Download or read book Cooling of Electronic Systems written by Sadik Kakaç and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 953 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.
Download or read book Encyclopedia Of Two phase Heat Transfer And Flow Iii Macro And Micro Flow Boiling And Numerical Modeling Fundamentals A 4 volume Set written by John R Thome and published by World Scientific. This book was released on 2018-03-13 with total page 1460 pages. Available in PDF, EPUB and Kindle. Book excerpt: Set III of this encyclopedia is a new addition to the previous Sets I and II. It contains 26 invited chapters from international specialists on the topics of numerical modeling of two-phase flows and evaporation, fundamentals of evaporation and condensation in microchannels and macrochannels, development and testing of micro two-phase cooling systems for electronics, and various special topics (surface wetting effects, microfin tubes, two-phase flow vibration across tube bundles). The chapters are written both by renowned university researchers and by well-known engineers from leading corporate research laboratories. Numerous 'must read' chapters cover the fundamentals of research and engineering practice on boiling, condensation and two-phase flows, two-phase heat transfer equipment, electronics cooling systems, case studies and so forth. Set III constitutes a 'must have' reference together with Sets I and II for thermal engineering researchers and practitioners.
Download or read book Advances in Heat Transfer written by and published by Academic Press. This book was released on 1995-05-25 with total page 347 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Heat Transfer is designed to fill the information gap between regularly scheduled journals and university level textbooks by providing in-depth review articles over a broader scope than is allowablein either journals or texts.
Download or read book Issues in Mechanical Engineering 2011 Edition written by and published by ScholarlyEditions. This book was released on 2012-01-09 with total page 3933 pages. Available in PDF, EPUB and Kindle. Book excerpt: Issues in Mechanical Engineering / 2011 Edition is a ScholarlyEditions™ eBook that delivers timely, authoritative, and comprehensive information about Mechanical Engineering. The editors have built Issues in Mechanical Engineering: 2011 Edition on the vast information databases of ScholarlyNews.™ You can expect the information about Mechanical Engineering in this eBook to be deeper than what you can access anywhere else, as well as consistently reliable, authoritative, informed, and relevant. The content of Issues in Mechanical Engineering: 2011 Edition has been produced by the world’s leading scientists, engineers, analysts, research institutions, and companies. All of the content is from peer-reviewed sources, and all of it is written, assembled, and edited by the editors at ScholarlyEditions™ and available exclusively from us. You now have a source you can cite with authority, confidence, and credibility. More information is available at http://www.ScholarlyEditions.com/.
Download or read book Transport Phenomena In Thermal Control written by Guang-Jyh Hwang and published by CRC Press. This book was released on 1989-08-01 with total page 822 pages. Available in PDF, EPUB and Kindle. Book excerpt: A collection of research papers into transport phenomena in thermal control, closely related to several important aspects of cooling technology. Articles provide overviews of current advances and details of individual technologies including electronic and turbine cooling and Marangoni convection.
Download or read book Advances in Heat Transfer written by Ephraim M. Sparrow and published by Academic Press. This book was released on 2018-11-07 with total page 396 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Heat Transfer, Volume 50, provides in-depth review articles from a broader scope than in traditional journals or texts, with this comprehensive release covering chapters on Heat Transfer in Rotating Channels, Advances in Liquid Metal Science and Technology in Chip Cooling and Thermal Management, Heat Transfer in Rotating Cooling Channel, Anomalous Heat Transfer: Examples, Fundamentals, and Fractional Calculus Models, and much more. - Fills the information gap between regularly scheduled journals and university-level textbooks by providing in-depth review articles over a broader scope than in traditional journals or texts - Essential reading for all mechanical, chemical and industrial engineers working in the field of heat transfer, or in graduate schools or industry
Download or read book Heat Transfer Enhancement And Energy Conservation written by Songshjiu Deng and published by CRC Press. This book was released on 2024-11-01 with total page 1055 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heat transfer is close connected to the better utilization of thermal energy. This book provides an international perspective on the status of heat transfer enhancement and energy conservation research, development, and applications. It contains scientific papers from countries and areas including Bahrain, Canada, China, France, the Federal Republic of Germany, Hong Kong, Italy, India, Japan, New Zealand, Poland, the United Kingdom, the United States of America, and Yugoslavia. It is a valuable reference for anyone interested in heat transfer enhancement and energy conservation.
Download or read book Journal of Heat Transfer written by and published by . This book was released on 2001 with total page 402 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Heat Transfer and Fluid Flow in Minichannels and Microchannels written by Satish Kandlikar and published by Elsevier. This book was released on 2006 with total page 492 pages. Available in PDF, EPUB and Kindle. Book excerpt: &Quot;This book explores flow through passages with hydraulic diameters from about 1 [mu]m to 3 mm, covering the range of minichannels and microchannels. Design equations along with solved examples and practice problems are also included to serve the needs of practicing engineers and students in a graduate course."--BOOK JACKET.
Download or read book ITherm 2002 written by Cristina H. Amon and published by . This book was released on 2002 with total page 1148 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book The proceedings of the 16th Annual Conference of China Electrotechnical Society written by Qingxin Yang and published by Springer Nature. This book was released on 2022-04-17 with total page 1465 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gathers outstanding papers presented at the 16th Annual Conference of China Electrotechnical Society, organized by China Electrotechnical Society (CES), held in Beijing, China, from September 24 to 26, 2021. It covers topics such as electrical technology, power systems, electromagnetic emission technology, and electrical equipment. It introduces the innovative solutions that combine ideas from multiple disciplines. The book is very much helpful and useful for the researchers, engineers, practitioners, research students, and interested readers.
Download or read book Emerging Trends in Mechanical and Industrial Engineering written by Xianguo Li and published by Springer Nature. This book was released on 2023-01-01 with total page 1062 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book presents the select proceedings of the International Conference on Emerging Trends in Mechanical and Industrial Engineering (ICETMIE 2022). It covers the latest trends in the area of mechanical engineering. The broad topics covered in the book are engineering design, industrial and production engineering, Industry 4.0, energy and process engineering, mechatronics, control and robotics, material science, and automotive engineering. The book is useful for students, researchers, and professionals working in the various areas of mechanical engineering.
Download or read book Encyclopedia Of Thermal Packaging Set 1 Thermal Packaging Techniques A 6 volume Set written by and published by World Scientific. This book was released on 2012-09-25 with total page 1582 pages. Available in PDF, EPUB and Kindle. Book excerpt: remove This Encyclopedia comes in 3 sets. To check out Set 2 and Set 3, please visit Set 2: Thermal Packaging Tools and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 1: Thermal Packaging TechniquesThe first set of the Encyclopedia, Thermal Packaging Techniques, focuses on the technology “building blocks” used to assemble a complete thermal management system and provide detailed descriptions of the underlying phenomena, modeling equations, and correlations, as well as guidance for achieving the optimal designs of individual “building blocks” and their insertion in the overall thermal solution. Specific volumes deal with microchannel coolers, cold plates, immersion cooling modules, thermoelectric microcoolers, and cooling devices for solid state lighting systems, as well as techniques and procedures for the experimental characterization of thermal management components. These “building blocks” are the essential elements in the creation of a complete, cost-effective thermal management system.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.
Download or read book Fluid Mechanics and Fluid Power Contemporary Research written by Arun K. Saha and published by Springer. This book was released on 2016-09-20 with total page 1638 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume comprises the proceedings of the 42nd National and 5th International Conference on Fluid Mechanics and Fluid Power held at IIT Kanpur in December, 2014.The conference proceedings encapsulate the best deliberations held during the conference. The diversity of participation in the conference, from academia, industry and research laboratories reflects in the articles appearing in the volume. This contributed volume has articles from authors who have participated in the conference on thematic areas such as Fundamental Issues and Perspectives in Fluid Mechanics; Measurement Techniques and Instrumentation; Computational Fluid Dynamics; Instability, Transition and Turbulence; Turbomachinery; Multiphase Flows; Fluid‐Structure Interaction and Flow‐Induced Noise; Microfluidics; Bio‐inspired Fluid Mechanics; Internal Combustion Engines and Gas Turbines; and Specialized Topics. The contents of this volume will prove useful to researchers from industry and academia alike.
Download or read book Mechanical Engineers Handbook Volume 4 written by Myer Kutz and published by John Wiley & Sons. This book was released on 2015-02-06 with total page 1198 pages. Available in PDF, EPUB and Kindle. Book excerpt: The engineer's ready reference for mechanical power and heat Mechanical Engineer's Handbook provides the most comprehensive coverage of the entire discipline, with a focus on explanation and analysis. Packaged as a modular approach, these books are designed to be used either individually or as a set, providing engineers with a thorough, detailed, ready reference on topics that may fall outside their scope of expertise. Each book provides discussion and examples as opposed to straight data and calculations, giving readers the immediate background they need while pointing them toward more in-depth information as necessary. Volume 4: Energy and Power covers the essentials of fluids, thermodynamics, entropy, and heat, with chapters dedicated to individual applications such as air heating, cryogenic engineering, indoor environmental control, and more. Readers will find detailed guidance toward fuel sources and their technologies, as well as a general overview of the mechanics of combustion. No single engineer can be a specialist in all areas that they are called on to work in the diverse industries and job functions they occupy. This book gives them a resource for finding the information they need, with a focus on topics related to the productions, transmission, and use of mechanical power and heat. Understand the nature of energy and its proper measurement and analysis Learn how the mechanics of energy apply to furnaces, refrigeration, thermal systems, and more Examine the and pros and cons of petroleum, coal, biofuel, solar, wind, and geothermal power Review the mechanical parts that generate, transmit, and store different types of power, and the applicable guidelines Engineers must frequently refer to data tables, standards, and other list-type references, but this book is different; instead of just providing the answer, it explains why the answer is what it is. Engineers will appreciate this approach, and come to find Volume 4: Energy and Power an invaluable reference.
Download or read book Microscale Heat Transfer Fundamentals and Applications written by S. Kakaç and published by Springer Science & Business Media. This book was released on 2006-05-20 with total page 517 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume contains an archival record of the NATO Advanced Institute on Microscale Heat Transfer – Fundamental and Applications in Biological and Microelectromechanical Systems held in Çesme – Izmir, Turkey, July 18–30, 2004. The ASIs are intended to be high-level teaching activity in scientific and technical areas of current concern. In this volume, the reader may find interesting chapters and various Microscale Heat Transfer Fundamental and Applications. The growing use of electronics, in both military and civilian applications has led to the widespread recognition for need of thermal packaging and management. The use of higher densities and frequencies in microelectronic circuits for computers are increasing day by day. They require effective cooling due to heat generated that is to be dissipated from a relatively low surface area. Hence, the development of efficient cooling techniques for integrated circuit chips is one of the important contemporary applications of Microscale Heat Transfer which has received much attention for cooling of high power electronics and applications in biomechanical and aerospace industries. Microelectromechanical systems are subject of increasing active research in a widening field of discipline. These topics and others are the main themeof this Institute.
Download or read book Encyclopedia of Thermal Packaging Set 1 Thermal Packaging Techniques a 6 Volume Set written by Avram Bar-Cohen and published by World Scientific. This book was released on 2012-02-01 with total page 1582 pages. Available in PDF, EPUB and Kindle. Book excerpt: Packaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and functional density achieved by the full range of electronic, microelectronic and nanoelectronic products during the past several decades. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal management on the critical path of nearly every organization dealing with traditional electronic product development, as well as emerging, product categories. Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of critical importance in the refinement of traditional products and in the development of products for new applications.The Encyclopedia of Thermal Packaging, compiled into four 5-volume sets (Thermal Packaging Techniques, Thermal Packaging Configurations, Thermal Packaging Tools and Thermal Packaging Applications), will provide comprehensive, one-stop treatment of the techniques, configurations, tools and applications of electronic thermal packaging. Each volume in a set comprises 250–350 pages and is written by world experts in thermal management of electronics.
