Download or read book Hot Carrier Degradation in Semiconductor Devices written by Tibor Grasser and published by Springer. This book was released on 2014-10-29 with total page 518 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with a variety of tools to address the challenges posed by hot carrier degradation, one of today’s most complicated reliability issues in semiconductor devices. Coverage includes an explanation of carrier transport within devices and book-keeping of how they acquire energy (“become hot”), interaction of an ensemble of colder and hotter carriers with defect precursors, which eventually leads to the creation of a defect, and a description of how these defects interact with the device, degrading its performance.

Download or read book Silicon Analog Components written by Badih El-Kareh and published by Springer. This book was released on 2015-06-04 with total page 634 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers modern analog components, their characteristics, and interactions with process parameters. It serves as a comprehensive guide, addressing both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. Based on the authors’ extensive experience in the development of analog devices, this book is intended for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science.

Download or read book 3D TCAD Simulation for Semiconductor Processes Devices and Optoelectronics written by Simon Li and published by Springer Science & Business Media. This book was released on 2011-10-01 with total page 303 pages. Available in PDF, EPUB and Kindle. Book excerpt: Technology computer-aided design, or TCAD, is critical to today’s semiconductor technology and anybody working in this industry needs to know something about TCAD. This book is about how to use computer software to manufacture and test virtually semiconductor devices in 3D. It brings to life the topic of semiconductor device physics, with a hands-on, tutorial approach that de-emphasizes abstract physics and equations and emphasizes real practice and extensive illustrations. Coverage includes a comprehensive library of devices, representing the state of the art technology, such as SuperJunction LDMOS, GaN LED devices, etc.

Download or read book Failure Analysis written by Marius Bazu and published by John Wiley & Sons. This book was released on 2011-03-08 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt: Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.

Download or read book Physics and Technology of Silicon Carbide Devices written by George Gibbs and published by . This book was released on 2016-10-01 with total page 284 pages. Available in PDF, EPUB and Kindle. Book excerpt: Silicon (Si) is by far the most widely used semiconductor material for power devices. On the other hand, Si-based power devices are approaching their material limits, which has provoked a lot of efforts to find alternatives to Si-based power devices for better performance. With the rapid innovations and developments in the semiconductor industry, Silicon Carbide (SiC) power devices have progressed from immature prototypes in laboratories to a viable alternative to Si-based power devices in high-efficiency and high-power density applications. SiC devices have numerous persuasive advantages--high-breakdown voltage, high-operating electric field, high-operating temperature, high-switching frequency and low losses. Silicon Carbide (SiC) devices belong to the so-called wide band gap semiconductor group, which offers a number of attractive characteristics for high voltage power semiconductors when compared to commonly used silicon (Si). Recently, some SiC power devices, for example, Schottky-barrier diodes (SBDs), metal-oxide-semiconductor field-effecttransistors (MOSFETs), junction FETs (JFETs), and their integrated modules have come onto the market. Physics and Technology of Silicon Carbide Devices abundantly describes recent technologies on manufacturing, processing, characterization, modeling, etc. for SiC devices.

Download or read book Fundamentals of Power Semiconductor Devices written by B. Jayant Baliga and published by Springer. This book was released on 2018-09-28 with total page 1114 pages. Available in PDF, EPUB and Kindle. Book excerpt: Fundamentals of Power Semiconductor Devices provides an in-depth treatment of the physics of operation of power semiconductor devices that are commonly used by the power electronics industry. Analytical models for explaining the operation of all power semiconductor devices are shown. The treatment here focuses on silicon devices but includes the unique attributes and design requirements for emerging silicon carbide devices. The book will appeal to practicing engineers in the power semiconductor device community.

Download or read book Analog Circuit Design written by Johan Huijsing and published by Springer Science & Business Media. This book was released on 2013-03-20 with total page 406 pages. Available in PDF, EPUB and Kindle. Book excerpt: Analog Circuit Design contains the contribution of 18 experts from the 13th International Workshop on Advances in Analog Circuit Design. It is number 13 in the successful series of Analog Circuit Design. It provides 18 excellent overviews of analog circuit design in: Sensor and Actuator Interfaces, Integrated High-Voltage Electronics and Power Management, and Low-Power and High-Resolution ADC’s. Analog Circuit Design is an essential reference source for analog circuits designers and researchers wishing to keep abreast with the latest developments in the field. The tutorial coverage also makes it suitable for use in an advanced design course.

Download or read book RF and Microwave Semiconductor Device Handbook written by Mike Golio and published by CRC Press. This book was released on 2017-12-19 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt: Offering a single volume reference for high frequency semiconductor devices, this handbook covers basic material characteristics, system level concerns and constraints, simulation and modeling of devices, and packaging. Individual chapters detail the properties and characteristics of each semiconductor device type, including: Varactors, Schottky diodes, transit-time devices, BJTs, HBTs, MOSFETs, MESFETs, and HEMTs. Written by leading researchers in the field, the RF and Microwave Semiconductor Device Handbook provides an excellent starting point for programs involving development, technology comparison, or acquisition of RF and wireless semiconductor devices.

Download or read book 2017 IEEE 12th International Conference on ASIC ASICON written by IEEE Staff and published by . This book was released on 2017-10-25 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Process & Device Technologies 1 VLSI Design & Circuits 2 Analog, Mixed Signal and RF Circuits 3 Application Specific SOCs 4 Circuits and Systems for Wireless Communications 5 Testing, Reliability, Fault Tolerance 6 Advanced Memory 7 FPGA 8 Circuits Simulation, Synthesis, Varification and Physical Design 9 CAD for System, DFM & Testing 10 MEMS Techniques 11 Nanoelectronics and Gigascale Systems 12 New Devices Hetrojunction Devices, Fin FET, CNT MTJ Devices, 3D Integration, etc 13 Advanced Interconnection Technology, High K Metal gate technology and other VLSI New Processing, New technologies 14 VLSI application for energy generation, conservation and control 15 Processing, Devices Modeling & Simulation 16 Other VLSI Devices and Design related topics

Download or read book High Voltage Integrated Circuits written by B. Jayant Baliga and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1988 with total page 384 pages. Available in PDF, EPUB and Kindle. Book excerpt: Very Good,No Highlights or Markup,all pages are intact.

Download or read book Electronic Components and Systems written by W. H. Dennis and published by Elsevier. This book was released on 2013-10-22 with total page 273 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic Components and Systems focuses on the principles and processes in the field of electronics and the integrated circuit. Covered in the book are basic aspects and physical fundamentals; different types of materials involved in the field; and passive and active electronic components such as capacitors, inductors, diodes, and transistors. Also covered in the book are topics such as the fabrication of semiconductors and integrated circuits; analog circuitry; digital logic technology; and microprocessors. The monograph is recommended for beginning electrical engineers who would like to know the fundamental concepts, theories, and processes in the related fields.

Download or read book Power MOSFETs written by Duncan A. Grant and published by Wiley-Interscience. This book was released on 1989-04-25 with total page 540 pages. Available in PDF, EPUB and Kindle. Book excerpt: Details the theory of power MOSFETs and their applications. Explains the basis of MOSFET characteristics, and the features that determine MOSFET behavior. Examines the interaction of the MOSFET device with other elements in the circuit, and how device characteristics influence circuit design. Describes several circuits at length to highlight the practical details of power MOSFET use.

Download or read book Modern DC to DC Switchmode Power Converter Circuits written by R. Severns and published by Springer. This book was released on 2014-04-21 with total page 342 pages. Available in PDF, EPUB and Kindle. Book excerpt: As each area of technology with a potential for significantly impacting any major segment of the electronics industry evolves, it often is accompanied by the development of a succession of new circuits. Each new circuit indeed appears different, employing different components in differing configurations, and claims an assortment of distinct features of "improved performance. " Without a considerable investment of laboratory time to construct, evaluate, and compare each candidate circuit, it usually is difficult to realistically appraise the relative merits of one approach over another. It often is even more difficult to identify the underlying principles which point up basic similarities and differences. Such is the situation in the new and rapidly expanding area known as electronic power processing or switching mode power supplies. The area of switching power supplies has been spurred by the need for power sources of higher performance, smaller volume, and lighter weight in order to achieve compatibility with the shrinking size of all forms of communication and data handling systems, and particularly with the portable battery-operated equipment in everything from horne appliances and handtools to mobile com munication equipment. Static dc-to-dc converters and dc-to-ac inverters provide a natural interface with the new direct energy sources such as solar cells, fuel cells, thermoelectric generators, and the like, and form the central ingredient in most uninterruptable power sources.

Download or read book Guide to State of the Art Electron Devices written by Joachim N. Burghartz and published by John Wiley & Sons. This book was released on 2013-03-19 with total page 637 pages. Available in PDF, EPUB and Kindle. Book excerpt: Winner, 2013 PROSE Award, Engineering and Technology Concise, high quality and comparative overview of state-of-the-art electron device development, manufacturing technologies and applications Guide to State-of-the-Art Electron Devices marks the 60th anniversary of the IRE electron devices committee and the 35th anniversary of the IEEE Electron Devices Society, as such it defines the state-of-the-art of electron devices, as well as future directions across the entire field. Spans full range of electron device types such as photovoltaic devices, semiconductor manufacturing and VLSI technology and circuits, covered by IEEE Electron and Devices Society Contributed by internationally respected members of the electron devices community A timely desk reference with fully-integrated colour and a unique lay-out with sidebars to highlight the key terms Discusses the historical developments and speculates on future trends to give a more rounded picture of the topics covered A valuable resource R&D managers; engineers in the semiconductor industry; applied scientists; circuit designers; Masters students in power electronics; and members of the IEEE Electron Device Society.

Download or read book 2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon EuroSOI ULIS written by IEEE Staff and published by . This book was released on 2021-09 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The seventh joint EUROSOI ULIS conference will be hosted by Normandy University in Caen The focus of the sessions is on advanced nanoscale devices, including SOI technology Papers in the following areas are solicited Physical mechanisms and innovative SOI like devices New channel materials for CMOS strained Si, strained SOI, SiGe, GeOI, III V and high mobility materials on insulator carbon nanotubes graphene and other two dimensional materials Nanometer scale devices technology, characterization techniques and evaluation metrics for high performance, low power, low standby power, high frequency and memory applications New functionalities in silicon compatible nanostructures and innovative devices representing the More than Moore domain nanoelectronic sensors, biosensor devices, energy harvesting devices, RF devices, imagers, etc Advanced test structures and characterization techniques,reliability and variability assessment techniques for new materials and novel devices

Download or read book Wafer Bonding written by Marin Alexe and published by Springer Science & Business Media. This book was released on 2004-05-14 with total page 524 pages. Available in PDF, EPUB and Kindle. Book excerpt: During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Download or read book Table for Four written by K Srilata and published by Penguin UK. This book was released on 2011-07-19 with total page 155 pages. Available in PDF, EPUB and Kindle. Book excerpt: It is their last evening together. Maya, Sandra and Derek, graduate students at UC Santa Cruz and house-mates for three years, are preparing for dinner with Uncle Prithvi, the house-owner. It’s a cheerful and quirky household: Sandra is prone to ‘Orkut attacks’; Derek silently pines for the wistful-looking Afghan boy in the photo on his wall; Maya, who has the hots for Derek, is inexplicably terrified of the ocean; and the elusive Uncle Prithvi communicates through notes he leaves all over the place. Sad at parting, perhaps forever, and half tipsy, Maya, Sandra and Uncle Prithvi play a game of wapping stories as they wait for Derek to arrive. As the evening progresses, we learn their deep, dark secrets and hidden fears. Sandra, abandoned at birth, talks about growing up in an orphanage with her precious twin, disabled Solana, only to be separated by circumstances; Uncle Prithvi rues the loss of his beloved daughter, whom he betrayed when he sought a new life with Karen in the US. Maya, the narrator, can’t bring herself to open up—except when alone. And Derek avoids revealing himself altogether as he doesn’t turn up at all. Finely crafted and deeply felt, Table for Four is a rumination on the burden of secrets, of learning to let go and accepting the betrayals and losses in our lives.