Download or read book Challenges In Mechanics of Time Dependent Materials and Processes in Conventional and Multifunctional Materials Volume 2 written by Bonnie Antoun and published by Springer Science & Business Media. This book was released on 2013-08-28 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt: Challenges in Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials, Volume 2: Proceedings of the 2013 SEM Annual Conference& Exposition on Experimental and Applied Mechanics, the second volume of eight from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on fundamental and applied aspects of Experimental Mechanics, including papers in the following general technical research areas: Metallic, Polymeric and Composite Materials Effects of Extreme Environments including Radiation Resistance, Damage, and Aging Challenges in Time-dependent Behavior Modeling of Low, Moderate and High Strain Rates Effects of Frequency and Hysteretic Heating Effects of Inhomogeneities on the Time-Dependent Behavior Composite, Hybrid and Multifunctional Materials Challenges in Time-dependent Behavior Modeling Viscoelastoplasticity and Damage Effects of Interfaces and Interphases on the Time-Dependent Behavior Environmental and Reactive Property Change Effects on Thermomechanical and Multifunctional Behaviors Modeling and Characterization of Fabrication Processes of Conventional and Multifunctional Materials Time-dependent and Small-scale Effects in Micro/Nano-scale Testing Time-dependent Processes in Biomaterials

Download or read book Environmental Issues with Materials and Processes for the Electronics and Semiconductor Industries written by Laura Mendicino and published by The Electrochemical Society. This book was released on 2001 with total page 228 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Materials and Processes for Next Generation Lithography written by and published by Elsevier. This book was released on 2016-11-08 with total page 634 pages. Available in PDF, EPUB and Kindle. Book excerpt: As the requirements of the semiconductor industry have become more demanding in terms of resolution and speed it has been necessary to push photoresist materials far beyond the capabilities previously envisioned. Currently there is significant worldwide research effort in to so called Next Generation Lithography techniques such as EUV lithography and multibeam electron beam lithography. These developments in both the industrial and the academic lithography arenas have led to the proliferation of numerous novel approaches to resist chemistry and ingenious extensions of traditional photopolymers. Currently most texts in this area focus on either lithography with perhaps one or two chapters on resists, or on traditional resist materials with relatively little consideration of new approaches. This book therefore aims to bring together the worlds foremost resist development scientists from the various community to produce in one place a definitive description of the many approaches to lithography fabrication. Assembles up-to-date information from the world’s premier resist chemists and technique development lithographers on the properties and capabilities of the wide range of resist materials currently under investigation Includes information on processing and metrology techniques Brings together multiple approaches to litho pattern recording from academia and industry in one place

Download or read book Physical Chemistry of Semiconductor Materials and Processes written by and published by John Wiley & Sons. This book was released on 2015-08-17 with total page 420 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of solid state devices began a little more than a century ago, with the discovery of the electrical conductivity of ionic solids. Today, solid state technologies form the background of the society in which we live. The aim of this book is threefold: to present the background physical chemistry on which the technology of semiconductor devices is based; secondly, to describe specific issues such as the role of defects on the properties of solids, and the crucial influence of surface properties; and ultimately, to look at the physics and chemistry of semiconductor growth processes, both at the bulk and thin-film level, together with some issues relating to the properties of nano-devices. Divided into five chapters, it covers: Thermodynamics of solids, including phases and their properties and structural order Point defects in semiconductors Extended defects in semiconductors and their interactions with point defects and impurities Growth of semiconductor materials Physical chemistry of semiconductor materials processing With applications across all solid state technologies,the book is useful for advanced students and researchers in materials science, physics, chemistry, electrical and electronic engineering. It is also useful for those in the semiconductor industry.

Download or read book Engineering Materials and Processes e Mega Reference written by Michael F. Ashby and published by Butterworth-Heinemann. This book was released on 2009-01-06 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt: A one-stop desk reference, for engineers involved in the use of engineered materials across engineering and electronics, this book will not gather dust on the shelf. It brings together the essential professional reference content from leading international contributors in the field. Material ranges from basic to advanced topics, including materials and process selection and explanations of properties of metals, ceramics, plastics and composites. A hard-working desk reference, providing all the essential material needed by engineers on a day-to-day basis Fundamentals, key techniques, engineering best practice and rules-of-thumb together in one quick-reference sourcebook Definitive content by the leading authors in the field, including Michael Ashby, Robert Messler, Rajiv Asthana and R.J. Crawford

Download or read book Microelectromechanical Systems written by Committee on Advanced Materials and Fabrication Methods for Microelectromechanical Systems and published by National Academies Press. This book was released on 1997-12-15 with total page 76 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectromenchanical systems (MEMS) is a revolutionary field that adapts for new uses a technology already optimized to accomplish a specific set of objectives. The silicon-based integrated circuits process is so highly refined it can produce millions of electrical elements on a single chip and define their critical dimensions to tolerances of 100-billionths of a meter. The MEMS revolution harnesses the integrated circuitry know-how to build working microsystems from micromechanical and microelectronic elements. MEMS is a multidisciplinary field involving challenges and opportunites for electrical, mechanical, chemical, and biomedical engineering as well as physics, biology, and chemistry. As MEMS begin to permeate more and more industrial procedures, society as a whole will be strongly affected because MEMS provide a new design technology that could rival--perhaps surpass--the societal impact of integrated circuits.

Download or read book Encyclopedia of Packaging Materials Processes and Mechanics written by Avram Bar-Cohen and published by World Scientific. This book was released on 2019 with total page 1079 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories. The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging "learning curve," the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications"--Publisher's website

Download or read book Computer Aided Materials Selection During Structural Design written by Committee on Application of Expert Systems to Materials Selection During Structural Design and published by National Academies Press. This book was released on 1995-04-17 with total page 84 pages. Available in PDF, EPUB and Kindle. Book excerpt: The selection of the proper materials for a structural component is a critical activity that is governed by many, often conflicting factors. Incorporating materials expert systems into CAD/CAM operations could assist designers by suggesting potential manufacturing processes for particular products to facilitate concurrent engineering, recommending various materials for a specific part based on a given set of characteristics, or proposing possible modifications of a design if suitable materials for a particular part do not exist. This book reviews the structural design process, determines the elements, and capabilities required for a materials selection expert system to assist design engineers, and recommends the areas of expert system and materials modeling research and development required to devise a materials-specific design system.

Download or read book Actual Challenges in Materials Science and Processing Technologies written by Gennadiy Pivnyak and published by . This book was released on 2020 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Architecting Robust Co Design of Materials Products and Manufacturing Processes written by Anand Balu Nellippallil and published by Springer Nature. This book was released on 2020-06-13 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explores systems-based, co-design, introducing a “Decision-Based, Co-Design” (DBCD) approach for the co-design of materials, products, and processes. In recent years there have been significant advances in modeling and simulation of material behavior, from the smallest atomic scale to the macro scale. However, the uncertainties associated with these approaches and models across different scales need to be addressed to enable decision-making resulting in designs that are robust, that is, relatively insensitive to uncertainties. An approach that facilitates co-design is needed across material, product design and manufacturing processes. This book describes a cloud-based platform to support decisions in the design of engineered systems (CB-PDSIDES), which feature an architecture that promotes co-design through the servitization of decision-making, knowledge capture and use templates that allow previous solutions to be reused. Placing the platform in the cloud aids mass collaboration and open innovation. A valuable reference resource reference on all areas related to the design of materials, products and processes, the book appeals to material scientists, design engineers and all those involved in the emerging interdisciplinary field of integrated computational materials engineering (ICME).

Download or read book Proceedings of the Second Symposium on III V Nitride Materials and Processes written by C. R. Abernathy and published by The Electrochemical Society. This book was released on 1998 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Process Systems and Materials for CO2 Capture written by Athanasios I. Papadopoulos and published by John Wiley & Sons. This book was released on 2017-03-28 with total page 688 pages. Available in PDF, EPUB and Kindle. Book excerpt: This comprehensive volume brings together an extensive collection of systematic computer-aided tools and methods developed in recent years for CO2 capture applications, and presents a structured and organized account of works from internationally acknowledged scientists and engineers, through: Modeling of materials and processes based on chemical and physical principles Design of materials and processes based on systematic optimization methods Utilization of advanced control and integration methods in process and plant-wide operations The tools and methods described are illustrated through case studies on materials such as solvents, adsorbents, and membranes, and on processes such as absorption / desorption, pressure and vacuum swing adsorption, membranes, oxycombustion, solid looping, etc. Process Systems and Materials for CO2 Capture: Modelling, Design, Control and Integration should become the essential introductory resource for researchers and industrial practitioners in the field of CO2 capture technology who wish to explore developments in computer-aided tools and methods. In addition, it aims to introduce CO2 capture technologies to process systems engineers working in the development of general computational tools and methods by highlighting opportunities for new developments to address the needs and challenges in CO2 capture technologies.

Download or read book Materials and Process Modeling of Aerospace Composites written by Charles Lu and published by SAE International. This book was released on 2019-04-30 with total page 190 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since the successful production of carbon fibers in early 1960s, composite materials have emerged as the materials of choice for general aviation aircraft, military aircraft, space launch vehicles, and unmanned air vehicles. This has revolutionized the aerospace industry due to their excellent mechanical and physical properties, as well as weight-reducing ability. The next- generation material development model should operate in an integrated computational environment, where new material development, manufacturability, and product design practice are seamlessly interconnected. Materials and Process Modeling of Aerospace Composites reports recent developments on materials and processes of aerospace composites by using computational modeling, covering the following aspects: • The historical uses of composites in aerospace industry, documenting in detail the early usage of composite materials on Premier I by Raytheon to recent full-scale applications of composites on large commercial aircraft by Boeing and Airbus. • An overview on the classifications of composites used in aerospace industry, ranging from conventional glass- fiber reinforced composites to advanced graphene nanocomposites. • The recent work on computational material engineering on aerospace composite materials, including fundamental computational frame work and case studies on the modeling of materials and processes

Download or read book Innovative Processes and Materials in Additive Manufacturing written by Sunpreet Singh and published by Woodhead Publishing. This book was released on 2022-09-06 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt: Innovative Processes and Materials in Additive Manufacturing explains game-changing interdisciplinary applications of recent research breakthroughs in additive manufacturing technology. The number of research publications addressing additive manufacturing has soared in recent years as a range of disciplines explore the possibilities that this technology can provide. This book acts as a bridge between this high-level research and the large number of academics and practitioners looking to additive manufacturing for innovative solutions, providing them with practical and approachable information. Applications in aerospace, automotive, medical, construction, and food industries are addressed, featuring technical details that will help successful implementation. This unique book also provides broad coverage of the theory behind this emerging technology, including material development, as well as the technical details required for readers to investigate the novel applications of the involved methods for themselves. Includes case studies from the aerospace, construction and medical industries Features innovations in the integration of additive manufacturing processes with other manufacturing technologies Identifies exciting routes for future research and application areas of additive manufacturing

Download or read book Actual Challenges in Materials Science and Processing Technologies II written by Oleg Bazaluk and published by Trans Tech Publications Ltd. This book was released on 2021-09-06 with total page 257 pages. Available in PDF, EPUB and Kindle. Book excerpt: Special topic volume with invited peer-reviewed papers only

Download or read book Thin Film Materials Processes and Reliability written by G. S. Mathad and published by The Electrochemical Society. This book was released on 2003 with total page 438 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Challenges in Mechanics of Time Dependent Materials and Processes in Conventional and Multifunctional Materials Volume 2 written by Bonnie Antoun and published by Springer Science & Business Media. This book was released on 2012-11-09 with total page 162 pages. Available in PDF, EPUB and Kindle. Book excerpt: Challenges in Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials, Volume 2 represents one of seven volumes of technical papers presented at the Society for Experimental Mechanics SEM 12th International Congress & Exposition on Experimental and Applied Mechanics, held at Costa Mesa, California, June 11-14, 2012. The full set of proceedings also includes volumes on: Dynamic Behavior of Materials, Imaging Methods for Novel Materials and Challenging Applications, Experimental and Applied Mechanics, 2nd International Symposium on the Mechanics of Biological Systems and Materials 13th International Symposium on MEMS and Nanotechnology and, Composite Materials and the 1st International Symposium on Joining Technologies for Composites.