Download or read book Mechanical Characterization of Thin Films Using Nanoindentation Techniques written by Angela Strojny and published by . This book was released on 1999 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Surface Properties And Engineering Of Complex Intermetallics written by Esther Belin-ferre and published by World Scientific. This book was released on 2010-02-25 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is the third in a series of 4 books issued yearly as a deliverable of the research school established within the European Network of Excellence CMA (for Complex Metallic Alloys). It is written by reputed experts in the fields of surface physics and chemistry, metallurgy and process engineering, combining expertise found inside as well as outside the network.The CMA network focuses on the huge group of largely unknown multinary alloys and compounds formed with crystal structures based on giant unit cells containing clusters, with many tens or up to more than thousand atoms per unit cell. In these phases, for many phenomena, the physical length scales are substantially smaller than the unit-cell dimension. Hence, these materials offer unique combinations of properties, which are mutually excluded in conventional materials: metallic electric conductivity combined with low thermal conductivity, combination of good light absorption with high-temperature stability, combination of high metallic hardness with reduced wetting by liquids, electrical and thermal resistance tuneable by composition variation, excellent resistance to corrosion, reduced cold-welding and adhesion, enhanced hydrogen storage capacity and light absorption, etc.The series of books will concentrate on: development of fundamental knowledge with the aim of understanding materials phenomena, technologies associated with the production, transformation and processing of knowledge-based multifunctional materials, surface engineering, support for new materials development and new knowledge-based higher performance materials for macro-scale applications.

Download or read book Mechanical Characterization of Thin Films written by Bin Huang and published by . This book was released on 2005 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book The Materials Science of Thin Films written by Milton Ohring and published by Academic Press. This book was released on 1992 with total page 744 pages. Available in PDF, EPUB and Kindle. Book excerpt: Prepared as a textbook complete with problems after each chapter, specifically intended for classroom use in universities.

Download or read book Mechanical Characterization of Thin Films with Application to Ferroelectrics written by Rongjing Zhang and published by . This book was released on 2006 with total page 208 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Mechanical Characterization of Thin Films written by and published by . This book was released on with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: HKUST Call Number: Thesis MECH 2005 Huang.

Download or read book Thin Films Volume 875 written by Thomas E. Buchheit and published by Cambridge University Press. This book was released on 2005 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book has a long tradition of representing current topics in thin-film properties and how they are related to the performance and reliability of thin-film structures. Several emerging and well-developed technologies rely on understanding the behavior of these structures. This book provides a forum for an exchange of ideas among researchers who are interested in the mechanical behavior of thin films, broadly applied to their materials choice or methodology. The book focuses on stress-related phenomena in thin films for a wide range of materials. Of particular interest are studies that explore the frontiers of thin-film materials science with regard to materials selection or size scale. Topics include: elasticity in thin films; characterizing thin films by nanoindentation; mechanical behavior of nanostructured films; mechanical properties of thin; thin-film plasticity; thin-film plasticity; thin-film plasticity; novel testing techniques; in situ characterization techniques; adhesion and fracture of thin films; fatigue and stress in interconnect and metallization; deformation, growth and microstructure in thin films and thin-film processing.

Download or read book Stress Analysis and Mechanical Characterization of Thin Films for Microelectronics and MEMS Applications written by Patrick Waters and published by . This book was released on 2008 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: ABSTRACT: Thin films are used for a variety of applications, which can include electronic devices, optical coatings and decorative parts. They are used for their physical, electrical, magnetic, optical and mechanical properties, and many times these properties are required simultaneously. Obtaining these desired properties starts with the deposition process and they are verified by a number of analysis techniques after deposition. A DC magnetron sputter system was used here to deposit tungsten films, with film thickness and residual stress uniformity being of primary interest. The film thickness was measured to vary by up to 45 % from the center to outer edge of a 4" wafer. Ar pressure was found to influence the thin film residual stress with lower Ar pressures leading to compressive residual stress ( -1.5 GPa) and higher Ar pressures leading to tensile residual stress (1 GPa). Residual stress measurements of the tungsten films were made using a wafer curvature technique and X-ray diffraction. The results of the two techniques were compared and found to be within 20 %. Nanoindentation was used to analyze the mechanical properties of several types of thin films that are commonly used in microelectronic devices. Thin film reduced modulus, hardness, interfacial toughness and fracture toughness were some of the mechanical properties measured. Difficulties with performing shallow indents (less than 100 nm) were addressed, with proper calibration procedures for the indentation equipment and tip area function detailed. Pile-up during the indentation of soft films will lead to errors in the indentation contact depth and area, leading to an overestimation of the films' reduced modulus and hardness. A method was developed to account for pile-up in determining the indentation contact depth and calculating a new contact area for improving the analysis of reduced modulus and hardness. Residual stresses in thin films are normally undesired because in extreme cases they may result in thru-film cracking or interfacial film delamination. With the use of lithography techniques to pattern wafers with areas of an adhesion reducing layer, thin film delamination was controlled. The patterned delamination microchannels may be used as an alternative method of creating microchannels for fluid transport in MEMS devices. Delamination morphology was influenced by the amount of residual stress in the film and the critical buckling stress, which was primarily controlled by the width of the adhesion reducing layers.

Download or read book Characterization of Mechanical Properties of Thin Films by Scanning Probe Microscopy written by Chung-Jen Lu and published by . This book was released on 1994 with total page 384 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Mechanical Characterization of Thin Films and Pellicles Used in Optical Lithography written by Lowell K. Siewert and published by . This book was released on 2000 with total page 230 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Mechanical Characterization of Nanoporous Thin Films by Nanoindentation and Laser induced Surface Acoustic Waves written by Gabriel Chow and published by . This book was released on 2014 with total page 207 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thin films represent a critical sector of modern engineering that strives to produce functional coatings at the smallest possible length scales. They appear most commonly in semiconductors where they form the foundation of all electronic circuits, but exist in many other areas to provide mechanical, electrical, chemical, and optical properties. The mechanical characterization of thin films has been a continued challenge due foremost to the length scales involved. However, emerging thin films focusing on materials with significant porosity, complex morphologies, and nanostructured surfaces produce additional difficulties towards mechanical analysis. Nanoindentation has been the dominant thin film mechanical characterization technique for the last decade because of the quick results, wide range of sample applicability, and ease of sample preparation. However, the traditional nanoindentation technique encounters difficulties for thin porous films. For such materials, alternative means of analysis are desirable and the lesser known laser-induced surface acoustic wave technique (LiSAW) shows great potential in this area. This dissertation focuses on studying thin, porous, and nanostructured films by nanoindentation and LiSAW techniques in an effort to directly correlate the two methodologies and to test the limits and applicabilities of each technique on challenging media. The LiSAW technique is particularly useful for thin porous films because unlike indentation, the substrate is properly accounted for in the wave motion analysis and no plastic deformation is necessary. Additionally, the use of lasers for surface acoustic wave generation and detection allows the technique to be fully non-contact. This is desirable in the measurement of thin, delicate, and porous films where physical sample probing may not be feasible. The LiSAW technique is also valuable in overcoming nanoscale roughness, particularly for films that cannot be mechanically polished, since typical SAW wavelengths are micrometers in scale whereas indentation depths are usually confined to the nanometer scale. This dissertation demonstrates the effectiveness of LiSAW on both thin porous layers and rough surfaces and shows the challenges faced by nanoindentation on the same films. Zeolite thin films are studied extensively in this work as a model system because of their porous crystalline framework and enormous economic market. Many types of zeolite exist and their widely varying structures and levels of porosity present a unique opportunity for mechanical characterization. For a fully dense ZSM-5 type zeolite with wear and corrosion resistance properties, nanoindentation was used to compare its mechanical properties to industrial chromium and cadmium films. Through tribological and indentation tests, it was shown that the zeolite film possesses exceptional resilience and hardness therefore demonstrating superior wear resistance to chromium and cadmium. This also highlighted the quality of nanoindentation measurements on thick dense layers where traditional nanoindentation excels. Nanoindentation was then performed on porous and non-porous MFI zeolite films with low-k (low dielectric constant) properties. These films were softer and much thinner than the ZSM-5 coatings resulting in significant substrate effects, evidenced by inflation of the measurements from the hard silicon substrate, during indentation. Such effects were avoided with the LiSAW technique on the same films where properties were readily extracted without complications. An alternative indentation analysis method was demonstrated to produce accurate mechanical measurements in line with the LiSAW results, but the non-traditional technique requires substantial computational intensity. Thus LiSAW was proven to be an accurate and efficient means of mechanical characterization for thin porous layers. The case for LiSAW was further supported by utilizing the technique on a porous nanostructured V2O5 electrode film. The surface roughness, on the same scale as indentation depths, created difficulty in obtaining consistent nanoindentation results. Since the film was too delicate for mechanical polishing, the nanoindentation results possessed a high level of uncertainty. It was demonstrated that the LiSAW technique could extract the mechanical properties from such layers without substrate effects and with higher accuracy than nanoindentation. The research in this dissertation directly demonstrates the areas where nanoindentation excels and the areas where it encounters difficulty. It is shown how the LiSAW technique can be an efficient alternative in the challenging areas through its dependence on bulk dispersive wave motion rather than localized deformation. Thus, LiSAW opens up many avenues towards the mechanical characterization of thin, porous, soft, or rough films. Nanoindentation remains an extremely useful technique for thin film characterization, especially with the alternative analysis adaptation. However, as films continue trending towards smaller length scales, more complex porous morphologies, and engineered nanoscale surfaces, LiSAW may well become an equally valuable and indispensable technique.

Download or read book Thin Films Volume 875 written by Thomas E. Buchheit and published by Cambridge University Press. This book was released on 2014-06-05 with total page 472 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book has a long tradition of representing current topics in thin-film properties and how they are related to the performance and reliability of thin-film structures. Several emerging and well-developed technologies rely on understanding the behavior of these structures. This book provides a forum for an exchange of ideas among researchers who are interested in the mechanical behavior of thin films, broadly applied to their materials choice or methodology. The book focuses on stress-related phenomena in thin films for a wide range of materials. Of particular interest are studies that explore the frontiers of thin-film materials science with regard to materials selection or size scale. Topics include: elasticity in thin films; characterizing thin films by nanoindentation; mechanical behavior of nanostructured films; mechanical properties of thin; thin-film plasticity; thin-film plasticity; thin-film plasticity; novel testing techniques; in situ characterization techniques; adhesion and fracture of thin films; fatigue and stress in interconnect and metallization; deformation, growth and microstructure in thin films and thin-film processing.

Download or read book Characterization of Mechanical Properties of Microelectronic Thin Films written by Fariborz Maseeh and published by . This book was released on 1990 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Characterization of Mechanical Properties of Microelectronic Thin Films written by Fariborz Maseeh-Tehrani and published by . This book was released on 1990 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Nanoscale Chemical and Mechanical Characterization of Thin Films written by S. J. Kweskin and published by . This book was released on 2006 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Sum frequency generation (SFG) surface vibrational spectroscopy was used to characterize interfaces pertinent to current surface engineering applications, such as thin film polymers and novel catalysts. An array of advanced surface science techniques like scanning probe microscopy (SPM), x-ray photoelectron spectroscopy (XPS), gas chromatography (GC) and electron microscopy were used to obtain experimental measurements complementary to SFG data elucidating polymer and catalyst surface composition, surface structure, and surface mechanical behavior. Experiments reported in this dissertation concentrate on three fundamental questions: (1) How does the interfacial molecular structure differ from that of the bulk in real world applications? (2) How do differences in chemical environment affect interface composition or conformation? (3) How do these changes correlate to properties such as mechanical or catalytic performance? The density, surface energy and bonding at a solid interface dramatically alter the polymer configuration, physics and mechanical properties such as surface glass transition, adhesion and hardness. The enhanced sensitivity of SFG at the buried interface is applied to three systems: a series of acrylates under compression, the compositions and segregation behavior of binary polymer polyolefin blends, and the changes in surface structure of a hydrogel as a function of hydration. In addition, a catalytically active thin film of polymer coated nanoparticles is investigated to evaluate the efficacy of SFG to provide in situ information for catalytic reactions involving small mass adsorption and/or product development. Through the use of SFG, in situ total internal reflection (TIR) was used to increase the sensitivity of SFG and provide the necessary specificity to investigate interfaces of thin polymer films and nanostructures previously considered unfeasible. The dynamic nature of thin film surfaces is examined and it is found that the non-equilibrium states contribute to practical applications of acrylates, blends and hydrogels. Lastly, nanoparticle surfaces and the catalytic activity and selectivity of platinum cube nanoparticles are correlated to the surface intermediates in a high pressure flow reactor.

Download or read book Mechanical Characterization of Thin Film Materials with Nanoindentation Measurement and Finite Element Analysis written by Xiaoqin Huang and published by . This book was released on 2005 with total page 282 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Mechanical Characterization of Thin Film Structures Using a Laser Spallation Technique written by Jianxin Wu and published by . This book was released on 1999 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt: