Download or read book GB T 25119 2010 English Translation of Chinese Standard written by https://www.codeofchina.com and published by https://www.codeofchina.com. This book was released on with total page 48 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Standard specifies the requirements of service, design, manufacture, and testing of electronic equipment, as well as basic hardware and software requirements considered necessary for durable and reliable equipment. Additional requirements in other standards or specifications may complement this Standard, if applicable. List of subclauses of this Standard in which agreement between the parties is mentioned is detailed in Appendix B. This Standard applies to all electronic equipment for control, regulation, protection, supply, etc. installed on rail vehicles (including subway and urban rail vehicle).The equipment may be powered by the batteries or generators of vehicles or powered by a low-voltage power supply with or without a direct connection to the contact system (transformer, voltage divider and auxiliary power supply).For the purposes of this Standard, electronic equipment is defined as equipment mainly composed of semiconductor devices and recognized associated components. These components will mainly be mounted on printed boards. Note: sensors (current, voltage, speed, etc.) and firing unit printed board for power electronic equipment are covered by this Standard. Complete firing units are covered by GB/T 25122.1. This Standard is not applicable to the power electronic equipment in the main circuits and auxiliary circuits.
Download or read book Materials for High Density Electronic Packaging and Interconnection written by National Research Council and published by National Academies Press. This book was released on 1990-02-01 with total page 154 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Progress in Adhesion and Adhesives Volume 8 written by K. L. Mittal and published by John Wiley & Sons. This book was released on 2024-10-01 with total page 437 pages. Available in PDF, EPUB and Kindle. Book excerpt: Keep up-to-date with the latest on adhesion and adhesives from an expert group of worldwide authors. The book series “Progress in Adhesion and Adhesives” was conceived as an annual publication and the premier volume made its debut in 2015. The series has been well-received as it is unique and provides substantive and curated review chapters on subjects that touch many disciplines. The current book contains nine chapters on topics that include multi-component theories in surface thermodynamics and adhesion science; plasma-deposited polymer layers as adhesion promotors; functional interlayers to control interfacial adhesion in reinforced polymer composites; hydrophobic materials, and coatings from natural sources; mechanics of ice adhesion; epoxy adhesives technology: latest developments and trends; hot-melt adhesives for automobile assembly; lifetime estimation of thermostat adhesives by physical and chemical aging processes; and nondestructive evaluation and condition monitoring of adhesive joints. Audience The volume will appeal to adhesionists, adhesive technologists, polymer scientists, materials scientists, and those involved/interested in adhesive bonding, plasma polymerization, adhesion in polymer composites, durability and testing of adhesive joints, materials from natural sources, and ice adhesion and mitigation.
Download or read book Electronic Equipment Packaging Technology written by Gerald L. Ginsberg and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 285 pages. Available in PDF, EPUB and Kindle. Book excerpt: The last twenty years have seen major advances in the electronics industry. Perhaps the most significant aspect of these advances has been the significant role that electronic equipment plays in almost all product markets. Even though electronic equipment is used in a broad base of applications, many future applications have yet to be conceived. This versatility of electron ics has been brought about primarily by the significant advances that have been made in integrated circuit technology. The electronic product user is rarely aware of the integrated circuits within the equipment. However, the user is often very aware of the size, weight, mod ularity, maintainability, aesthetics, and human interface features of the product. In fact, these are aspects of the products that often are instrumental in deter mining its success or failure in the marketplace. Optimizing these and other product features is the primary role of Electronic Equipment Packaging Technology. As the electronics industry continues to pro vide products that operate faster than their predecessors in a smaller space with a reduced cost per function, the role of electronic packaging technology will assume an even greater role in the development of cost-effective products.
Download or read book Lead Free Solder Process Development written by Gregory Henshall and published by John Wiley & Sons. This book was released on 2011-03-29 with total page 241 pages. Available in PDF, EPUB and Kindle. Book excerpt: Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distribution Examines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB) Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD) Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.
Download or read book NB T 42077 2016 Translated English of Chinese Standard NBT 42077 2016 NB T42077 2016 NBT42077 2016 written by https://www.chinesestandard.net and published by https://www.chinesestandard.net. This book was released on 2018-03-13 with total page 152 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is standard applies to portable devices performing simultaneously the functions of detection of the residual current, of comparison of the value of this current with the residual operating value and of opening of the protected circuit when the residual current exceeds this value.
Download or read book Official Gazette of the United States Patent and Trademark Office written by and published by . This book was released on 2002 with total page 756 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Practical Reliability Of Electronic Equipment And Products written by Eugene R. Hnatek and published by CRC Press. This book was released on 2002-10-25 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: Practical Reliability of Electronic Equipment and Products will help electrical, electronics, manufacturing, mechanical, systems design, and reliability engineers; electronics production managers; electronic circuit designers; and upper-level undergraduate and graduate students in these disciplines.
Download or read book Handbook of Aluminum Bonding Technology and Data written by J. D. Minford and published by CRC Press. This book was released on 1993-06-16 with total page 728 pages. Available in PDF, EPUB and Kindle. Book excerpt: A reference that offers comprehensive discussions on every important aspect of aluminum bonding for each level of manufacturing from mill finished to deoxidized, conversion coated, anodized, and painted surfaces and provides an extensive, up-to-date review of adhesion science, covering all significa
Download or read book Surface Mount and Related Technologies written by Gerald L. Ginsberg and published by CRC Press. This book was released on 1989-04-24 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Linkages written by National Research Council and published by National Academies Press. This book was released on 2006-01-19 with total page 94 pages. Available in PDF, EPUB and Kindle. Book excerpt: Over the past two decades, the Department of Defense has been moving toward commercial-military integration for manufacturing, while at the same time, the printed circuit board industry has been moving steadily offshore. Today, many in DoD, the U.S. Congress, and the federal government lack a clear understanding of the importance of high-quality, trustworthy printed circuit boards (PrCBs) for properly functioning weapons and other defense systems and components. To help develop this understanding, DOD requested the NRC to identify and assess the key issues affecting PrCBs for military use. This report presents a discussion of how to ensure DOD's access to reliable printed circuits; an assessment of its vulnerability to the global printed circuit supply chain; and suggestions about ways to secure the design and manufacture of printed circuits. In addition, this report offers recommendations to help DoD (1) preserve existing systems' capabilities, (2) improve the military's access to currently available PrCBs, and (3) ensure access to future PrCB technology. The recommendations reflect the need to achieve these goals at reasonable cost and in concert with evolving environmental regulations.
Download or read book Products and Services Catalogue written by and published by . This book was released on 2000 with total page 1034 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Surface Mount Technology written by Ray Prasad and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 791 pages. Available in PDF, EPUB and Kindle. Book excerpt: A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work. When asked to write this foreword, I had no problem with what I wanted to say about the work or the author. I did, however, wonder why people read a foreword. It is probably of value to know the background of the writer of a book; it is probably also of value to know the background of the individual who is commenting on the work. I consider myself a good friend of the author, and when I was asked to write a few words I felt honored to provide my view of Ray Prasad, his expertise, and the contribution that he has made to our industry. This book is about the industry, its technology, and its struggle to learn and compete in a global market bursting with new ideas to satisfy a voracious appetite for new and innovative electronic products. I had the good fortune to be there at the beginning (or almost) and have witnessed the growth and excitement in the opportunities and challenges afforded the electronic industries' engineering and manufacturing talents. In a few years my involve ment will span half a century.
Download or read book GB 29303 2012 Translated English of Chinese Standard GB29303 2012 written by https://www.chinesestandard.net and published by https://www.chinesestandard.net. This book was released on 2017-02-11 with total page 167 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Standard specifies the classification, characteristics, marking and product information, standard conditions for operation in service and for installation, and requirements for construction and operation of SPE-PRCDs.
Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Download or read book Fundamentals of Modern Manufacturing written by Mikell P. Groover and published by John Wiley & Sons. This book was released on 2015-11-23 with total page 948 pages. Available in PDF, EPUB and Kindle. Book excerpt: Fundamentals of Modern Manufacturing: Materials, Processes, and Systems, 6th Edition, is designed for a first course or two-course sequence in Manufacturing at the junior level in Mechanical, Industrial, and Manufacturing Engineering curricula. As in preceding editions, the author's objective is to provide a treatment of manufacturing that is modern and quantitative. The book's modern approach is based on balanced coverage of the basic engineering materials, the inclusion of recently developed manufacturing processes and comprehensive coverage of electronics manufacturing technologies. The quantitative focus of the text is displayed in its emphasis on manufacturing science and its greater use of mathematical models and quantitative end-of-chapter problems. This text is an unbound, three hole punched version.
Download or read book The Electronic Packaging Handbook written by Glenn R. Blackwell and published by CRC Press. This book was released on 2017-12-19 with total page 648 pages. Available in PDF, EPUB and Kindle. Book excerpt: The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
