Download or read book Manufacturing Process for Polyimide Laminate written by H. Nagai and published by . This book was released on 1987 with total page 7 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Method for Manufacturing a Polyimide Laminate written by T. Kanda and published by . This book was released on 1986 with total page 10 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Manufacturing Process for Polyimide written by H. Ogi and published by . This book was released on 1987 with total page 8 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Polyimide Laminates with High Peel Resistance and Process for Their Production written by H. Zengel and published by . This book was released on 1984 with total page 17 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Polyimides and Other High Temperature Polymers Synthesis Characterization and Applications volume 2 written by Kash L. Mittal and published by CRC Press. This book was released on 2003-03-01 with total page 532 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume documents the proceedings of the Second International Symposium on Polyimides and Other High Temperature Polymers: Synthesis, Characterization and Applications, held in Newark, New Jersey, December 3-6, 2001. Polyimides possess many desirable attributes, so this class of materials has found applications in many technologies ranging from

Download or read book Manufacturing Process for Polyimide Molding Material written by Y. Tagami and published by . This book was released on 1988 with total page 14 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Manufacturing Processes for Fabricating Graphite PMR 15 Polyimide Structural Elements written by and published by . This book was released on 1979 with total page 304 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Manufacturing Process for Molded Polyimide Product written by Akira Suzuki and published by . This book was released on 1986 with total page 7 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Rigid Flex Printed Circuit Manufacturing Process A Project of the Manufacturing Technology Program written by Joseph A. Reavill and published by . This book was released on 1979 with total page 386 pages. Available in PDF, EPUB and Kindle. Book excerpt: The activities performed to achieve the program objectives first involved identifying one of eight different suppliers in order to purchase the polyimide glass laminate. The laminate supplier selection was based upon material testing, cost, quality/technology level, and production capability. Material was procured and a process investigation was conducted which evaluated current production processes by fabricating and testing sample rigid-flex units. An optimized fabrication process was developed by varying individual process parameters and the deliverable rigid-flex units were fabricated according to the documented material, process, and product specifications generated during this program. To establish that the cables meet specification requirements, extensive testing was performed on each unit. A yield/cost analysis was performed to verify the achievement of program goals.

Download or read book Manufacturing Method of Polyimide written by W. R. Henrix and published by . This book was released on 1964 with total page 22 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Microelectronic Packaging written by M. Datta and published by CRC Press. This book was released on 2004-12-20 with total page 564 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.

Download or read book Develop and Demonstrate Manufacturing Processes for Fabricating Graphite Filament Reinforced Polyimide Gr PI Composite Structural Elements written by and published by . This book was released on 1977 with total page 49 pages. Available in PDF, EPUB and Kindle. Book excerpt: One approach for increasing the efficiency of future reusable space vehicles involves the use of lightweight, elevated temperature resistant structural materials. One of the most promising materials for this application is graphite filament reinforced polyimide matrix composites. NASA's project Composites for Advanced Space Transportation Systems (CASTS) has been established to develop and demonstrate the technology required to achieve Gr/PI structural components with 316C (600F) operational capability. The primary objective of this program, which is sponsored under the CASTS Project, is the development and demonstration of fabrication processes for graphite composites based on DuPont's NR-150B2 polyimide which are applicable to fabrication of large size structures. The program involves two major tasks and various sub (a) Material development and characterization for Quality Assurance. (b) Laminate fabrication process development. (c) Adhesive bonding study. (d) Stiffened panel development. (e) Honeycomb panel development. (f) Chopped fiber molding process development. (g) NDI development. (h) Testing for process verification. (i) Specifications. (a) Laminates. (b) Stiffened Panels. (c) Honeycomb Panels. (d) Chopped Fiber Moldings. (e) Structural Component.

Download or read book Production Process Development for Polyimide Acrylic Materials for Flexible Printed Circuitry written by Stephen A. Hays and published by . This book was released on 1977 with total page 260 pages. Available in PDF, EPUB and Kindle. Book excerpt: The results of a successfully concluded NAV-SEA sponsored program performed by General Dynamics, Pomona, in testing, process development, and fabrication of multilayer Flexible Printed Wiring (FPW) using acrylic adhesive are reported. These acrylic adhesives were obtained in various forms, as copper and/or polyimide laminates and cast film. Based on the findings of this investigation, change-over to these acrylic-polyimide materials is recommended for all continuing FPW fabrication programs, in order to improve yields, improve product reliability, and reduce both processing and overall costs. The program objective of choosing a material/process system which provides a significant reduction in fabrication cost, with an improvement in quality of the product as its acceptance criteria was achieved. This program included testing and fabrication of materials, two layer test pattern FPW, four layer test pattern FPW and a four layer pilot lot FPW consisting of multiple test patterns including an actual tactical missile FPW prototype part.

Download or read book Printing Technology for Flexible Substrates written by Publishing Interlingua Publishing and published by InterLingua Publishing. This book was released on 2006 with total page 253 pages. Available in PDF, EPUB and Kindle. Book excerpt: A huge revolution is emerging in the format and manufacturing process of electronic devices including displays brought on by the use of plastic substrates and printing technology. Flexible substrates enable large displays that can be freely bent, lightweight, and easily transported, as a result. In addition, the new technology has the potential of achieving various new devices such as e-paper, a new display medium, which epitomizes the advantage of hard copy paper; solar cells which are 1/10 the weight; sensors that can be completely embedded in floors and personal clothing.This report analyzes the latest trends in the technology and materials surrounding the manufacturing process of flexible electronic devices, with the above exciting breakthrough features.

Download or read book Method for Manufacturing Polyimide written by T. Ota and published by . This book was released on 1988 with total page 16 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1995 with total page 500 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Handbook of Printed Circuit Manufacturing written by Raymond H. Clark and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 622 pages. Available in PDF, EPUB and Kindle. Book excerpt: Of all the components that go into electronic equipment, the printed circuit probably requires more manufacturing operations-each of which must be per formed by a skilled person-than any other. As a shift supervisor early in my printed circuit career, I had to hire and train personnel for all job functions. The amount of responsibility delegated to my subordinates depended strictly on how well I had been able to train them. Training people can be a trying experience and is always a time-consuming one. It behooved me to help my workers obtain the highest degree of job under standing and skill that they and I were capable of. One hindrance to effective teaching is poor continuity of thought, for example, having to say to a trainee, "Wait a minute; forget what I just told you. We have to go back and do some thing else first. " It was in trying to avoid pitfalls such as this that I undertook a detailed examination of the processes involved, what I thought each trainee had to know, and what questions they would most frequently ask. From this analysis I developed the various process procedures. Only after I had done so was I able to train effectively and with the confidence that I was doing the best possible job. Answers had to be at hand for all of their questions and in what ever detail they needed to know.