition conditions, germanium content and doping concentration on the electrical and piezoresistive properties of boron-doped poly-SiGe. The development of a CMOS-compatible process flow, with special attention to the sealing method, is also described. Piezoresistive pressure sensors with different areas and piezoresistor designs were fabricated and tested. Together with the piezoresistive pressure sensors, also functional capacitive pressure sensors were successfully fabricated on the same wafer, proving the versatility of poly-SiGe for MEMS sensor applications. Finally, a detailed analysis of the MEMS processing impact on the underlying CMOS circuit is also presented.

Download or read book MEMS Mechanical Sensors written by Stephen Beeby and published by Artech House. This book was released on 2004 with total page 282 pages. Available in PDF, EPUB and Kindle. Book excerpt: Here's the book to keep handy when you have to overcome obstacles in design, simulation, fabrication and application of MEMS sensors. This practical guide to design tools and packaging helps you create the sensors you need for the full range of mechanical microsensor applications. Critical physical sensing techniques covered include piezoresistive, piezoelectric, capacative, optical, resonant, actuation, thermal, and magnetic, as well as smart sensing.

Download or read book Micro Electro Mechanical System MEMS Pressure Sensor for Footwear written by and published by . This book was released on 2008 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Footwear comprises a sole and a plurality of sealed cavities contained within the sole. The sealed cavities can be incorporated as deformable containers within an elastic medium, comprising the sole. A plurality of micro electro-mechanical system (MEMS) pressure sensors are respectively contained within the sealed cavity plurality, and can be adapted to measure static and dynamic pressure within each of the sealed cavities. The pressure measurements can provide information relating to the contact pressure distribution between the sole of the footwear and the wearer's environment.

Download or read book Resonant MEMS written by Oliver Brand and published by John Wiley & Sons. This book was released on 2015-04-22 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt: Part of the AMN book series, this book covers the principles, modeling and implementation as well as applications of resonant MEMS from a unified viewpoint. It starts out with the fundamental equations and phenomena that govern the behavior of resonant MEMS and then gives a detailed overview of their implementation in capacitive, piezoelectric, thermal and organic devices, complemented by chapters addressing the packaging of the devices and their stability. The last part of the book is devoted to the cutting-edge applications of resonant MEMS such as inertial, chemical and biosensors, fluid properties sensors, timing devices and energy harvesting systems.

Download or read book MEMS Barometers Toward Vertical Position Detection Background Theory System Prototyping and Measurement Analysis written by Dimosthenis E. Bolanakis and published by Morgan & Claypool Publishers. This book was released on 2017-05-08 with total page 147 pages. Available in PDF, EPUB and Kindle. Book excerpt: Micro-Electro-Mechanical-Systems (MEMS) sensors constitute perhaps the most exciting technology of our age. The present effort incorporates all the information needed byscientists and engineers who work on research projects and/or product systems, which apply to air pressure acquisition and to its rearrangement into altitude data. Some of the potential implementations of this method (regularly referred to as barometric altimetry) include, but are not limited to, Position Location Application, Navigation Systems, Clinical Monitoring Applications, and Aircraft Instrumentation. This book holds the key to such applications, providing readers with the theoretical basis as well as the practical perspective of the subject matter. At first, the reader is introduced to the background theory, methods, and applications of barometric altimetry. Thereafter, the book incorporates the development of wireless barometers and a (real time monitoring) wireless sensor network system for scheduling low-cost experimental observations. Finally, a deepened understanding to the analysis procedure of pressure measurements (using Matlab script code) is performed.

Download or read book CMOS MEMS written by Henry Baltes and published by John Wiley & Sons. This book was released on 2008-07-11 with total page 612 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microstructures, electronics, nanotechnology - these vast fields of research are growing together as the size gap narrows and many different materials are combined. Current research, engineering sucesses and newly commercialized products hint at the immense innovative potentials and future applications that open up once mankind controls shape and function from the atomic level right up to the visible world without any gaps. Sensor systems, microreactors, nanostructures, nanomachines, functional surfaces, integrated optics, displays, communications technology, biochips, human/machine interfaces, prosthetics, miniaturized medical and surgery equipment and many more opportunities are being explored. This new series, Advanced Micro and Nano Systems, provides cutting-edge reviews from top authors on technologies, devices and advanced systems from the micro and nano worlds.

Download or read book MEMS NEMS Sensors written by Goutam Koley and published by MDPI. This book was released on 2019-11-20 with total page 242 pages. Available in PDF, EPUB and Kindle. Book excerpt: Due to the ever-expanding applications of micro/nano-electromechanical systems (NEMS/MEMS) as sensors and actuators, interest in their development has rapidly expanded over the past decade. Encompassing various excitation and readout schemes, the MEMS/NEMS devices transduce physical parameter changes, such as temperature, mass or stress, caused by changes in desired measurands, to electrical signals that can be further processed. Some common examples of NEMS/MEMS sensors include pressure sensors, accelerometers, magnetic field sensors, microphones, radiation sensors, and particulate matter sensors.

Download or read book Tunable Absolute Capacitive MEMS Pressure Sensor on a Pure Play Commercial Process written by Charles Allan and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: "A new method for manufacturing absolute MEMS (microelectromechanical systems) capacitive pressure sensors was developed using MIDISTM, a commercially available Pure Play process offered by Teledyne DALSA. The method takes advantage of the clean vacuum and low leak rate of 45 molecules/s (7.5E−13 atm∙cc/s) [2, 3] as a highly stable reference. The method allows absolute capacitive pressure sensors to be manufactured alongside 3-axis accelerometers and 3-axis gyroscopes opening the possibility of 10-axis IMUs on a single dye [4]. A method for characterizing the mechanical properties of the sensing membrane using FT-MTA02 Micromechanical Testing and Assembly Station by FemtoTools showed an accurate correlation of membrane deflection constant with simulated results. Finally, a testing set up was designed and built to measure the electrical performance of the pressure sensors under the biomedical, environmental and energy extraction applications. This pressure testing set up will be used to compare sensor data from sensors with diameters ranging from 210-360um with membrane thicknesses of 3 and 5um. The data will be valuable in showcasing the range and versatility of this method for manufacturing absolute pressure sensors. From the simulations we expect our sensors to have a resolution of 0.01kPa with an accuracy of +/-0.7% in the smallest package (2mmx2mmx0.8mm) while consuming only 24uA in high resolution and 3.3uA in low resolution. A high performance, low power, customizable pressure sensor that can be fabricated alongside accelerometers, gyroscopes allowing for 10-axis IMUs on a single dye." --

Download or read book MODELLING SIMULATION PERFORMANCE EVALUATION AND OPTIMIZATION OF MEMS IN THE CONTEXT OF PHYSIOLOGICAL PRESSURE MEASUREMENT written by Dr. Mohd. Zafar Shaikh and published by Lulu.com. This book was released on with total page 110 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Lateral line inspired MEMS array Pressure Sensing for Passive Underwater Navigation written by Vicente I. Fernandez and published by . This book was released on 2007 with total page 16 pages. Available in PDF, EPUB and Kindle. Book excerpt: This paper presents work toward the development of a novel MEMS sensing technology for AUVs. The proposed lateral line-inspired sensor system is a high-density array of pressure sensors for measuring hydrodynamic disturbances. By measuring pressure variations on a vehicle surface, a dense pressure sensor array will allow the AUV to detect, classify, and locate nearby obstacles and optimize its motion in unsteady environments. This approach is very similar to the canal lateral line system found in all fish, which allow them to function in dark or clouded environments. In order to lay the groundwork for developing the MEMS sensor and interpreting the pressure distributions, the paper also presents experiments demonstrating the discrimination between cylindrical obstacles of round and square cross sections with an array of off-the-shelf pressure sensors. Test objects with 5.1 cm and 7.6 cm diameters passed stationary sensors at 0.5 m/s and 0.75 m/s and with 1.3 and 5.1 mm separation. Hand chosen features and features chosen through a Principal Component Analysis are used to discriminate between object shapes under a variety of conditions. A classification error rate of under 2% is achieved across all velocities, sizes, and separations. These results lead to requirements for the density, sensitivity, and frequency response of the MEMS sensors, which fall well in the MEMS domain. The pressure sensor array proposed here consists of hundreds of MEMS pressure sensors with diameters near 1 mm spaced a few millimeters apart fabricated on etched silicon and Pyrex wafers; a fabrication process for producing the array is described. A strain-gauge pressure sensor is analyzed and shown to satisfy specifications as required by the results from the afore-mentioned experiments. The sensing element is a strain gauge mounted on a flexible diaphragm, which is a thin (20 [mu]m) layer of silicon attached at the edges to a square silicon cavity 2000 [mu]m wide on a side. A source voltage of 10 V produces a sensor with a sensitivity on the order of 1[mu]V/Pa. Since the thermal noise voltage is near 0.7 [mu]V, the pressure resolution of the sensors is on the order of 1 Pa.

Download or read book MEMS Mechanical Sensors written by Stephen Beeby and published by Artech House. This book was released on 2004 with total page 282 pages. Available in PDF, EPUB and Kindle. Book excerpt: Annotation Engineers and researchers can turn to this reference time and time again when they need to overcome challenges in design, simulation, fabrication, and application of MEMS (microelectromechanical systems) sensors.

Download or read book 3D and Circuit Integration of MEMS written by Masayoshi Esashi and published by John Wiley & Sons. This book was released on 2021-03-16 with total page 528 pages. Available in PDF, EPUB and Kindle. Book excerpt: Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.

Download or read book 2020 XI National Conference with International Participation ELECTRONICA written by IEEE Staff and published by . This book was released on 2020-07-23 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: ELECTRONICA 2020 will continue the discussion initiated by Electronica 1991 on the state and prospects for the development of the Bulgarian electronics research, education and industry in a globalised world economy and EU membership Papers discussing theoretical and applied electronics submitted by Bulgarian and foreign specialists will be presented Participation of leading Bulgarian and foreign companies is planed An exhibition and round table will be organized The official language is English

Download or read book Design and Fabrication of a Microelectromechanical Systems array Pressure Sensor System for Passive Underwater Navigation Inspired by the Lateral Line written by Stephen Ming-Chang Hou and published by . This book was released on 2012 with total page 241 pages. Available in PDF, EPUB and Kindle. Book excerpt: An object within a fluid flow generates local pressure variations that are unique and characteristic to the object's shape and size. For example, a three-dimensional object or a wall-like obstacle obstructs flow and creates sharp pressure gradients nearby. Similarly, unsteady flow contains vortical patterns with associated unique pressure signatures. Detection of obstacles, as well as identification of unsteady flow features, is required for autonomous undersea vehicle (AUV) navigation. An array of passive underwater pressure sensors, with their ability to An object within a fluid flow generates local pressure variations that are unique and characteristic to the object's shape and size. For example, a three-dimensional object or a wall-like obstacle obstructs flow and creates sharp pressure gradients nearby. Similarly, unsteady flow contains vortical patterns with associated unique pressure signatures. Detection of obstacles, as well as identification of unsteady flow features, is required for autonomous undersea vehicle (AUV) navigation. An array of passive underwater pressure sensors, with their ability to "touch at a distance" with minimal power consumption, would be able to resolve the pressure signatures of obstacles in the near field and the wake of objects in the intermediate field. As an additional benefit, with proper design, pressure sensors can also be used to sample acoustic signals as well. Fish already have a biological version of such a pressure sensor system, namely the lateral line organ, a spatially-distributed set of sensors over a fish's body that allows the fish to monitor its hydrodynamic environment, influenced by the external disturbances. Through its ability to resolve the pressure signature of objects, the fish obtains "hydrodynamic pictures". Inspired by the fish lateral line, this thesis describes the development of a high-density array of microelectromechanical systems (MEMS) pressure sensors built in KOH-etched silicon and HF-etched Pyrex wafers. A novel strain-gauge resistor design is discussed, and standard CMOS/MEMS fabrication techniques were used to build sensors based on the strain-gauge resistors and thin silicon diphragms. Measurements of the diaphragm deflection and strain-gauge resistance changes in response to changes in applied external pressure confirm that the devices can be reliably calibrated for use as pressure sensors to enable passive navigation by AUVs. A set of sensors with millimeter-scale spacing, 2.1 to 2.5 [mu]V/Pa sensitivity, sub-pascal pressure resolution, and -2000 Pa to 2000 Pa pressure range has been demonstrated. Finally, an integrated circuit for array processing and signal amplification and to be fabricated with the pressure sensors is proposed.

Download or read book Remotely Interrogated MEMS Pressure Sensor written by ʻAmr Ibrāhīm and published by . This book was released on 2012 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: This thesis considers the design and implementation of passive wireless microwave readable pressure sensors on a single chip. Two novel-all passive devices are considered for wireless pressure operation. The first device consists of a tuned circuit operating at 10 GHz fabricated on SiO2 membrane, supported on a silicon wafer. A pressure difference across the membrane causes it to deflect so that a passive resonant circuit detunes. The circuit is remotely interrogated to read off the sensor data. The chip area is 20 mm2 and the membrane area is 2mm2 with thickness of 4 μm. Two on chip passive resonant circuits were investigated: a meandered dipole and a zigzag antenna. Both have a physical length of 4.25 mm. the sensors show a shift in their resonant frequency in response to changing pressure of 10.28-10.27 GHz for the meandered dipole, and 9.61-9.58 GHz for the zigzag antenna. The sensitivities of the meandered dipole and zigzag sensors are 12.5 kHz and 16 kHz mbar, respectively. The second device is a pressure sensor on CMOS chip. The sensing element is capacitor array covering an area of 2 mm2 on a membrane. This sensor is coupled with a dipole antenna operating at 8.77 GHz. The post processing of the CMOS chip is carried out only in three steps, and the sensor on its own shows a sensitivity of 0.47fF/mbar and wireless sensitivity of 27 kHz/mbar. The MIM capacitors on membrane can be used to detune the resonant frequency of an antenna.

Download or read book Analysis and Design Principles of MEMS Devices written by Minhang Bao and published by Elsevier. This book was released on 2005-04-12 with total page 327 pages. Available in PDF, EPUB and Kindle. Book excerpt: Sensors and actuators are now part of our everyday life and appear in many appliances, such as cars, vending machines and washing machines. MEMS (Micro Electro Mechanical Systems) are micro systems consisting of micro mechanical sensors, actuators and micro electronic circuits. A variety of MEMS devices have been developed and many mass produced, but the information on these is widely dispersed in the literature. This book presents the analysis and design principles of MEMS devices. The information is comprehensive, focusing on microdynamics, such as the mechanics of beam and diaphragm structures, air damping and its effect on the motion of mechanical structures. Using practical examples, the author examines problems associated with analysis and design, and solutions are included at the back of the book. The ideal advanced level textbook for graduates, Analysis and Design Principles of MEMS Devices is a suitable source of reference for researchers and engineers in the field.* Presents the analysis and design principles of MEMS devices more systematically than ever before.* Includes the theories essential for the analysis and design of MEMS includes the dynamics of micro mechanical structures* A problem section is included at the end of each chapter with answers provided at the end of the book.