Download or read book ISTFA 2012 written by ASM International and published by ASM International. This book was released on 2012 with total page 643 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book ISTFA 2017 Proceedings from the 43rd International Symposium for Testing and Failure Analysis written by ASM International and published by ASM International. This book was released on 2017-12-01 with total page 666 pages. Available in PDF, EPUB and Kindle. Book excerpt: The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
Download or read book Physical and Failure Analysis of Integrated Circuits IPFA 2012 19th IEEE International Symposium on the written by and published by . This book was released on 2012 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book ISTFA 2014 written by A. S. M. International and published by ASM International. This book was released on 2014-11-01 with total page 561 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Exploring the Many Facets of Failure Analysis.
Download or read book ISTFA 2019 Proceedings of the 45th International Symposium for Testing and Failure Analysis written by and published by ASM International. This book was released on 2019-12-01 with total page 540 pages. Available in PDF, EPUB and Kindle. Book excerpt: The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Download or read book Microelectronics Fialure Analysis Desk Reference Seventh Edition written by Tejinder Gandhi and published by ASM International. This book was released on 2019-11-01 with total page 750 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
Download or read book ISTFA 2018 Proceedings from the 44th International Symposium for Testing and Failure Analysis written by and published by ASM International. This book was released on 2018-12-01 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
Download or read book 3D Microelectronic Packaging written by Yan Li and published by Springer Nature. This book was released on 2020-11-23 with total page 629 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
Download or read book Springer Handbook of Semiconductor Devices written by Massimo Rudan and published by Springer Nature. This book was released on 2022-11-10 with total page 1680 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Springer Handbook comprehensively covers the topic of semiconductor devices, embracing all aspects from theoretical background to fabrication, modeling, and applications. Nearly 100 leading scientists from industry and academia were selected to write the handbook's chapters, which were conceived for professionals and practitioners, material scientists, physicists and electrical engineers working at universities, industrial R&D, and manufacturers. Starting from the description of the relevant technological aspects and fabrication steps, the handbook proceeds with a section fully devoted to the main conventional semiconductor devices like, e.g., bipolar transistors and MOS capacitors and transistors, used in the production of the standard integrated circuits, and the corresponding physical models. In the subsequent chapters, the scaling issues of the semiconductor-device technology are addressed, followed by the description of novel concept-based semiconductor devices. The last section illustrates the numerical simulation methods ranging from the fabrication processes to the device performances. Each chapter is self-contained, and refers to related topics treated in other chapters when necessary, so that the reader interested in a specific subject can easily identify a personal reading path through the vast contents of the handbook.
Download or read book Copper Zinc Tin Sulfide Based Thin Film Solar Cells written by Kentaro Ito and published by John Wiley & Sons. This book was released on 2015-02-23 with total page 449 pages. Available in PDF, EPUB and Kindle. Book excerpt: Beginning with an overview and historical background of Copper Zinc Tin Sulphide (CZTS) technology, subsequent chapters cover properties of CZTS thin films, different preparation methods of CZTS thin films, a comparative study of CZTS and CIGS solar cell, computational approach, and future applications of CZTS thin film solar modules to both ground-mount and rooftop installation. The semiconducting compound (CZTS) is made up earth-abundant, low-cost and non-toxic elements, which make it an ideal candidate to replace Cu(In,Ga)Se2 (CIGS) and CdTe solar cells which face material scarcity and toxicity issues. The device performance of CZTS-based thin film solar cells has been steadily improving over the past 20 years, and they have now reached near commercial efficiency levels (10%). These achievements prove that CZTS-based solar cells have the potential to be used for large-scale deployment of photovoltaics. With contributions from leading researchers from academia and industry, many of these authors have contributed to the improvement of its efficiency, and have rich experience in preparing a variety of semiconducting thin films for solar cells.
Download or read book FIB Nanostructures written by Zhiming M. Wang and published by Springer Science & Business Media. This book was released on 2014-01-04 with total page 536 pages. Available in PDF, EPUB and Kindle. Book excerpt: FIB Nanostructures reviews a range of methods, including milling, etching, deposition, and implantation, applied to manipulate structures at the nanoscale. Focused Ion Beam (FIB) is an important tool for manipulating the structure of materials at the nanoscale, and substantially extends the range of possible applications of nanofabrication. FIB techniques are widely used in the semiconductor industry and in materials research for deposition and ablation, including the fabrication of nanostructures such as nanowires, nanotubes, nanoneedles, graphene sheets, quantum dots, etc. The main objective of this book is to create a platform for knowledge sharing and dissemination of the latest advances in novel areas of FIB for nanostructures and related materials and devices, and to provide a comprehensive introduction to the field and directions for further research. Chapters written by leading scientists throughout the world create a fundamental bridge between focused ion beam and nanotechnology that is intended to stimulate readers' interest in developing new types of nanostructures for application to semiconductor technology. These applications are increasingly important for the future development of materials science, energy technology, and electronic devices. The book can be recommended for physics, electrical engineering, and materials science departments as a reference on materials science and device design.
Download or read book Conductive Atomic Force Microscopy written by Mario Lanza and published by John Wiley & Sons. This book was released on 2017-12-04 with total page 382 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first book to summarize the applications of CAFM as the most important method in the study of electronic properties of materials and devices at the nanoscale. To provide a global perspective, the chapters are written by leading researchers and application scientists from all over the world and cover novel strategies, configurations and setups where new information will be obtained with the help of CAFM. With its substantial content and logical structure, this is a valuable reference for researchers working with CAFM or planning to use it in their own fields of research.
Download or read book Hot Carrier Degradation in Semiconductor Devices written by Tibor Grasser and published by Springer. This book was released on 2014-10-29 with total page 518 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with a variety of tools to address the challenges posed by hot carrier degradation, one of today’s most complicated reliability issues in semiconductor devices. Coverage includes an explanation of carrier transport within devices and book-keeping of how they acquire energy (“become hot”), interaction of an ensemble of colder and hotter carriers with defect precursors, which eventually leads to the creation of a defect, and a description of how these defects interact with the device, degrading its performance.
Download or read book Fundamentals of Electromigration Aware Integrated Circuit Design written by Jens Lienig and published by Springer. This book was released on 2018-02-23 with total page 171 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.
Download or read book Proceedings of the International Conference on Business and Management Dynamics 2016 Sustainable economies in the information economy written by Joy E. Akahome and published by AOSIS. This book was released on 2016-12-31 with total page 115 pages. Available in PDF, EPUB and Kindle. Book excerpt: Cape Town, South Africa, 7 Sept. 2016 – 8 Sept. 2016. Theme: Sustainable economies in the information economy. Purpose: To share the quality academic papers presented at the International Conference on Business and Management Dynamics (ICBMD) held from 7 to 8 September 2016 at African Pride Crystal Hotel and Spa in Cape Town. As grey literature, the proceedings are the contributions made by researchers at the conference and are considered the written record of the work that was presented to fellow conference delegates. Methodology: The methodology used varies from researcher to researcher but are suitable for the studies conducted. Thus, on the one hand, studies that were subjective in nature used the interpretive paradigm, where the qualitative approach adopted made used of the interview method to collect data. On the other hand, studies that were objectively inclined adopted the positivist philosophy and used survey questionnaires to collect data. However, there were some academic papers which used mixed methodology because of the nature of the study. Whatever methodology used adhered to the ethos of the philosophies underpinning the methodology. Contribution made to scholarship: The articles come from individual researchers and each article in the proceedings is unique. Mostly, there is no general argument leading from one contribution to the next. However, it is interesting to note that in the area of economic performance it was evident that real exchange rate and net foreign direct investment contribute more towards innovations in economic growth. With regard to human capital development, papers presented evidence that there exists a definite need to explore the phenomenon of personal branding as limited scientific academic research has been done within the field of personal branding or on elements of the topic. Thus, the outcome argues that personal branding has an influence on leadership style which in turn impacts on organisational performance and related hygiene factors. Furthermore, it was demonstrated that current methods or strategies for enforcing institutionalisation of knowledge sharing within an organisation have not been successful, and, as such, new strategies are needed to reinforce efforts to nurture and invigorate the institutionalisation of knowledge sharing within an organisation. With regard to technology and big data impact on organisational performance, it was evident that system performance, memory consumption and CPU utilisation can be used as criteria to compare and evaluate big data technologies to improve organisational performance. Most of the articles’ contribution reemphasised technology education and training as a means of digitising business and improving effectiveness. Target audience: The target readership is academic researchers and business leaders who require access to the latest developments in the fields of economics, information management, business, education, development studies, social sciences and technology. It is also for policymakers and other stakeholders who need a better understanding of the impact of new developments on existing policies and regulations for their review or amendment.
Download or read book ISTFA 2011 written by and published by ASM International. This book was released on 2011 with total page 479 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Global Megaprojects written by Virginia A. Greiman and published by John Wiley & Sons. This book was released on 2023-01-03 with total page 564 pages. Available in PDF, EPUB and Kindle. Book excerpt: GLOBAL MEGAPROJECTS The definitive guide to international megaprojects from an undisputed authority in the field In Global Megaprojects: Lessons, Case Studies, and Expert Advice on International Megaproject Management, distinguished international megaproject researcher and consultant Virginia A. Greiman delivers a comprehensive and incisive discussion of a key topic in global infrastructure development: the international megaproject. In the book, readers will find indispensable guidance and insights from experienced megaproject experts, as well as over 20 case studies highlighting practical solutions to common and pressing issues faced by project stakeholders around the world. This book was written to demonstrate that megaprojects can and have accomplished major economic, social, and technical advancements thought impossible but achieved by successfully confronting the challenges of the time. This book offers solutions and prescriptions for megaproject participants to overcome the complex challenges presented by these projects. It incorporates the latest evidence-based theory and a wealth of practical experience and provides a truly international perspective, showcasing viewpoints from a diverse collection of regions, cultures, and industries. Global Megaprojects also presents: Thorough introductions to megaprojects and their lifecycles, including the megaproject ecosystem and the world’s emerging megaprojects In-depth examinations of megaproject finance and economics, including innovation and value-driven program management Extensive explorations of complex project leadership, including the characteristics of uncertainty, complex projects, and cross-cultural dynamics Comprehensive discussions of megaproject implementation management, including global delivery methodologies and strategic objective alignment Global Megaprojects: Lessons, Case Studies, and Expert Advice on International Megaproject Management will earn a place in the libraries of project managers, policymakers, academics, contractors, engineers, suppliers, investors, and sponsors of large international projects.
