Download or read book ISPSD 04 written by and published by . This book was released on 2004 with total page 514 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book ISPSD 91 written by and published by . This book was released on 1991 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book ISPSD 91 written by Muhammed Ayman Shibib and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1991 with total page 260 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book ISPSD 92 written by IEEE Electron Devices Society and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1992 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of the Tenth Symposium on Plasma Processing written by Electrochemical Society. Dielectric Science and Technology Division and published by The Electrochemical Society. This book was released on 1994 with total page 622 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Silicon on Insulator Technology and Devices X written by Electrochemical Society. Electronics Division and published by The Electrochemical Society. This book was released on 2001 with total page 482 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Future Energy Conferences and Symposia written by and published by . This book was released on 1991 with total page 578 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Wafer Bonding written by Marin Alexe and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 510 pages. Available in PDF, EPUB and Kindle. Book excerpt: The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Download or read book Silicon on Insulator Technology Materials to VLSI written by J.-P. Colinge and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 375 pages. Available in PDF, EPUB and Kindle. Book excerpt: Silicon-on-Insulator Technology: Materials to VLSI, Third Edition, retraces the evolution of SOI materials, devices and circuits over a period of roughly twenty years. Twenty years of progress, research and development during which SOI material fabrication techniques have been born and abandoned, devices have been invented and forgotten, but, most importantly, twenty years during which SOI Technology has little by little proven it could outperform bulk silicon in every possible way. The turn of the century turned out to be a milestone for the semiconductor industry, as high-quality SOI wafers suddenly became available in large quantities. From then on, it took only a few years to witness the use of SOI technology in a wealth of applications ranging from audio amplifiers and wristwatches to 64-bit microprocessors. This book presents a complete and state-of-the-art review of SOI materials, devices and circuits. SOI fabrication and characterization techniques, SOI CMOS processing, and the physics of the SOI MOSFET receive an in-depth analysis.
Download or read book System Integration written by Kurt Hoffmann and published by John Wiley & Sons. This book was released on 2006-02-08 with total page 510 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of large-scale integrated systems on a chip has had a dramatic effect on circuit design methodology. Recent years have seen an escalation of interest in systems level integration (system-on-a-chip) and the development of low power, high chip density circuits and systems. Kurt Hoffmann sets out to address a wide range of issues relating to the design and integration of integrated circuit components and provides readers with the methodology by which simple equations for the estimation of transistor geometries and circuit behaviour can be deduced. The broad coverage of this unique book ranges from field effect transistor design, MOS transistor modelling and the fundamentals of digital CMOS circuit design through to MOS memory architecture and design. Highlights the increasing requirement for information on system-on-a-chip design and integration. Combines coverage of semiconductor physics, digital VLSI design and analog integrated circuits in one volume for the first time. Written with the aim of bridging the gap between semiconductor device physics and practical circuit design. Introduces the basic behaviour of semiconductor components for ICs and covers the design of both digital and analog circuits in CMOS and BiCMOS technologies. Broad coverage will appeal to both students and practising engineers alike. Written by a respected expert in the field with a proven track record of publications in this field. Drawing upon considerable experience within both industry and academia, Hoffmann’s outstanding text, will prove an invaluable resource for designers, practising engineers in the semiconductor device field and electronics systems industry as well as Postgraduate students of microelectronics, electrical and computer engineering.
Download or read book Solid State Device Research 91 written by M. Ilegems and published by Elsevier Publishing Company. This book was released on 1991 with total page 750 pages. Available in PDF, EPUB and Kindle. Book excerpt: The ESSDERC conference constitutes the major European forum for discussing research and development work on semiconductor devices and technology. The 141 papers, including 17 invited papers, review subjects of recent interest or report on major coordinated research programs in Europe and Japan. The main focus of the contributions is on traditional silicon-based devices and technology, oriented towards integrated circuits. Papers are also included on micro- and optoelectronic devices based on 3-5 compound semiconductors, and the design and fabrication of semiconductor-based microsensors and microactuators. The volume will be an indispensable reference source to researchers from different but related areas, in promoting the exchange of experience and in emphasizing the unifying aspects of the wide interdisciplinary area of semiconductor science and technology.
Download or read book Proceedings of the International Symposium on Power Semiconductor Devices and ICs written by and published by . This book was released on 2004 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Science and Technology of Semiconductor On Insulator Structures and Devices Operating in a Harsh Environment written by Denis Flandre and published by Springer Science & Business Media. This book was released on 2005-02-15 with total page 364 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book collects the papers presented during NATO Advanced Research Workshop "Science and technology of Semiconductor on Insulator (SOI) structures and devices operating in a harsh environment" held in Kiev 26-30 April 2004. The volume contains both reviews from invited speakers and selected papers presenting major innovations in SOI materials and devices. Particular attention is paid to the reliability of SOI structures operated under harsh conditions. In the first part of the book dealing with SOI material technology, the evolution of SOI materials, achievements in the main standard technologies as Smart Cut, SIMOX, porous silicon as well as methods to create more exotic structures are described. The second part of the book covers the reliability aspect of SOI devices operating in a harsh environment: high and low temperatures, high voltages, with a focus on radiation effects and characterization of these devices. Third part of the book overviews novel devices and sensors opportunities for such conditions and the closes with papers discussing the perspectives of SOI scaling to nano devices.
Download or read book Proceedings of the Third International Symposium on Semiconductor Wafer Bonding written by C. E. Hunt and published by . This book was released on 1995 with total page 628 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Frontiers In Electronics Selected Papers From The Workshop On Frontiers In Electronics 2015 Wofe 15 written by Sorin Cristoloveanu and published by World Scientific. This book was released on 2017-01-13 with total page 174 pages. Available in PDF, EPUB and Kindle. Book excerpt: Rapid pace of electronic technology evolution and current economic climate compel a merger of such technical areas as low-power digital electronics, microwave power circuits, optoelectronics, etc., which collectively have become the foundation of today's electronic technology.This Workshop aims at encouraging active cross-fertilization of the different 'species' in this electronic planet. The WOFE2015 had gather experts from academia, industry, and government agencies to review the recent exciting breakthroughs and their underlying physical mechanisms.This Monographs includes ten invited articles; cover topics ranging from Ultra-thin silicon nanowire solar cells, to hydrogen generation under illumination of GaN-based structures and from ultrafast response of nanoscale device structures to Power device optimization.
Download or read book Science Abstracts written by and published by . This book was released on 1993 with total page 2332 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Technology CAD Systems written by Franz Fasching and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 313 pages. Available in PDF, EPUB and Kindle. Book excerpt: As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compete in today's business. The ability to tradeoff wafer starts in an advanced piloting facility for simulation analysis and optimization utilizing a "virtual fab" S/W tool set is a clear economical asset for any semiconductor development company. Consequently, development of more sophisticated, accurate, physics-based, and easy-to-use device and process modeling tools will receive continuing attention over the coming years. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. While some (noteably larger) companies have insisted on maintaining their own internal modeling tool development organization, others have elected to depend totally on the tools offered by the TCAD vendors and have consequently reduced their mod eling staffs to a bare minimal support function. Others are seeking to combine the best of their internally developed tool suite with "robust", "proven" tools provided by the vendors, hoping to achieve a certain synergy as well as savings through this approach. In the following sections we describe IBM's internally developed suite of TCAD modeling tools and show several applications of the use of these tools.
