Download or read book Dielectric Material Integration for Microelectronics written by William D. Brown and published by The Electrochemical Society. This book was released on 1998 with total page 384 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Mechanics of Materials written by Christopher Jenkins and published by Elsevier. This book was released on 2005-04-22 with total page 409 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is the first to bridge the often disparate bodies of knowledge now known as applied mechanics and materials science. Using a very methodological process to introduce mechanics, materials, and design issues in a manner called "total structural design", this book seeks a solution in "total design space" Features include: * A generalized design template for solving structural design problems. * Every chapter first introduces mechanics concepts through deformation, equilibrium, and energy considerations. Then the constitutive nature of the chapter topic is presented, followed by a link between mechanics and materials concepts. Details of analysis and materials selection are subsequently discussed. * A concluding example design problem is provided in most chapters, so that students may get a sense of how mechanics and materials come together in the design of a real structure. * Exercises are provided that are germane to aerospace, civil, and mechanical engineering applications, and include both deterministic and design-type problems. * Accompanying website contains a wealth of information complementary to this text, including a set of virtual labs. Separate site areas are available for the instructor and students. Combines theories of solid mechanics, materials science and structural design in one coherent text/reference Covers physical scales from the atomistic to continuum mechanics Offers a generalized structural design template

Download or read book Materials Process Integration for MEMS written by Francis E. H. Tay and published by Springer Science & Business Media. This book was released on 2002-08-31 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt: The field of materials and process integration for MEMS research has an extensive past as well as a long and promising future. Researchers, academicians and engineers from around the world are increasingly devoting their efforts on the materials and process integration issues and opportunities in MEMS devices. These efforts are crucial to sustain the long-term growth of the MEMS field. The commercial MEMS community is heavily driven by the push for profitable and sustainable products. In the course of establishing high volume and low-cost production processes, the critical importance of materials properties, behaviors, reliability, reproducibility, and predictability, as well as process integration of compatible materials systems become apparent. Although standard IC fabrication steps, particularly lithographic techniques, are leveraged heavily in the creation of MEMS devices, additional customized and novel micromachining techniques are needed to develop sophisticated MEMS structures. One of the most common techniques is bulk micromachining, by which micromechanical structures are created by etching into the bulk of the substrates with either anisotropic etching with strong alk:ali solution or deep reactive-ion etching (DRIB). The second common technique is surface micromachining, by which planar microstructures are created by sequential deposition and etching of thin films on the surface of the substrate, followed by a fmal removal of sacrificial layers to release suspended structures. Other techniques include deep lithography and plating to create metal structures with high aspect ratios (LIGA), micro electrodischarge machining (J.

Download or read book Manufacturing written by Beno Benhabib and published by CRC Press. This book was released on 2003-07-03 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: From concept development to final production, this comprehensive text thoroughly examines the design, prototyping, and fabrication of engineering products and emphasizes modern developments in system modeling, analysis, and automatic control. This reference details various management strategies, design methodologies, traditional production techniqu

Download or read book Perovskite Materials Devices and Integration written by He Tian and published by BoD – Books on Demand. This book was released on 2020-06-10 with total page 192 pages. Available in PDF, EPUB and Kindle. Book excerpt: Perovskites have attracted great attention in the fields of energy storage, pollutant degradation as well as optoelectronic devices due to their excellent properties. This kind of material can be divided into two categories; inorganic perovskite represented by perovskite oxide and organic-inorganic hybrid perovskite, which have described the recent advancement separately in terms of catalysis and photoelectron applications. This book systematically illustrates the crystal structures, physic-chemical properties, fabrication process, and perovskite-related devices. In a word, perovskite has broad application prospects. However, the current challenges cannot be ignored, such as toxicity and stability.

Download or read book Integration of 2D Materials for Electronics Applications written by Filippo Giannazzo and published by MDPI. This book was released on 2019-02-13 with total page 265 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a printed edition of the Special Issue "Integration of 2D Materials for Electronics Applications" that was published in Crystals

Download or read book Application of Linear Elastic Fracture Mechanics in Materials Science and Engineering written by Yunan Prawoto and published by Lulu.com. This book was released on 2013 with total page 217 pages. Available in PDF, EPUB and Kindle. Book excerpt: "This book is a fracture mechanics book written for non mechanics readers" -- Preface, p. 7.

Download or read book Photonic Integration and Photonics Electronics Convergence on Silicon Platform written by Koji Yamada and published by Frontiers Media SA. This book was released on 2015-11-10 with total page 111 pages. Available in PDF, EPUB and Kindle. Book excerpt: Silicon photonics technology, which has the DNA of silicon electronics technology, promises to provide a compact photonic integration platform with high integration density, mass-producibility, and excellent cost performance. This technology has been used to develop and to integrate various photonic functions on silicon substrate. Moreover, photonics-electronics convergence based on silicon substrate is now being pursued. Thanks to these features, silicon photonics will have the potential to be a superior technology used in the construction of energy-efficient cost-effective apparatuses for various applications, such as communications, information processing, and sensing. Considering the material characteristics of silicon and difficulties in microfabrication technology, however, silicon by itself is not necessarily an ideal material. For example, silicon is not suitable for light emitting devices because it is an indirect transition material. The resolution and dynamic range of silicon-based interference devices, such as wavelength filters, are significantly limited by fabrication errors in microfabrication processes. For further performance improvement, therefore, various assisting materials, such as indium-phosphide, silicon-nitride, germanium-tin, are now being imported into silicon photonics by using various heterogeneous integration technologies, such as low-temperature film deposition and wafer/die bonding. These assisting materials and heterogeneous integration technologies would also expand the application field of silicon photonics technology. Fortunately, silicon photonics technology has superior flexibility and robustness for heterogeneous integration. Moreover, along with photonic functions, silicon photonics technology has an ability of integration of electronic functions. In other words, we are on the verge of obtaining an ultimate technology that can integrate all photonic and electronic functions on a single Si chip. This e-Book aims at covering recent developments of the silicon photonic platform and novel functionalities with heterogeneous material integrations on this platform.

Download or read book Integration of Fundamental Polymer Science and Technology 3 written by P.J. Lemstra and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 409 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Rolduc Polymer Meetings, of which the contents of this volume represent the third, are already on their way to occupying a unique place in the crowded calendar of symposia on every aspect of polymer science and engineering. They combine manageable meeting size with a theme, 'Integration of Fundamental Polymer Science and Technology', which is often discussed but seldom realized in practice. The technological, or applied, areas of polymers have perhaps received more emphasis historically than those of other allied disciplines. Indeed, various plastic and rubber materials were successful items of commerce long before the macromolecular concept itself was firmly established. The more fundamental aspects of the field were also largely developed in industrial laboratories. The early work of Mark and Meyer at IG Farben, and that of Carrothers and Flory at Du Pont, are good examples of this. The present situation, in which polymers are being applied to more and more demanding end uses, from high performance materials on the one hand to the biomedical and electronics fields on the other, caIls for an ever greater understanding of the basic scientific principles governing their behavior. It is evident, therefore, that interactions between those engaged in the 'pure' and 'applied' parts of the field must be promoted effectively. The Rolduc Polymer Meetings contribute significantly to such interactions, not only by interweaving technological and scientific presentations, but also by providing a forum for the participants to discuss problems of mutual interest in all their complexity.

Download or read book Intelligent Human Systems Integration written by Waldemar Karwowski and published by Springer. This book was released on 2017-12-30 with total page 791 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book reports on research on innovative human systems integration and human-machine interaction, with an emphasis on artificial intelligence and automation, as well as computational modeling and simulation. It covers a wide range of applications in the area of design, construction and operation of products, systems and services, including lifecycle development and human-technology interaction. The book describes advanced methodologies and tools for evaluating and improving interface usability, new models, as well as case studies and best practices in virtual, augmented and mixed reality systems, with a special focus on dynamic environments. It also discusses different factors concerning the human, hardware, and artificial intelligence software. Based on the proceedings of the 1st International Conference on Intelligent Human Systems Integration (IHSI 2018), held on January 7-9, 2018, in Dubai, United Arab Emirates, the book also examines the forces that are currently shaping the nature of computing and cognitive systems, such as the need for decreasing hardware costs; the importance of infusing intelligence and automation, and the related trend toward hardware miniaturization and power reduction; the necessity for a better assimilation of computation in the environment; and the social concerns regarding access to computers and systems for people with special needs. It offers a timely survey and a practice-oriented reference guide to policy- and decision-makers, human factors engineers, systems developers and users alike.

Download or read book More than Moore Devices and Integration for Semiconductors written by Francesca Iacopi and published by Springer Nature. This book was released on 2023-02-17 with total page 271 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources. The book also includes examples of applications for brain-computer interfaces and event-driven imaging systems. Provides a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems; Covers functionalities to add to 3D microsystems, including flexible electronics, metasurfaces and power sources; Includes current applications, such as brain-computer interfaces, event - driven imaging and edge computing.

Download or read book 3D Integration in VLSI Circuits written by Katsuyuki Sakuma and published by CRC Press. This book was released on 2018-04-17 with total page 211 pages. Available in PDF, EPUB and Kindle. Book excerpt: Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.

Download or read book Monolithic Nanoscale Photonics Electronics Integration in Silicon and Other Group IV Elements written by Henry Radamson and published by Academic Press. This book was released on 2014-09-17 with total page 183 pages. Available in PDF, EPUB and Kindle. Book excerpt: Silicon technology is evolving rapidly, particularly in board-to-board or chip-to chip applications. Increasingly, the electronic parts of silicon technology will carry out the data processing, while the photonic parts take care of the data communication. For the first time, this book describes the merging of photonics and electronics in silicon and other group IV elements. It presents the challenges, the limitations, and the upcoming possibilities of these developments. The book describes the evolution of CMOS integrated electronics, status and development, and the fundamentals of silicon photonics, including the reasons for its rapid expansion, its possibilities and limitations. It discusses the applications of these technologies for such applications as memory, digital logic operations, light sources, including drive electronics, optical modulators, detectors, and post detector circuitry. It will appeal to engineers in the fields of both electronics and photonics who need to learn more about the basics of the other field and the prospects for the integration of the two. Combines the topics of photonics and electronics in silicon and other group IV elements Describes the evolution of CMOS integrated electronics, status and development, and the fundamentals of silicon photonics

Download or read book Intelligent Human Systems Integration IHSI 2024 Integrating People and Intelligent Systems written by Tareq Ahram and published by AHFE Conference. This book was released on 2024-02-22 with total page 869 pages. Available in PDF, EPUB and Kindle. Book excerpt: Intelligent Human Systems Integration 2024 Proceedings of the 7th International Conference on Intelligent Human Systems Integration: Integrating People and Intelligent Systems, Università degli Studi di Palermo, Palermo, Italy, February 22- 24, 2024

Download or read book Integration and Optimization of Unit Operations written by Barry A. Perlmutter and published by Elsevier. This book was released on 2022-06-24 with total page 464 pages. Available in PDF, EPUB and Kindle. Book excerpt: The chemical industry changes and becomes more and more integrated worldwide. This creates a need for information exchange that includes not only the principles of operation but also the transfer of practical knowledge. Integration and Optimization of Unit Operations provides up-to-date and practical information on chemical unit operations from the R&D stage to scale-up and demonstration to commercialization and optimization. A global collection of industry experts systematically discuss all innovation stages, complex processes with different unit operations, including solids processing and recycle flows, and the importance of integrated process validation. The book addresses the needs of engineers who want to increase their skill levels in various disciplines so that they are able to develop, commercialize and optimize processes. After reading this book, you will be able to acquire new skills and knowledge to collaborate across disciplines and develop creative solutions. Shows the impacts of upstream process decisions on downstream operations Provides troubleshooting strategies at each process stage Asks challenging questions to develop creative solutions to process problems

Download or read book Handbook of Process Integration PI written by Jiří Jaromír Klemeš and published by Woodhead Publishing. This book was released on 2022-11-09 with total page 1190 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Process Integration (PI): Minimisation of Energy and Water Use, Waste and Emissions, Second Edition provides an up-to-date guide on the latest PI research and applications. Since the first edition published, methodologies and sustainability targets have developed considerably. Each chapter has been fully updated, with six new chapters added in this release, covering emissions, transport, water scarcity, reliability and maintenance, environmental impact and circular economy. This version also now includes worked examples and simulations to deepen the reader’s understanding. With its distinguished editor and international team of expert contributors, this book is an important reference work for managers and researchers in all energy and sustainability industries, as well as academics and students in Energy, Chemical, Process, and Environmental Engineering. Provides a fully updated handbook with six new chapters that reflect the latest research and applications on process integration Reviews a wide range of process design and integration topics, ranging from heat and utility systems to water, recycling, waste and hydrogen systems Covers equipment design and operability issues, with a strong extension to environmental engineering and suitability issues

Download or read book 3D Integration for NoC based SoC Architectures written by Abbas Sheibanyrad and published by Springer Science & Business Media. This book was released on 2010-11-08 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.