Download or read book MCM C Multichip Module Manufacturing Guide written by and published by . This book was released on 2000 with total page 57 pages. Available in PDF, EPUB and Kindle. Book excerpt: Honeywell Federal Manufacturing & Technologies (FM & amp;T) provides complete microcircuit capabilities from design layout through manufacturing and final electrical testing. Manufacturing and testing capabilities include design layout, electrical and mechanical computer simulation and modeling, circuit analysis, component analysis, network fabrication, microelectronic assembly, electrical tester design, electrical testing, materials analysis, and environmental evaluation. This document provides manufacturing guidelines for multichip module-ceramic (MCM-C) microcircuits. Figure 1 illustrates an example MCM-C configuration with the parts and processes that are available. The MCM-C technology is used to manufacture microcircuits for electronic systems that require increased performance, reduced volume, and higher density that cannot be achieved by the standard hybrid microcircuit or printed wiring board technologies. The guidelines focus on the manufacturability issues that must be considered for low-temperature cofired ceramic (LTCC) network fabrication and MCM assembly and the impact that process capabilities have on the overall MCM design layout and product yield. Prerequisites that are necessary to initiate the MCM design layout include electrical, mechanical, and environmental requirements. Customer design data can be accepted in many standard electronic file formats. Other requirements include schedule, quantity, cost, classification, and quality level. Design considerations include electrical, network, packaging, and producibility; and deliverables include finished product, drawings, documentation, and electronic files.
Download or read book Multichip Module Technology Handbook written by Philip E. Garrou and published by McGraw-Hill Professional Publishing. This book was released on 1998 with total page 696 pages. Available in PDF, EPUB and Kindle. Book excerpt: MCMs are electronic components that house multiple integrated circuits (ICs) upon a single chip. Their use in design allow systems that are faster, hotter and more reliable than those built with standalone ICs. More and more, the speed needs of electronic systems require MCMs. This comprehensive handbook aims to provide designers with the knowledge needed to understand and work with MCMs.
Download or read book Design Specifications for Manufacturability of MCM C Multichip Modules written by and published by . This book was released on 1996 with total page 13 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide for ceramic-based multichip modules (MCMS) has been developed by AlliedSignal Federal Manufacturing & Technologies (FM & T) to provide manufacturability information for its customers about how MCM designs can be affected by existing process and equipment capabilities. This guide extends beyond a listing of design rules by providing information about design layout, low- temperature cofired ceramic (LTCC) substrate fabrication, MCM assembly and electrical testing Electrical mechanical packaging, environmental, and producibility issues are reviewed. Examples of three MCM designs are shown in the form of packaging cross-sectional views, LTCC substrate layer allocations, and overall MCM photographs. The guide has proven to be an effective tool for enhancing communications between MCM designers and manufacturers and producing a microcircuit that meets design requirements within the limitations of process capabilities.
Download or read book Multichip Modules and Related Technologies written by Gerald L. Ginsberg and published by McGraw-Hill Companies. This book was released on 1994 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Toward a Comprehensive Cost Model for Multichip Module MCM Manufacturing written by Daniel W. Pierce and published by . This book was released on 1996 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings written by and published by . This book was released on 1997 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book MCM C Mixed Technologies and Thick Film Sensors written by W.K. Jones and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity. MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond. MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area.
Download or read book Multichip Module Technologies and Alternatives The Basics written by Daryl Ann Doane and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 895 pages. Available in PDF, EPUB and Kindle. Book excerpt: Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.
Download or read book Digital Integrated Circuits written by John E. Ayers and published by CRC Press. This book was released on 2018-09-03 with total page 428 pages. Available in PDF, EPUB and Kindle. Book excerpt: Exponential improvement in functionality and performance of digital integrated circuits has revolutionized the way we live and work. The continued scaling down of MOS transistors has broadened the scope of use for circuit technology to the point that texts on the topic are generally lacking after a few years. The second edition of Digital Integrated Circuits: Analysis and Design focuses on timeless principles with a modern interdisciplinary view that will serve integrated circuits engineers from all disciplines for years to come. Providing a revised instructional reference for engineers involved with Very Large Scale Integrated Circuit design and fabrication, this book delves into the dramatic advances in the field, including new applications and changes in the physics of operation made possible by relentless miniaturization. This book was conceived in the versatile spirit of the field to bridge a void that had existed between books on transistor electronics and those covering VLSI design and fabrication as a separate topic. Like the first edition, this volume is a crucial link for integrated circuit engineers and those studying the field, supplying the cross-disciplinary connections they require for guidance in more advanced work. For pedagogical reasons, the author uses SPICE level 1 computer simulation models but introduces BSIM models that are indispensable for VLSI design. This enables users to develop a strong and intuitive sense of device and circuit design by drawing direct connections between the hand analysis and the SPICE models. With four new chapters, more than 200 new illustrations, numerous worked examples, case studies, and support provided on a dynamic website, this text significantly expands concepts presented in the first edition.
Download or read book Use Of Models Soc Science written by Lyndhurst Collins and published by Routledge. This book was released on 2019-07-23 with total page 428 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book deals with the philosophy of model use; focuses on the role of models in the natural sciences; and introduces a new paradigm to the social sciences, catastrophe model. It outlines the role of models concerned with conflict problems, particularly problems of military strategy.
Download or read book High Performance Design Automation for Multi chip Modules and Packages written by Jun-Dong Cho and published by World Scientific. This book was released on 1996 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt: Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.
Download or read book Ceramic Interconnect Technology Handbook written by Fred D. Barlow, III and published by CRC Press. This book was released on 2018-10-03 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
Download or read book Multichip Modules written by and published by . This book was released on 1994 with total page 676 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Manufacturing Technology Directorate written by DIANE Publishing Company and published by DIANE Publishing. This book was released on 1998-05 with total page 108 pages. Available in PDF, EPUB and Kindle. Book excerpt: This supplement contains new projects since the publication of the Project Book in Sep. 1995. Potential new starts are summarized on a single page. The summary contains an explanation of the need for the project, the approach taken to accomplish the effort, the benefits expected to be realized, the current status, the name of the project engineer, & performing contractor. Covers: advanced industrial practices, electronics, manufacturing & engineering systems, metals, nonmetals, sustainment, technology development, & Title III. Illsutrated.
Download or read book Active Electronic Component Handbook written by Charles A. Harper and published by McGraw-Hill Professional Publishing. This book was released on 1996 with total page 680 pages. Available in PDF, EPUB and Kindle. Book excerpt: Complete with coverage of the latest microwave and electro-optic components, the new edition of this classic reference meets the needs of all engineers who design, manufacture, and use active components in all categories of electronic systems. Includes data on the full range of semiconductors, guidelines for speed-power-density-cost tradeoffs, architectures, and noise reduction techniques, plus sections on microprocessors and microcontrollers. 700 illustrations.
Download or read book From Display and PWB to MCMs written by and published by . This book was released on 1994 with total page 10 pages. Available in PDF, EPUB and Kindle. Book excerpt: Considerable manufacturing development is currently aimed at reducing high density Multichip Module (MCM) cost through the use of large panels (>40 cm x 40 cm) to fabricate many interconnection substrates in parallel. This drive for low cost MCM manufacturing is aided by the growing base of similar panel technology for the Printed Wiring Board (PWB) and Flat Panel display industries. It is toward this experience that the infant large panel MCM efforts are looking. In particular, the MCM Consortium formed by the Electronic Industry Association (EIA) and funded under the federal TRP effort is charged with developing a line of equipment optimized for large panel, fine line manufacture. PWB line definition research into large panels of glass and smooth non-woven laminate at 2-4 mil lines and spaces reveals that present equipment and processes are extendible well beyond commercial PWB product. In contrast, the ultra-cleanliness and spin coating of the silicon integrated circuit technology prove too expensive when scaled from 150mm diameter wafers to 560mm panels. Thus low waste photoresist (and other polymer dielectrics) application methods are needed for large panel manufacture. Similarly, PWB contact photomasking is nearing limits at 2-4 mil feature size, and projection or maskless direct write processes may be needed. Even small hand-held flat panel displays are manufactured from large panels to reduce the cost per display for conductive and dielectric layer deposition and patterning. In addition, as low cost flat displays become larger and improve in resolution, the line pitch and density approach that needed in high density MCMs.
