Download or read book MCM Technology Development at MCC written by David Misunas and published by . This book was released on 1992 with total page 10 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Variations in MCM Implementations Using Semi custom MCM Technology written by David Carey and published by . This book was released on 1991 with total page 14 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Multichip Module Technologies and Alternatives The Basics written by Daryl Ann Doane and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 895 pages. Available in PDF, EPUB and Kindle. Book excerpt: Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.
Download or read book Electronic Packaging and Production written by and published by . This book was released on 1995 with total page 686 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Miniaturization Technologies written by and published by Office of Technology Assessment. This book was released on 1991 with total page 64 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings written by and published by . This book was released on 1997 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Chip On Board written by John H. Lau and published by Springer Science & Business Media. This book was released on 1994-06-30 with total page 584 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
Download or read book Multichip Modules written by and published by . This book was released on 1994 with total page 676 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Management of Design written by Sriram Dasu and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt: Product design significantly influences product cost and quality, as well as market share and profitability of a firm. Design projects often involve many people belonging to different functional areas and in many organizations several design projects may be under way at the same time. Due to this complexity, management of design has given rise to a rich set of research problems in management and engineering. In this volume, design is considered as the planning and specification activity prior to fabrication. Design determines what products will be produced, how they will be produced, and when they will be introduced into the market. The quality of the products and the speed with which they are developed are significantly affected by the design process. The design process by which a product is developed is determined by the managerial and engineering practices, tools and techniques. This book presents engineering and management perspectives on design. Topics covered include: Decomposition of product development projects; Tools and techniques for preliminary evaluation of designs; Interface between design and manufacturing, assembly and distribution; Design information flows, and Determination of the scope, timing and duration of projects, and the allocation of resources.
Download or read book Enabling Technologies for Petaflops Computing written by Thomas Lawrence Sterling and published by MIT Press. This book was released on 1995 with total page 196 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chapters focus on four interrelated areas: applications and algorithms, device technology, architecture and systems, and software technology. Building a computer ten times more powerful than all the networked computing capability in the United States is the subject of this book by leading figures in the high performance computing community. It summarizes the near-term initiatives, including the technical and policy agendas for what could be a twenty-year effort to build a petaFLOP scale computer. (A FLOP -- Floating Point OPeration -- is a standard measure of computer performance and a PetaFLOP computer would perform a million billion of these operations per second.) Chapters focus on four interrelated areas: applications and algorithms, device technology, architecture and systems, and software technology. While a petaFLOPS machine is beyond anything within contemporary experience, early research into petaFLOPS system design and methodologies is essential to U.S. leadership in all facets of computing into the next century. The findings reported here explore new and fertile ground. Among them: construction of an effective petaFLOPS computing system will be feasible in two decades, although effectiveness and applicability will depend on dramatic cost reductions as well as innovative approaches to system software and programming methodologies; a mix of technologies such as semiconductors, optics, and possibly cryogenics will be required; and while no fundamental paradigm shift in system architecture is expected, active latency management will be essential, requiring a high degree of fine-grain parallelism and the mechanisms to exploit it. Scientific and Engineering Computation series.
Download or read book Area Array Interconnection Handbook written by Karl J. Puttlitz and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 1250 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
Download or read book Proceedings of the Technical Conference written by and published by . This book was released on 1992 with total page 730 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Semiconductor International written by and published by . This book was released on 1993 with total page 910 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Defense Conversion written by and published by U.S. Government Printing Office. This book was released on 1993 with total page 252 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Defense conversion redirecting R D written by and published by DIANE Publishing. This book was released on with total page 242 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book The International Journal of Microcircuits and Electronic Packaging written by and published by . This book was released on 1997 with total page 668 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Defense Conversion written by DIANE Publishing Company and published by DIANE Publishing. This book was released on 1994-05 with total page 249 pages. Available in PDF, EPUB and Kindle. Book excerpt: Discusses how to find productive civilian uses for the resources and people formerly devoted to the nation's defense. Focuses on how R&D institutions can be more responsive to civilian technology development. Examines how certain proposed national missions might replace defense in contributing to the country's repository of technology, high-value added jobs, and gross domestic product. Charts and tables.
