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Book Handbook of VLSI Microlithography

Download or read book Handbook of VLSI Microlithography written by William B. Glendinning and published by William Andrew. This book was released on 2012-12-02 with total page 672 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatings-- including optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely covered -- including an entire chapter on resist process defectivity and the potential yield limiting effect on device production. Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.

Book Handbook of VLSI Microlithography

Download or read book Handbook of VLSI Microlithography written by John N. Helbert and published by William Andrew. This book was released on 2001-04-01 with total page 1025 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatingsùincluding optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely coveredùincluding an entire chapter on resist process defectivity and the potential yield limiting effect on device production.Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.

Book Handbook of VLSI Microlithography  2nd Edition

Download or read book Handbook of VLSI Microlithography 2nd Edition written by John N. Helbert and published by Cambridge University Press. This book was released on 2001-04 with total page 1026 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatingsùincluding optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely coveredùincluding an entire chapter on resist process defectivity and the potential yield limiting effect on device production. Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.

Book Fundamental Principles of Optical Lithography

Download or read book Fundamental Principles of Optical Lithography written by Chris Mack and published by John Wiley & Sons. This book was released on 2011-08-10 with total page 503 pages. Available in PDF, EPUB and Kindle. Book excerpt: The fabrication of an integrated circuit requires a variety of physical and chemical processes to be performed on a semiconductor substrate. In general, these processes fall into three categories: film deposition, patterning, and semiconductor doping. Films of both conductors and insulators are used to connect and isolate transistors and their components. By creating structures of these various components millions of transistors can be built and wired together to form the complex circuitry of modern microelectronic devices. Fundamental to all of these processes is lithography, ie, the formation of three-dimensional relief images on the substrate for subsequent transfer of the pattern to the substrate. This book presents a complete theoretical and practical treatment of the topic of lithography for both students and researchers. It comprises ten detailed chapters plus three appendices with problems provided at the end of each chapter. Additional Information: Visiting http://www.lithoguru.com/textbook/index.html enhances the reader's understanding as the website supplies information on how you can download a free laboratory manual, Optical Lithography Modelling with MATLAB®, to accompany the textbook. You can also contact the author and find help for instructors.

Book Resolution Enhancement Techniques in Optical Lithography

Download or read book Resolution Enhancement Techniques in Optical Lithography written by Alfred Kwok-Kit Wong and published by SPIE Press. This book was released on 2001 with total page 238 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ever-smaller IC devices are pushing the optical lithography envelope, increasing the importance of resolution enhancement techniques. This tutorial encompasses two decades of research. It discusses theoretical and practical aspects of commonly used techniques, including optical imaging and resolution, modified illumination, optical proximity correction, alternating and attenuating phase-shifting masks, selecting RETs, and second-generation RETs. Useful for students and practicing lithographers

Book VLSI Electronics Microstructure Science

Download or read book VLSI Electronics Microstructure Science written by Norman G. Einspruch and published by Academic Press. This book was released on 2014-12-01 with total page 414 pages. Available in PDF, EPUB and Kindle. Book excerpt: VLSI Electronics: Microstructure Science, Volume 7 presents a comprehensive exposition and assessment of the developments and trends in VLSI (Very Large Scale Integration) electronics. This treatise covers subjects that range from microscopic aspects of materials behavior and device performance to the comprehension of VLSI in systems applications. Each chapter is prepared by a recognized authority. The topics contained in this volume include a basic introduction to the application of superconductivity in high-speed digital systems; the expected impact of VLSI technology on the implementation of AI (artificial intelligence); the limits to improvement of silicon integrated circuits; and the various spontaneous noise sources in VLSI circuits and their effect on circuit operation. Scientists, engineers, researchers, device designers, and systems architects will find the book very useful.

Book VLSI Electronics

Download or read book VLSI Electronics written by D B Clayson and published by Elsevier. This book was released on 2014-06-28 with total page 357 pages. Available in PDF, EPUB and Kindle. Book excerpt: VLSI Electronics

Book Handbook of Microlithography  Micromachining  and Microfabrication  Microlithography

Download or read book Handbook of Microlithography Micromachining and Microfabrication Microlithography written by P. Rai-Choudhury and published by SPIE Press. This book was released on 1997 with total page 780 pages. Available in PDF, EPUB and Kindle. Book excerpt: The dynamic field of lithography demands an authoritative handbook for process development and production, and to aid in the training of scientists and engineers. It contains process details, recipes, tables, charts, etc., and is useful as a reference book or as a textbook. Copublished with IEE.

Book Nanotechnologies  The Physics of Nanomaterials

Download or read book Nanotechnologies The Physics of Nanomaterials written by David Schmool and published by CRC Press. This book was released on 2021-07-09 with total page 420 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides a broad introduction to nanophysics and nanotechnologies, and the importance of low-dimensional and surface physics is discussed indepth. Chapters in Volume 1 covers the large range of physical preparation techniques available for the production of nanomaterials and nanostructuring.

Book Fundamentals of Semiconductor Processing Technology

Download or read book Fundamentals of Semiconductor Processing Technology written by Badih El-Kareh and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 605 pages. Available in PDF, EPUB and Kindle. Book excerpt: The drive toward new semiconductor technologies is intricately related to market demands for cheaper, smaller, faster, and more reliable circuits with lower power consumption. The development of new processing tools and technologies is aimed at optimizing one or more of these requirements. This goal can, however, only be achieved by a concerted effort between scientists, engineers, technicians, and operators in research, development, and manufac turing. It is therefore important that experts in specific disciplines, such as device and circuit design, understand the principle, capabil ities, and limitations of tools and processing technologies. It is also important that those working on specific unit processes, such as lithography or hot processes, be familiar with other unit processes used to manufacture the product. Several excellent books have been published on the subject of process technologies. These texts, however, cover subjects in too much detail, or do not cover topics important to modem tech nologies. This book is written with the need for a "bridge" between different disciplines in mind. It is intended to present to engineers and scientists those parts of modem processing technologies that are of greatest importance to the design and manufacture of semi conductor circuits. The material is presented with sufficient detail to understand and analyze interactions between processing and other semiconductor disciplines, such as design of devices and cir cuits, their electrical parameters, reliability, and yield.

Book Lithography for VLSI

Download or read book Lithography for VLSI written by Norman G. Einspruch and published by Academic Press. This book was released on 2014-12-01 with total page 374 pages. Available in PDF, EPUB and Kindle. Book excerpt: VLSI Electronics Microstructure Science, Volume 16: Lithography for VLSI treats special topics from each branch of lithography, and also contains general discussion of some lithographic methods. This volume contains 8 chapters that discuss the various aspects of lithography. Chapters 1 and 2 are devoted to optical lithography. Chapter 3 covers electron lithography in general, and Chapter 4 discusses electron resist exposure modeling. Chapter 5 presents the fundamentals of ion-beam lithography. Mask/wafer alignment for x-ray proximity printing and for optical lithography is tackled in Chapter 6. Chapters 7 and 8 on metrology deal with the characterization of lithography by measurements of various types. Engineers, scientists, and technical managers in the semiconductor industry, and engineering and applied physics faculty and graduate students will find the text very useful.

Book Microlithography

Download or read book Microlithography written by Bruce W. Smith and published by CRC Press. This book was released on 2020-05-01 with total page 851 pages. Available in PDF, EPUB and Kindle. Book excerpt: The completely revised Third Edition to the bestselling Microlithography: Science and Technology provides a balanced treatment of theoretical and operational considerations, from fundamental principles to advanced topics of nanoscale lithography. The book is divided into chapters covering all important aspects related to the imaging, materials, and processes that have been necessary to drive semiconductor lithography toward nanometer-scale generations. Renowned experts from the world’s leading academic and industrial organizations have provided in-depth coverage of the technologies involved in optical, deep-ultraviolet (DUV), immersion, multiple patterning, extreme ultraviolet (EUV), maskless, nanoimprint, and directed self-assembly lithography, together with comprehensive descriptions of the advanced materials and processes involved. New in the Third Edition In addition to the full revision of existing chapters, this new Third Edition features coverage of the technologies that have emerged over the past several years, including multiple patterning lithography, design for manufacturing, design process technology co-optimization, maskless lithography, and directed self-assembly. New advances in lithography modeling are covered as well as fully updated information detailing the new technologies, systems, materials, and processes for optical UV, DUV, immersion, and EUV lithography. The Third Edition of Microlithography: Science and Technology authoritatively covers the science and engineering involved in the latest generations of microlithography and looks ahead to the future systems and technologies that will bring the next generations to fruition. Loaded with illustrations, equations, tables, and time-saving references to the most current technology, this book is the most comprehensive and reliable source for anyone, from student to seasoned professional, looking to better understand the complex world of microlithography science and technology.

Book ULSI Technology

Download or read book ULSI Technology written by C. Y. Chang and published by McGraw-Hill Science, Engineering & Mathematics. This book was released on 1996 with total page 756 pages. Available in PDF, EPUB and Kindle. Book excerpt: "This text follows the tradition of Sze's highly successful pioneering text on VLSI technology and is updated with the latest advances in the field of microelectronic chip fabrication. Since computer chips are foundations of modern electronics, these topics are essential for the next generation of USLI technologies, allowing more transistors to be packaged on a single chip. Contributing to each chapter are industry experts, specializing in topics such as epitaxy with low temperature process, rapid thermal processes, low damage plasma reactive ion etching, fine line litography, cleaning technology, clean room technology, packing and reliability."--

Book Silicon Processing

    Book Details:
  • Author : SYMPOSIUM ON SILICON PROCESSING. (1982 : SAN JOSE) AUTOR
  • Publisher : ASTM International
  • Release : 1983
  • ISBN :
  • Pages : 562 pages

Download or read book Silicon Processing written by SYMPOSIUM ON SILICON PROCESSING. (1982 : SAN JOSE) AUTOR and published by ASTM International. This book was released on 1983 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Beam Processing Technologies

Download or read book Beam Processing Technologies written by Norman G. Einspruch and published by Academic Press. This book was released on 2014-12-01 with total page 559 pages. Available in PDF, EPUB and Kindle. Book excerpt: Beam Processing Technologies is a collection of papers that deals with the miniaturization of devices that will be faster, consume less power, and cost less per operation or fabrication. One paper discusses metal oxide semiconductor (MOS) integrated circuit technology including the operation of devices whose lateral and vertical dimensions are scaled down. If the devices' silicon doping profiles are increased by the same scale factor, they can operate on lower voltages and currents, with the same performance. Another paper describes laser beam processing and wafer-scale integration as techniques to increase the number of devices on a silicon chip. Electron beam technologies can be used in many fabrication processes such as in microlithography, selective oxidation, doping, metrology. Ion beam applications depend on the presence of the ion introduced into the device (e.g. implantation doping), on pseudoelastic collisions (e.g. physical sputtering or crystal damage), and on inelastic scattering (e.g. polymer resist exposure). Silicon molecular beam epitaxy (SiMBE) can also grow high-quality layers at low temperature, particularly concerning germanium, especially as reagrds the growth system design and utilization of n- and p-type doping. Chemical beam epitaxy (CBE) is another epitaxial growth technique that can surpass MBE and metal organic chemical vapor deposition (MO-CVD). The collection is suitable chemical engineers, industrial physicists, and researchers whose work involve micro-fabrication and development of integrated circuits.

Book The Market and Beyond

Download or read book The Market and Beyond written by Martin Fransman and published by Cambridge University Press. This book was released on 1993-02-25 with total page 356 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book examines the Japanese success in technology through their Innovation System, improving products and their foresight.

Book Concise Encyclopedia of Semiconducting Materials   Related Technologies

Download or read book Concise Encyclopedia of Semiconducting Materials Related Technologies written by S. Mahajan and published by Elsevier. This book was released on 2013-10-22 with total page 607 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of electronic materials and particularly advances in semiconductor technology have played a central role in the electronics revolution by allowing the production of increasingly cheap and powerful computing equipment and advanced telecommunications devices. This Concise Encyclopedia, which incorporates relevant articles from the acclaimed Encyclopedia of Materials Science and Engineering as well as newly commissioned articles, emphasizes the materials aspects of semiconductors and the technologies important in solid-state electronics. Growth of bulk crystals and epitaxial layers are discussed in the volume and coverage is included of defects and their effects on device behavior. Metallization and passivation issues are also covered. Over 100 alphabetically arranged articles, written by world experts in the field, are each intended to serve as the first source of information on a particular aspect of electronic materials. The volume is extensively illustrated with photographs, diagrams and tables. A bibliography is provided at the end of each article to guide the reader to recent literature. A comprehensive system of cross-references, a three-level subject index and an alphabetical list of articles are included to aid readers in the abstraction of information.