Download or read book Mechanical design for electronics product Other specific function design written by Jerry Wang and published by Jerry Wang. This book was released on 2019-10-26 with total page 9 pages. Available in PDF, EPUB and Kindle. Book excerpt: The design guide for seal, EMC, screw toque definition.

Download or read book Mechanical design for electronics product written by Jerry Wang and published by Jerry Wang. This book was released on 2019-10-22 with total page 137 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is a summary of my over 15 years work as a mechanical design engineer in electronics industry. The contents include: · The task, design considerations, developing steps of mechanical design for electronics product. · The frequent using mechanical components design guideline. · Specific function design, such as seal, EMC, screw torque definition and calculation. · Tolerance analysis. · Preliminary thermal distribution design. · Other topics such as DFM, failure root cause analysis, etc. Components design guideline is the major part of this book. The components are categorized according manufacturing method, such as sheet metal, plastic injection, die casting, Aluminium extrusion, over mold, rubber keypad and standards components selection. In each individual guideline, the typical structure is used to include the main items of: · Characters about advantages and disadvantages. · Brief description of typical manufacturing process and related equipment. · Frequent using material. · Structure design considerations. · Typical features. · Tolerance. · Frequent defects and analysis. The aim of this book is to provide guide and support to the junior mechanical design engineers in electronics industry, and I assume the readers have mechanical knowledge and reasonable design practise. So I excluded the massive basics that can be found from popular manuals or standards to make the book brief and wish could bring the readers practical help.

Download or read book Mechanical deisgn for electronics product Design considerations and steps written by Jerry Wang and published by Jerry Wang. This book was released on 2019-10-26 with total page 15 pages. Available in PDF, EPUB and Kindle. Book excerpt: General design considerations and steps

Download or read book Designing Electronic Product Enclosures written by Tony Serksnis and published by Springer. This book was released on 2018-07-25 with total page 226 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains the design and fabrication of any electronic enclosure that contains a printed circuit board, from original design through materials selection, building and testing, and ongoing design improvement. It presents a thorough and lucid treatment of material physical properties, engineering, and compliance considerations such that readers will understand concerns that exist with a design (structural, environmental, and regulatory) and what is needed to successfully enter the marketplace. To this end, a main thrust of this volume is on the “commercialization” of electronic products when an enclosure is needed. The book targets the broadest audience tasked with design and manufacture of an enclosure for an electronic product, from mechanical/industrial engineers to designers and technicians. Compiling a wealth of information on relevant physical phenomena (strength of materials, shock and vibration, heat transfer), the book stands as a ready reference on how and where these key properties may be considered in the design of most electronic enclosures.

Download or read book Design of Electromechanical and Combination Products written by Ali Jamnia and published by CRC Press. This book was released on 2023-08-31 with total page 461 pages. Available in PDF, EPUB and Kindle. Book excerpt: The second edition of this work, now with the expanded title of Design of Electromechanical and Combination Products, covers the design and development of electromechanical products, updated throughout to focus not only on an Agile Systems approach but also its application to disposables and consumables. Providing a practical set of guidelines and thorough examination of best practices, this book focuses on cutting-edge research on sustainability of electromechanical and combination products. Key Features Presents the design, development, and life cycle management of electromechanical and combination products Provides a practical set of guidelines and best practices for world-class design Explains the role of costing and pricing in product design Covers Design for X and its role in product life-cycle management Examines the dynamics of cross-functional design and product development teams Develops DHF and DMR as tools and inherent components of configuration management Includes numerous real-world examples of electromechanical and combination product designs This book is intended for scientists, engineers, designers, and technical managers, and provides a gateway to developing a product’s design history file (DHF) and device master record (DMR). These tools enable the design team to communicate a product’s design, manufacturability, and service procedures with various cross-functional teams.

Download or read book Mechanical design for electronics product Sheet metal written by Jerry Wang and published by Jerry Wang. This book was released on 2019-10-25 with total page 17 pages. Available in PDF, EPUB and Kindle. Book excerpt: Design guide for sheet metal parts in electronics product

Download or read book Modeling Analysis Design and Tests for Electronics Packaging beyond Moore written by Hengyun Zhang and published by Woodhead Publishing. This book was released on 2019-11-14 with total page 436 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. - Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging - Features experimental characterization and qualifications for the analysis and verification of electronic packaging design - Provides multiphysics modeling and analysis techniques of electronic packaging

Download or read book The CRC Handbook of Mechanical Engineering Second Edition written by and published by CRC Press. This book was released on 1998-03-24 with total page 2642 pages. Available in PDF, EPUB and Kindle. Book excerpt: During the past 20 years, the field of mechanical engineering has undergone enormous changes. These changes have been driven by many factors, including: the development of computer technology worldwide competition in industry improvements in the flow of information satellite communication real time monitoring increased energy efficiency robotics automatic control increased sensitivity to environmental impacts of human activities advances in design and manufacturing methods These developments have put more stress on mechanical engineering education, making it increasingly difficult to cover all the topics that a professional engineer will need in his or her career. As a result of these developments, there has been a growing need for a handbook that can serve the professional community by providing relevant background and current information in the field of mechanical engineering. The CRC Handbook of Mechanical Engineering serves the needs of the professional engineer as a resource of information into the next century.

Download or read book Handbook of Electronic Package Design written by Michael Pecht and published by CRC Press. This book was released on 2018-10-24 with total page 904 pages. Available in PDF, EPUB and Kindle. Book excerpt: Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development

Download or read book NASA Tech Briefs written by and published by . This book was released on 1997 with total page 166 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Electronic Engineering and Computing Technology written by Len Gelman and published by Springer Science & Business Media. This book was released on 2010-04-21 with total page 698 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic Engineering and Computing Technology contains sixty-one revised and extended research articles written by prominent researchers participating in the conference. Topics covered include Control Engineering, Network Management, Wireless Networks, Biotechnology, Signal Processing, Computational Intelligence, Computational Statistics, Internet Computing, High Performance Computing, and industrial applications. Electronic Engineering and Computing Technology will offer the state of art of tremendous advances in electronic engineering and computing technology and also serve as an excellent reference work for researchers and graduate students working with/on electronic engineering and computing technology.

Download or read book Glocalized Solutions for Sustainability in Manufacturing written by Jürgen Hesselbach and published by Springer Science & Business Media. This book was released on 2011-03-19 with total page 699 pages. Available in PDF, EPUB and Kindle. Book excerpt: The 18th CIRP International Conference on Life Cycle Engineering (LCE) 2011 continues a long tradition of scientific meetings focusing on the exchange of industrial and academic knowledge and experiences in life cycle assessment, product development, sustainable manufacturing and end-of-life-management. The theme “Glocalized Solutions for Sustainability in Manufacturing” addresses the need for engineers to develop solutions which have the potential to address global challenges by providing products, services and processes taking into account local capabilities and constraints to achieve an economically, socially and environmentally sustainable society in a global perspective. Glocalized Solutions for Sustainability in Manufacturing do not only involve products or services that are changed for a local market by simple substitution or the omitting of functions. Products and services need to be addressed that ensure a high standard of living everywhere. Resources required for manufacturing and use of such products are limited and not evenly distributed in the world. Locally available resources, local capabilities as well as local constraints have to be drivers for product- and process innovations with respect to the entire life cycle. The 18th CIRP International Conference on Life Cycle Engineering (LCE) 2011 serves as a platform for the discussion of the resulting challenges and the collaborative development of new scientific ideas.

Download or read book Multi Disciplinary Engineering for Cyber Physical Production Systems written by Stefan Biffl and published by Springer. This book was released on 2017-05-06 with total page 474 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses challenges and solutions for the required information processing and management within the context of multi-disciplinary engineering of production systems. The authors consider methods, architectures, and technologies applicable in use cases according to the viewpoints of product engineering and production system engineering, and regarding the triangle of (1) product to be produced by a (2) production process executed on (3) a production system resource. With this book industrial production systems engineering researchers will get a better understanding of the challenges and requirements of multi-disciplinary engineering that will guide them in future research and development activities. Engineers and managers from engineering domains will be able to get a better understanding of the benefits and limitations of applicable methods, architectures, and technologies for selected use cases. IT researchers will be enabled to identify research issues related to the development of new methods, architectures, and technologies for multi-disciplinary engineering, pushing forward the current state of the art.

Download or read book Systems Engineering in Research and Industrial Practice written by Josip Stjepandić and published by Springer Nature. This book was released on 2019-10-31 with total page 422 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book details the foundations, new developments and methods, applications, and current challenges of systems engineering (SE). It provides key insights into SE as a concept and as an approach based on the holistic view on the entire lifecycle (requirements, design, production, and exploitation) of complex engineering systems, such as spacecraft, aircraft, power plants, and ships. Written by leading international experts, the book describes the achievements of the holistic, transdisciplinary approach of SE as state of the art both in research and practice using case study examples from originating at universities and companies such as Airbus, BAE Systems, BMW, Boeing, and COMAC. The reader obtains a comprehensive insight into the still existing challenges of the concept of SE today and the various forms in which SE is applied in a variety of areas.

Download or read book High Value Manufacturing Advanced Research in Virtual and Rapid Prototyping written by Maria K. Todd and published by CRC Press. This book was released on 2013-09-16 with total page 650 pages. Available in PDF, EPUB and Kindle. Book excerpt: High Value Manufacturing is the result of the 6th International Conference on Advanced Research in Virtual and Rapid Prototyping, held in Leiria, Portugal, October 2013. It contains current contributions to the field of virtual and rapid prototyping (V&RP) and is also focused on promoting better links between industry and academia. This volume

Download or read book Practical Reliability Of Electronic Equipment And Products written by Eugene R. Hnatek and published by CRC Press. This book was released on 2002-10-25 with total page 472 pages. Available in PDF, EPUB and Kindle. Book excerpt: Examining numerous examples of highly sensitive products, this book reviews basic reliability mathematics, describes robust design practices, and discusses the process of selecting suppliers and components. He focuses on the specific issues of thermal management, electrostatic discharge, electromagnetic compatibility, printed wiring assembly, environmental stress testing, and failure analysis. The book presents methods for meeting the reliability goals established for the manufacture of electronic product hardware and addresses the development of reliable software. The appendix provides example guidelines for the derating of electrical and electromechanical components.

Download or read book Plunkett s Engineering Research Industry Almanac 2008 written by Jack W. Plunkett and published by Plunkett Research, Ltd.. This book was released on 2008-05 with total page 719 pages. Available in PDF, EPUB and Kindle. Book excerpt: A guide to the trends and leading companies in the engineering, research, design, innovation and development business fields: those firms that are dominant in engineering-based design and development, as well leaders in technology-based research and development.