Download or read book Micro and Opto Electronic Materials and Structures Physics Mechanics Design Reliability Packaging written by Ephraim Suhir and published by Springer Science & Business Media. This book was released on 2007-05-26 with total page 1471 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Download or read book Mechanical Behavior of Materials and Structures in Microelectronics Volume 226 written by Ephraim Suhir and published by . This book was released on 1991 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Download or read book Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices written by Ephraim Suhir and published by CRC Press. This book was released on 2021-01-28 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt: Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devices Shows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical data Covers how to design the most effective test vehicles for testing solder joints Details how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnections Outlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such cases Illustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated tests This book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design.
Download or read book Materials for Electronic Packaging written by Deborah D.L. Chung and published by Elsevier. This book was released on 1995-03-31 with total page 383 pages. Available in PDF, EPUB and Kindle. Book excerpt: Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems. - Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors - Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science - Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems
Download or read book Materials Reliability in Microelectronics written by and published by . This book was released on 1992 with total page 352 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Materials Reliability in Microelectronics IV written by Materials Research Society. Spring Meeting and published by . This book was released on 1994 with total page 666 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Materials Reliability Issues in Microelectronics written by and published by . This book was released on 1991 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of the "MRS Symposium on Materials Reliability Issues in Microelectronics"--Dedication, p. xiii.
Download or read book Complex Fluids Volume 248 written by E. Sirota and published by . This book was released on 1992-08-10 with total page 564 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Download or read book Phase Formation and Modification by Beam Solid Interactions Volume 235 written by Gary S. Was and published by . This book was released on 1992-04-10 with total page 952 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Download or read book Thin Films Volume 239 written by W. D. Nix and published by . This book was released on 1992-06-16 with total page 750 pages. Available in PDF, EPUB and Kindle. Book excerpt: Papers presented at the 1991 Fall Meeting of the Materials Research Society
Download or read book Debye Screening Length written by Kamakhya Prasad Ghatak and published by Springer. This book was released on 2013-11-05 with total page 403 pages. Available in PDF, EPUB and Kindle. Book excerpt: This monograph solely investigates the Debye Screening Length (DSL) in semiconductors and their nano-structures. The materials considered are quantized structures of non-linear optical, III-V, II-VI, Ge, Te, Platinum Antimonide, stressed materials, Bismuth, GaP, Gallium Antimonide, II-V and Bismuth Telluride respectively. The DSL in opto-electronic materials and their quantum confined counterparts is studied in the presence of strong light waves and intense electric fields on the basis of newly formulated electron dispersion laws that control the studies of such quantum effect devices. The suggestions for the experimental determination of 2D and 3D DSL and the importance of measurement of band gap in optoelectronic materials under intense built-in electric field in nano devices and strong external photo excitation (for measuring photon induced physical properties) have also been discussed in this context. The influence of crossed electric and quantizing magnetic fields on the DSL and the DSL in heavily doped semiconductors and their nanostructures has been investigated. This monograph contains 150 open research problems which form the integral part of the text and are useful for both PhD students and researchers in the fields of solid-state sciences, materials science, nano-science and technology and allied fields in addition to the graduate courses in modern semiconductor nanostructures.
Download or read book Structures and Properties of Interfaces in Materials Volume 238 written by William A. T. Clark and published by Mrs Proceedings. This book was released on 1992-04-03 with total page 920 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Download or read book Specimen Preparation for Transmission Electron Microscopy of Materials written by and published by . This book was released on 1992 with total page 308 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book AIAA Journal written by American Institute of Aeronautics and Astronautics and published by . This book was released on 1997 with total page 850 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Specimen Preparation for Transmission Electron Microscopy of Materials III Volume 254 written by Ron Anderson and published by . This book was released on 1992-04-03 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Download or read book Conference Proceedings written by Society of Plastics Engineers. Technical Conference and published by . This book was released on 1983 with total page 1120 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Mechanics and Materials for Electronic Packaging Thermal and mechanical behavior and modeling written by and published by . This book was released on 1994 with total page 244 pages. Available in PDF, EPUB and Kindle. Book excerpt:
